公开(公告)号：US08936970B2

公开(公告)日：2015-01-20

申请号：US13227841

申请日：2011-09-08

申请人： Chia-Liang Hsu

发明人： Chia-Liang Hsu

IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L33/62 ,  H01L33/60 ,  H01L33/00 ,  H01L33/48 ,  H01L33/54

CPC分类号： H01L33/60 ,  H01L33/0079 ,  H01L33/38 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0033 ,  H01L2933/0066

摘要： A light-emitting structure comprises a semiconductor light-emitting element which includes a first connection point and a second connection point. The light-emitting structure further includes a first electrode electrically connected to the first connection point, and a second electrode electrically connected the second connection point. The first electrode and the second electrode can form a concave on which the semiconductor light-emitting element is located.

摘要翻译： 发光结构包括包括第一连接点和第二连接点的半导体发光元件。 发光结构还包括电连接到第一连接点的第一电极和与第二连接点电连接的第二电极。 第一电极和第二电极可以形成半导体发光元件所在的凹部。

公开(公告)号：US08618572B2

公开(公告)日：2013-12-31

申请号：US13403334

申请日：2012-02-23

申请人： Chia-Liang Hsu

发明人： Chia-Liang Hsu

IPC分类号： H01L33/00

CPC分类号： H01L33/0079 ,  H01L33/025

摘要： A light-emitting device is disclosed. The light-emitting device comprises a substrate, an ion implanted layer on the substrate, a light-emitting stack layer disposed on the ion implanted layer, and an adhesive layer connecting the substrate with the light-emitting stack layer, wherein the adhesive layer comprises a thin silicon film disposed between the ion implanted layer and the light-emitting layer. This invention also discloses a method of manufacturing a light-emitting device comprising the steps of forming a light-emitting stack layer, forming a thin silicon film on the light-emitting stack layer, providing a substrate, forming an ion implanted layer on the substrate, and providing an electrode potential difference to form an oxide layer between the thin silicon film and the ion implanted layer.

摘要翻译： 公开了一种发光器件。 发光装置包括衬底，衬底上的离子注入层，设置在离子注入层上的发光层，以及将衬底与发光层叠层连接的粘合剂层，其中粘合层包括 设置在离子注入层和发光层之间的薄硅膜。 本发明还公开了一种制造发光器件的方法，包括以下步骤：形成发光叠层，在发光叠层上形成薄硅膜，提供衬底，在衬底上形成离子注入层 并且提供电极电位差以在薄硅膜和离子注入层之间形成氧化物层。

公开(公告)号：US08242526B2

公开(公告)日：2012-08-14

申请号：US12550089

申请日：2009-08-28

申请人： Chia-Liang Hsu

发明人： Chia-Liang Hsu

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/44 ,  H01L33/46 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： The present application discloses a light-emitting semiconductor device including a semiconductor light-emitting element, a transparent paste layer and a wavelength conversion structure. A first light emitted from the semiconductor light-emitting element enters the wavelength conversion structure to generate a second light which has a wavelength different from that of the first light. In addition, the present application also provides a light-emitting semiconductor device package.

摘要翻译： 本申请公开了一种包括半导体发光元件，透明浆料层和波长转换结构的发光半导体器件。 从半导体发光元件发射的第一光进入波长转换结构以产生具有与第一光不同的波长的第二光。 此外，本申请还提供了一种发光半导体器件封装。

公开(公告)号：US08240881B2

公开(公告)日：2012-08-14

申请号：US12292161

申请日：2008-11-13

申请人： Chia-Liang Hsu

发明人： Chia-Liang Hsu

IPC分类号： F21V7/04 ,  H01J1/62

CPC分类号： G02B6/0073 ,  G02B6/0025 ,  G02B6/0031 ,  G02F1/1336 ,  H01L33/48 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A light-emitting device package is disclosed and comprises at least one light-emitting device and a carrier. The light-emitting device includes a light-emitting diode chip attached to a first surface of a transparent substrate, wherein the chip comprises a first type conductivity semiconductor layer, an active layer and a second type conductivity semiconductor layer. The carrier comprises a p electrode, an n electrode, a platform and a reflective inside wall. The transparent substrate of the light-emitting device is attached to the platform by an adhering layer. In addition, an angle between the first surface of the transparent substrate and the platform is not equal to zero degree, and the better is about 90 degree.

摘要翻译： 公开了一种发光器件封装，并且包括至少一个发光器件和载体。 发光装置包括安装在透明基板的第一表面上的发光二极管芯片，其中芯片包括第一类型的导电半导体层，有源层和第二类型的导电半导体层。 载体包括p电极，n电极，平台和反射内壁。 发光装置的透明基板通过粘附层附着在平台上。 此外，透明基板的第一表面与平台之间的角度不等于零度，并且更好地为大约90度。

公开(公告)号：USD660258S1

公开(公告)日：2012-05-22

申请号：US29391152

申请日：2011-05-04

申请人： Chia-Liang Hsu ,  Pang-Yen Liu

设计人： Chia-Liang Hsu ,  Pang-Yen Liu

公开(公告)号：USD646234S1

公开(公告)日：2011-10-04

申请号：US29380704

申请日：2010-12-09

申请人： Chiu-Lin Yao ,  Chia-Liang Hsu ,  Ching-Bei Lin ,  Sheng-Fang Hung

设计人： Chiu-Lin Yao ,  Chia-Liang Hsu ,  Ching-Bei Lin ,  Sheng-Fang Hung

公开(公告)号：US07837374B2

公开(公告)日：2010-11-23

申请号：US12003880

申请日：2008-01-03

申请人： Chia-Liang Hsu ,  Shu-Ting Hsu

发明人： Chia-Liang Hsu ,  Shu-Ting Hsu

IPC分类号： F21V33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/54 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： This application relates to a light-emitting device comprising a light channel having an upper surface, a lower surface opposite to the upper surface, an inner surface intersecting with each of the upper and lower surface by different angles, and an escape surface; and a light-emitting element having a bottom surface substantially parallel to the inner surface and emitting light traveling inside the light channel toward the escape surface. In an embodiment, the escape surface of the light-emitting device is an inclined plane with lens array thereon.

摘要翻译： 本申请涉及一种发光装置，包括具有上表面，与上表面相对的下表面的光通道，与上表面和下表面中的每一个以不同角度相交的内表面和逃逸表面; 以及发光元件，其具有基本上平行于内表面的底表面，并且发射在光通道内朝向逸出表面行进的光。 在一个实施例中，发光装置的逸出表面是其上具有透镜阵列的倾斜平面。

公开(公告)号：US07745832B2

公开(公告)日：2010-06-29

申请号：US11222803

申请日：2005-09-12

申请人： Min-Hsun Hsieh ,  Chou-Chih Yin ,  Chien-Yuan Wang ,  Jen-Shui Wang ,  Chia-Fen Tsai ,  Chia-Liang Hsu

发明人： Min-Hsun Hsieh ,  Chou-Chih Yin ,  Chien-Yuan Wang ,  Jen-Shui Wang ,  Chia-Fen Tsai ,  Chia-Liang Hsu

IPC分类号： H01L33/00 ,  H01L23/34

CPC分类号： H01L33/641 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor light-emitting element assembly, comprising a composite substrate, a circuit layout carrier, a connecting structure, a recess, and a semiconductor light-emitting element, is disclosed. The connecting structure is used for bonding the composite substrate with the circuit layout carrier. The recess is formed by the circuit layout carrier and extends toward the composite substrate. The semiconductor light-emitting element is deposited in the recess and electrically connected to the circuit layout carrier.

摘要翻译： 公开了一种半导体发光元件组件，包括复合衬底，电路布局载体，连接结构，凹部和半导体发光元件。 连接结构用于将复合基板与电路布线载体接合。 凹部由电路布局载体形成并朝向复合基板延伸。 半导体发光元件沉积在凹槽中并电连接到电路布局载体。

公开(公告)号：US07246931B2

公开(公告)日：2007-07-24

申请号：US11302732

申请日：2005-12-13

申请人： Min-Hsun Hsieh ,  Chou-Chih Yin ,  Chia-Liang Hsu ,  Jen-Shui Wang ,  Chia-Fen Tsai ,  Chien-Yuan Wang

发明人： Min-Hsun Hsieh ,  Chou-Chih Yin ,  Chia-Liang Hsu ,  Jen-Shui Wang ,  Chia-Fen Tsai ,  Chien-Yuan Wang

IPC分类号： F21V7/04

CPC分类号： F21K9/61 ,  F21K9/00 ,  F21Y2115/10

摘要： A tube type light emitting diode light source including a light source generator, a light guide and a diffuser is provided. The light source generator includes LEDs arranging in a line. The light guide has a grooved light incident surface and a grooved light-guiding surface. The grooved light incident surface encompasses the LEDs, and the grooved light-guiding surface is adapted for changing the propagating direction of an incident light. The diffuser covers the light guide.

摘要翻译： 提供了包括光源发生器，光导和扩散器的管式发光二极管光源。 光源发生器包括排列成一行的LED。 光导具有凹槽的光入射表面和带槽的光导表面。 带槽的光入射表面包围LED，并且带槽的光导表面适于改变入射光的传播方向。 扩散器覆盖光导。

公开(公告)号：US20130240924A1

公开(公告)日：2013-09-19

申请号：US13421898

申请日：2012-03-16

申请人： Ching-Huai Ni ,  Chia-Liang Hsu ,  Yi-Ming Chen

发明人： Ching-Huai Ni ,  Chia-Liang Hsu ,  Yi-Ming Chen

IPC分类号： H01L33/22

CPC分类号： H01L33/382 ,  H01L33/22 ,  H01L33/24 ,  H01L33/30 ,  H01L33/32 ,  H01L2933/0016

摘要： A light-emitting device comprises a substrate; a semiconductor stack comprising a first type semiconductor layer, a second type semiconductor layer and an active layer formed between the first type semiconductor layer and the second type semiconductor layer; a bonding layer formed between the substrate and the semiconductor stack; and a plurality of buried electrodes physically buried in the first type semiconductor layer.

摘要翻译： 发光装置包括基板; 包括第一类型半导体层，第二类型半导体层和形成在第一类型半导体层和第二类型半导体层之间的有源层的半导体堆叠; 形成在所述基板和所述半导体叠层之间的接合层; 以及物理地埋在第一类型半导体层中的多个埋置电极。