Gas supply device by gasifying burnable liquid
    41.
    发明申请
    Gas supply device by gasifying burnable liquid 审中-公开
    通过气化可燃液体供气装置

    公开(公告)号:US20060006556A1

    公开(公告)日:2006-01-12

    申请号:US11168080

    申请日:2005-06-27

    申请人: Hung Chen

    发明人: Hung Chen

    IPC分类号: B01D47/06

    CPC分类号: F02M31/18 Y02T10/126

    摘要: A gas supply device by gasifying burnable liquid comprises a container having a space for filling burnable gas; at least one layer of flow guide plate being arranged in the space; each flow guide plate being arranged with a filter element; a gas generating unit arranged on a container for generating gas and then inputting the container; an input unit arranged on the container for inputting gas from the gas generating unit to the container; a gas divider connected to a tube of the input unit; the gas divider having output holes for generating bubbles; at least one output unit arranged on the container for outputting gas in the container; a pressure sensing unit arranged on the container for sensing pressure within the container; and a constant temperature control unit arranged on the container for sensing temperature within the container for heating at a predetermined timing.

    摘要翻译: 通过气化可燃液体的气体供给装置包括具有用于填充可燃气体的空间的容器; 至少一层导流板布置在该空间中; 每个流动引导板布置有过滤元件; 气体发生单元,布置在用于产生气体的容器上,然后输入容器; 输入单元,布置在容器上,用于将气体从气体发生单元输入到容器; 连接到输入单元的管的气体分配器; 所述气体分配器具有用于产生气泡的输出孔; 至少一个输出单元,布置在容器上用于在容器中输出气体; 压力检测单元,布置在容器上用于感测容器内的压力; 以及设置在容器上的恒温控制单元,用于感测容器内的温度,以便在预定的时间加热。

    Profile control platen
    42.
    发明申请
    Profile control platen 有权
    型材控制台板

    公开(公告)号:US20050186892A1

    公开(公告)日:2005-08-25

    申请号:US11029287

    申请日:2005-01-05

    IPC分类号: B24B37/16 B24B41/047 B24B1/00

    CPC分类号: B24B37/16

    摘要: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.

    摘要翻译: 用于基板的化学机械抛光的压板包括可以放置抛光垫的表面,支撑结构和控制器。 表面具有第一区域和第二区域,并且可操作以在抛光期间对抛光垫施加力。 支撑结构位于第二区域下方并且可操作以使第二区域施加比第一区域更多的力。 控制器可操作以调节由第二区域施加的力的量。

    Retaining ring with slurry transport grooves
    44.
    发明申请
    Retaining ring with slurry transport grooves 审中-公开
    带浆料输送槽的保持环

    公开(公告)号:US20050126708A1

    公开(公告)日:2005-06-16

    申请号:US10732966

    申请日:2003-12-10

    CPC分类号: B24B37/32

    摘要: A retaining ring for chemical mechanical polishing has a generally annular body with a top surface, a bottom surface, an inner diameter surface, and an outer diameter surface. The bottom surface includes a plurality of channels, each channel extending from the inner diameter surface to the outer diameter surface and having a rounded ceiling.

    摘要翻译: 用于化学机械抛光的保持环具有大致环形体,其具有顶表面,底表面,内径表面和外径表面。 底表面包括多个通道,每个通道从内径表面延伸到外径表面并且具有圆形天花板。

    Carrier head with a flexible membrane for a chemical mechanical polishing system
    46.
    发明授权
    Carrier head with a flexible membrane for a chemical mechanical polishing system 有权
    带有柔性膜的载体头,用于化学机械抛光系统

    公开(公告)号:US06386955B2

    公开(公告)日:2002-05-14

    申请号:US09730944

    申请日:2000-12-05

    IPC分类号: B24B100

    CPC分类号: B24B37/30 B24B37/32

    摘要: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

    摘要翻译: 用于化学机械抛光装置的载体头。 承载头包括壳体,基座,装载机构,万向节机构和基底背衬组件。 衬底背衬组件包括位于底座下方的支撑结构,将支撑结构连接到基座的基本水平的环形弯曲部,以及连接到支撑结构的柔性膜。 柔性膜具有用于基底的安装表面,并且在基底之下延伸以限定腔室。

    High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods
    49.
    发明授权
    High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods 有权
    高刚度,防滑洗刷器刷组件,高刚度心轴,子组件和装配方法

    公开(公告)号:US09119461B2

    公开(公告)日:2015-09-01

    申请号:US13456796

    申请日:2012-04-26

    摘要: In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush having a body of open-cell foam including an interior surface, a sleeve received in contact with the scrubber brush, the sleeve including peripherally-spaced, longitudinal walls and reinforcing segments interconnecting adjacent ones of the longitudinal walls and forming elongated pockets along the length, the sleeve having raised ribs extending along the length, and a mandrel having recesses formed on an outer surface, the mandrel being coupled to the sleeve by receiving the raised ribs within the recesses. Scrubber brush subassemblies, high stiffness mandrels, and methods of assembly are provided, as are numerous other aspects.

    摘要翻译: 在一个方面,提供了洗涤器刷组件。 洗涤器刷组件包括洗涤器刷,其具有包括内表面的开孔泡沫体,与洗涤器刷接触的套筒,套筒包括周向间隔开的纵向壁和将邻近的纵向壁相互连接的加强段 以及沿所述长度形成细长的袋,所述套筒具有沿所述长度延伸的凸肋,以及具有形成在外表面上的凹部的心轴,所述心轴通过容纳所述凹部内的所述凸肋而联接到所述套筒。 提供了洗涤刷组件,高刚度心轴和组装方法,以及许多其它方面。

    Methods and apparatus for pre-chemical mechanical planarization buffing module
    50.
    发明授权
    Methods and apparatus for pre-chemical mechanical planarization buffing module 有权
    预化学机械平面抛光模块的方法和装置

    公开(公告)号:US08968055B2

    公开(公告)日:2015-03-03

    申请号:US13459177

    申请日:2012-04-28

    IPC分类号: B24B1/00

    CPC分类号: B24B37/107 B24B41/068

    摘要: The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.

    摘要翻译: 本发明提供了用于CMP前半导体衬底抛光模块的方法和装置。 本发明包括适于相对于基底的主表面旋转的抛光垫组件; 当所述抛光垫组件旋转时,卡盘适于保持所述基底并且将所述基底旋转抵靠所述抛光垫组件; 以及横向运动电动机,其适于在抛光垫组件相对于旋转衬底旋转的同时横向穿过衬底的主表面振荡抛光垫组件。 公开了许多附加特征。