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    METHODS AND APPARATUS FOR ACTIVE SUBSTRATE PRECESSION DURING CHEMICAL MECHANICAL POLISHING
    2.
    发明申请
    METHODS AND APPARATUS FOR ACTIVE SUBSTRATE PRECESSION DURING CHEMICAL MECHANICAL POLISHING 审中-公开
    化学机械抛光期间主动基板预处理的方法与装置

    公开(公告)号：US20130288577A1

    公开(公告)日：2013-10-31

    申请号：US13459075

    申请日：2012-04-27

    申请人： Hung Chen ,  Lakshmanan Karuppiah

    发明人： Hung Chen ,  Lakshmanan Karuppiah

    IPC分类号： B24B47/10 ,  B24B1/00 ,  B24B37/32

    CPC分类号： B24B37/32 ,  B24B47/10

    摘要： In some aspects, a chemical mechanical polishing (CMP) apparatus is provided that includes a polishing head having (a) a rotatable spindle; (b) a membrane coupled to the rotatable spindle and adapted to press a substrate against a polishing pad during polishing of the substrate; and (c) a retaining ring rotatable coupled to the spindle and adapted to surround a substrate being pressed against a polishing pad during polishing and to limit lateral movement of the substrate relative to the polishing head. The CMP apparatus also includes a drive mechanism coupled to the retaining ring and adapted to drive the retaining ring at a different rate of rotation than the spindle during polishing. Numerous other aspects are provided.

    摘要翻译： 在一些方面，提供了一种化学机械抛光（CMP）装置，其包括具有（a）可旋转主轴的抛光头; （b）膜，其耦合到所述可旋转心轴并适于在衬底的抛光期间将衬底压靠在抛光垫上; 和（c）保持环，其可旋转地联接到所述心轴并且适于围绕在抛光期间被压靠在抛光垫上的衬底并且限制所述衬底相对于所述抛光头的横向运动。 CMP设备还包括联接到保持环的驱动机构，并且适于在抛光期间以与主轴不同的旋转速度驱动保持环。 提供了许多其他方面。

    Paired pivot arm
    3.
    发明申请
    Paired pivot arm 有权
    配对枢轴臂

    公开(公告)号：US20070141954A1

    公开(公告)日：2007-06-21

    申请号：US11438497

    申请日：2006-05-22

    申请人： Hung Chen ,  Steven Zuniga

    发明人： Hung Chen ,  Steven Zuniga

    IPC分类号： B24B51/00 ,  B24B7/30 ,  B24B29/00

    CPC分类号： B24B37/345 ,  B24B41/005

    摘要： The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polishing head direct access to two polishing stations. The polishing system of the present invention provides flexibility and improves throughput.

    摘要翻译： 本发明涉及一种用于抛光半导体衬底的设备和方法。 在一个实施例中，两个抛光头安装在共享一个枢转点的两个独立的旋转臂上。 每个枢转臂使相应的抛光头可直接进入两个抛光台。 本发明的抛光系统提供灵活性并提高生产量。

    Liquid crystal display with curving data lines
    4.
    发明申请
    Liquid crystal display with curving data lines 审中-公开
    带弯曲数据线的液晶显示器

    公开(公告)号：US20060209243A1

    公开(公告)日：2006-09-21

    申请号：US11384569

    申请日：2006-03-20

    申请人： Hung Chen ,  Chao Hung

    发明人： Hung Chen ,  Chao Hung

    IPC分类号： G02F1/1343

    CPC分类号： G02F1/134309 ,  G02F2201/52 ,  G09G3/3614

    摘要： A liquid crystal display includes a liquid crystal panel having a plurality of gate lines that are parallel to each other and that each extend along a first direction, and a plurality of data lines that are parallel to each other and that each extend along a second direction substantially orthogonal to the first direction, a plurality of pixel regions defined by points of intersection of the gate lines and the data lines, and a gate driver for driving the gate lines, and a data driver for driving the data lines. Each of the data lines includes curving portions, whereby pixel regions defined by two corresponding data lines each have two curving side boundaries.

    摘要翻译： 液晶显示器包括具有彼此平行并且各自沿着第一方向延伸的多条栅极线的液晶面板和彼此平行并分别沿着第二方向延伸的多条数据线 基本上与第一方向正交的多个像素区域，由栅极线和数据线的相交点限定的多个像素区域以及用于驱动栅极线的栅极驱动器和用于驱动数据线的数据驱动器。 每个数据线包括弯曲部分，由两个对应的数据线限定的像素区域各自具有两个弯曲边界。

    Vibration damping in chemical mechanical polishing system
    5.
    发明申请
    Vibration damping in chemical mechanical polishing system 失效
    化学机械抛光系统中的振动阻尼

    公开(公告)号：US20060148387A1

    公开(公告)日：2006-07-06

    申请号：US11333992

    申请日：2006-01-17

    申请人： Hung Chen ,  John White ,  Shijian Li ,  Fred Redeker ,  Ramin Emami

    发明人： Hung Chen ,  John White ,  Shijian Li ,  Fred Redeker ,  Ramin Emami

    IPC分类号： B24B29/00

    CPC分类号： B24B37/30 ,  B24B37/12 ,  B24B37/32 ,  B24B41/007

    摘要： A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.

    摘要翻译： 用于化学机械抛光的载体头包括基底，附着到具有用于接触基底的表面的基部的支撑结构以及附接到基部的保持结构，以防止基底沿着表面移动。 保持结构和表面限定用于接收基底的空腔。 保持结构包括与基座接触的上部，下部和分隔上部和下部的振动阻尼器。 振动阻尼器，减震器包括当经受变形时不能反弹到其原始形状的材料。

    CMP polishing pad
    8.
    发明授权
    CMP polishing pad 有权
    CMP抛光垫

    公开(公告)号：US06575825B2

    公开(公告)日：2003-06-10

    申请号：US09759858

    申请日：2001-01-12

    申请人： Robert D. Tolles ,  Steven T. Mear ,  Gopalakrishna B. Prabhu ,  Steven Zuniga ,  Hung Chen

    发明人： Robert D. Tolles ,  Steven T. Mear ,  Gopalakrishna B. Prabhu ,  Steven Zuniga ,  Hung Chen

    IPC分类号： B24D1102

    CPC分类号： B24B37/26 ,  B24B37/16 ,  Y10S451/921

    摘要： A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.

    摘要翻译： 提供了一种用于化学机械抛光系统的抛光垫。 衬垫安装到可旋转的压板上并且包括抛光表面和偏转表面，当与衬底接触时，该抛光表面和偏转表面提供期望的刚度和顺应性。 偏转表面可以包括延伸穿过垫的一个或多个通道，其通向大气。 在一个实施例中，偏转区域限定凸起区域和凹陷区域。 凸起区域为压板提供安装表面，而凹陷区域允许焊盘的顺应性。 在另一个实施例中，偏转区域包括限定多个倾斜突起的多个通道。 通道可以不相交，使得倾斜突起是设置在垫上的细长部分。 或者，通道可以相交，使得倾斜的突起彼此隔离并且以间隔的关系设置在垫上。

    Bottle Cap and Method of Use With a Liquid Dispensing Apparatus and System
    10.
    发明申请
    Bottle Cap and Method of Use With a Liquid Dispensing Apparatus and System 审中-公开
    瓶盖和使用液体分配装置和系统的方法

    公开(公告)号：US20070267100A1

    公开(公告)日：2007-11-22

    申请号：US11382114

    申请日：2006-05-08

    申请人： Gregory Spear ,  Chun-Yen Wang ,  Hung Chen

    发明人： Gregory Spear ,  Chun-Yen Wang ,  Hung Chen

    IPC分类号： B65B1/04

    CPC分类号： B65D47/141 ,  B65D2231/022 ,  B67D3/0032

    摘要： A cap is provided for sealing a liquid container such as a water bottle. The cap may include a cap body with an outer annular wall engaging the bottle neck, and an inner annular wall with a plug gripping formation engaging a cap gripping formation on a cap plug. The cap body and the cap plug may be attached by a tether to ensure that the cap plug does not completely disassociate from the cap during liquid container removal and replacement. A method for using such a cap, including various embodiments of the cap body and cap plug, is also disclosed and claimed.

    摘要翻译： 提供用于密封诸如水瓶的液体容器的盖。 盖可以包括具有与瓶颈接合的外环形壁的帽体，以及具有塞帽夹持构件的内环形壁，其接合帽塞上的帽夹持结构。 帽体和帽塞可以通过绳索附接，以确保在液体容器移除和更换期间盖帽不能完全脱离盖。 还公开并要求保护包括帽体和帽塞的各种实施例的这种帽的方法。