Abstract:
A memory device, array and method of arranging where the memory device includes a memory cell region including a plurality of memory cells. Each memory cell includes a source, a drain and a channel between the source and the drain, a channel dielectric, a charge storage region and an electrically alterable conductor-material system in proximity to the charge storage region. Cell lines extend among the memory cells. A connection region is provided for electrically coupling contacts and one or more of the cell lines. A non-memory region has embedded logic. Memory cells are arrayed at a cell pitch, with cell lines extending from cell to cell and arrayed substantially at the cell pitch, and with contacts arrayed substantially at the cell pitch forming a high density memory device.
Abstract:
Nonvolatile memory cells having a conductor-filter system, a conductor-insulator system, and a charge-injection system are provided. The conductor-filter system provides band-pass filtering function, charge-filtering function, and mass-filtering function to charge-carriers flows. The conductor-insulator system provides Image-Force barrier lowering effect to collect charge-carriers. The charge-injection system includes the conductor-filter system and the conductor-insulator system, wherein the filter of the conductor-filter system contacts the conductor of the conductor-insulator system. Apparatus on cell architecture are provided for the nonvolatile memory cells. Additionally, apparatus on array architectures are provided for constructing the nonvolatile memory cells in memory array. Method on manufacturing such memory cells and array architectures are provided.
Abstract:
A FET device for operation at high voltages includes a substrate, a first well and a second well within the substrate that are doped with implants of a first type and second type, respectively. The first and second wells define a p-n junction. A field oxide layer within the second well defines a first surface region to receive a drain contact. A third well is located at least partially in the first well, includes doped implants of the second type, and is adapted to receive a source contact. As such, the third well defines a channel between itself and the second well within the first well. A gate is disposed over the channel. At least a first portion of the gate is disposed over the p-n junction, and includes doped implants of the first type. A number of permutations are allowed for doping the remainder of the gate.
Abstract:
A method comprises providing a first conductive region, arranging a second conductive region adjacent to and insulated from the first conductive region by a dielectric region, arranging a third region adjacent to and insulated from the second conductive region, and adjusting mechanical stress to at least one of the first conductive region and the second conductive region.
Abstract:
A system for tracking elements employing fixed tags that are permanently attached to elements. The tags include radio-frequency (RF) communication units that are adapted for wireless communication with RF communicators. The RF tags are permanently affixed to elements as part of the manufacturing of products such as cell phones, PDA's, computers, routers and other electronic equipment. The RF tags are installed during manufacturing in a manner that resists tampering and interference. The RF tags are installed with mechanical barriers to access and are hidden from view in non-user accessible locations.
Abstract:
A management system for tracking elements through steps and stages of a chain employing fixed tags permanently attached to elements that progress through the steps and stages. The elements are tracked by the fixed tags from an initial stage, through multiple work-in-process stages to a final stage of the chain. The fixed tags include radio-frequency (RF) communication units that have wireless communication with RF communicators in one or more of the stages of the supply chain. The wireless communications between the RF tags and the RF communicators operate with a tag communication protocol that defines the operations and sequences for storing information into and retrieval of information from tags. The hierarchy of data storage in RF tags, in RF communicators and otherwise in storage locations in the system is controlled to operate within the memory hierarchy.
Abstract:
NVM arrays include rows and columns of NVM cells comprising a floating gate, dual transistor, inverter storage element. Supply voltage for selected storage elements is turned off during a programming and an erase mode. Isolation transistors for each NVM cell or for each row of NVM cells may be used to control the supply voltage.
Abstract:
A method of forming an array of floating gate memory cells, and an array formed thereby, wherein each memory cell includes an electrical conductive floating gate formed in a trench in a semiconductor substrate, and an electrical conductive control gate having a portion disposed over and insulated from the floating gate. An electrical conductive tunneling gate is disposed over and insulated from the control gate by an insulating layer to form a tri-layer structure permitting both electron and hole charges tunneling through at similar tunneling rate. Spaced apart source and drain regions are formed with the source region disposed adjacent to and insulated from a lower portion of the floating gate, and with the drain region disposed adjacent to and insulated from an upper portion of the floating gate with a channel region formed therebetween and along a sidewall of the trench.
Abstract:
A nonvolatile memory cell is provided. The memory cell includes a storage transistor and an injector in a well of an n-type conductivity. The well is formed in a semiconductor substrate of a p-type conductivity. The storage transistor comprises a source, a drain, a channel, and a charge storage region. The source and the drain are formed in the well and having the p-type conductivity with the channel of the well defined therebetween. The charge storage region is disposed over and insulated from the channel region by an insulator. Further provided are methods operating the memory cell, including means for injecting electrons from the channel through the insulator onto the charge storage region and means for injecting holes from the injector through the well through the channel through the insulator onto the charge storage region. The memory cell can be implemented in a conventional logic CMOS process.
Abstract:
A nonvolatile memory cell is provided. The cell has a charge filter, a tunneling gate, a ballistic gate, a charge storage layer, a source, and a drain with a channel defined between the source and drain. The charge filter permits transporting of charge carriers of one polarity type from the tunneling gate through the blocking material and the ballistic gate to the charge storage layer while blocking the transport of charge carriers of an opposite polarity from the ballistic gate to the tunneling gate. Further embodiments of the present invention provide a cell having a charge filter, a supplier gate, a tunneling gate, a ballistic gate, a source, a drain, a channel, and a charge storage layer. The present invention further provides an energy band engineering method permitting the memory cell be operated without suffering from disturbs, from dielectric breakdown, from impact ionization, and from undesirable RC effects.