SELF-ALIGNED METHOD OF FORMING A SEMICONDUCTOR MEMORY ARRAY OF FLOATING GATE MEMORY CELLS WITH BURIED FLOATING GATE, AND A MEMORY ARRAY MADE THEREBY
    42.
    发明申请
    SELF-ALIGNED METHOD OF FORMING A SEMICONDUCTOR MEMORY ARRAY OF FLOATING GATE MEMORY CELLS WITH BURIED FLOATING GATE, AND A MEMORY ARRAY MADE THEREBY 有权
    形成具有浮动门的浮动存储器存储器的半导体存储器阵列的自对准方法及其存储器阵列

    公开(公告)号:US20050045940A1

    公开(公告)日:2005-03-03

    申请号:US10653015

    申请日:2003-08-28

    摘要: An array of floating gate memory cells, and a method of making same, where each pair of memory cells includes a pair of trenches formed into a surface of a semiconductor substrate, with a strip of the substrate disposed therebetween, a source region formed in the substrate strip, a pair of drain regions, a pair of channel regions each extending between the source region and one of the drain regions, a pair of floating gates each disposed in one of the trenches, and a pair of control gates. Each channel region has a first portion disposed in the substrate strip and extending along one of the trenches, a second portion extending underneath the one trench, a third portion extending along the one trench, and a fourth portion extending along the substrate surface and under one of the control gates.

    摘要翻译: 一种浮动栅极存储单元的阵列及其制造方法,其中每对存储单元包括形成在半导体衬底的表面中的一对沟槽,其中衬底的条带设置在其间,源区域形成在 衬底条,一对漏极区,一对沟道区,每个沟道区各自在源极区和漏极区之一之间延伸;一对浮置栅极,分别设置在一个沟槽中,以及一对控制栅极。 每个通道区域具有设置在衬底条中并沿​​其中一个沟槽延伸的第一部分,在一个沟槽下面延伸的第二部分,沿该沟槽延伸的第三部分,以及沿衬底表面延伸的第四部分 的控制门。

    Method of making phase change memory device employing thermally insulating voids and sloped trench
    43.
    发明授权
    Method of making phase change memory device employing thermally insulating voids and sloped trench 有权
    制造使用隔热空隙和倾斜沟槽的相变存储装置的方法

    公开(公告)号:US07763492B2

    公开(公告)日:2010-07-27

    申请号:US11807131

    申请日:2007-05-25

    申请人: Bomy Chen

    发明人: Bomy Chen

    IPC分类号: H01L21/06

    摘要: A phase change memory device, and method of making the same, that includes a trench formed in insulation material having opposing sidewalls that are inwardly sloping with trench depth. A first electrode is formed in the trench. Phase change memory material is formed in electrical contact with the first electrode. A second electrode is formed in electrical contact with the phase change memory material. Voids are formed in the insulation material to impede heat from the phase change memory material from conducting away therefrom. The voids are formed in pairs, with either a portion of the phase change memory material or the second electrode disposed between the voids.

    摘要翻译: 相变存储器件及其制造方法,其包括形成在绝缘材料中的沟槽,该沟槽具有向内倾斜的沟槽深度的相对的侧壁。 第一电极形成在沟槽中。 相变记忆材料形成为与第一电极电接触。 形成与相变记忆材料电接触的第二电极。 在绝缘材料中形成空隙以阻止相变记忆材料的热量远离导线。 这些空隙成对地形成,其中一部分相变记忆材料或第二电极设置在空隙之间。

    Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same
    44.
    发明授权
    Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same 有权
    被动元件,制品,封装,半导体复合材料及其制造方法

    公开(公告)号:US07605092B2

    公开(公告)日:2009-10-20

    申请号:US11772080

    申请日:2007-06-29

    IPC分类号: H01L21/31 H01L21/469

    摘要: Systems and methods associated with semiconductor articles are disclosed, including forming a first layer of material on a substrate, etching trenches within regions defining a passive element in the first layer, forming metal regions on sidewalls of the trenches, and forming a region of dielectric or polymer material over or in the substrate. Moreover, an exemplary method may also include forming areas of metal regions on the sidewalls of the trenches such that planar strip portions of the areas form electrically conductive regions of the passive element(s) that are aligned substantially perpendicularly with respect to a primary plane of the substrate. Other exemplary embodiments may comprise various articles or methods including capacitive and/or inductive aspects, Titanium- and/or Tantalum-based resistive aspects, products, products by processes, packages and composites consistent with one or more aspects of the innovations set forth herein.

    摘要翻译: 公开了与半导体制品相关联的系统和方法,包括在衬底上形成第一材料层,在限定第一层中的无源元件的区域内蚀刻沟槽,在沟槽的侧壁上形成金属区域,以及形成电介质区域 聚合物材料在衬底上或衬底中。 此外,示例性方法还可以包括在沟槽的侧壁上形成金属区域的区域,使得这些区域的平面条带部分形成无源元件的导电区域,该无源元件相对于主要平面基本上垂直地排列 底物。 其它示例性实施例可以包括与本文所阐述的创新的一个或多个方面一致的各种物品或方法,包括电容和/或感应方面,基于钛和/或钽的电阻方面,产品,通过工艺,封装和复合材料的产品。

    Method Of Trimming Semiconductor Elements With Electrical Resistance Feedback
    45.
    发明申请
    Method Of Trimming Semiconductor Elements With Electrical Resistance Feedback 有权
    使用电阻反馈修整半导体元件的方法

    公开(公告)号:US20080131982A1

    公开(公告)日:2008-06-05

    申请号:US12027916

    申请日:2008-02-07

    IPC分类号: H01L21/02

    摘要: A method of trimming down the volume of a semiconductor resistor element using electrical resistance feedback. After forming conductive material disposed between a pair of electrodes, a voltage is applied to the electrodes to produce an electrical current through the conductive material sufficient to heat and melt away a portion of the conductive material. By reducing the volume of the conductive material, its resistance is increased. The application of the voltage is ceased once the desired dimensions (and thus resistivity) of the conductive material is reached. The resulting semiconductor resistor element could have a fixed resistance, or could have a variable resistance (by using phase change memory material).

    摘要翻译: 使用电阻反馈来减少半导体电阻元件的体积的方法。 在形成设置在一对电极之间的导电材料之后,向电极施加电压以产生通过导电材料的电流,足以加热和熔化掉导电材料的一部分。 通过减小导电材料的体积,其电阻增加。 一旦达到导电材料的所需尺寸(因此电阻率),电压的施加就会停止。 所得到的半导体电阻元件可以具有固定电阻,或者可以具有可变电阻(通过使用相变存储器材料)。

    Novel chalcogenide material, switching device and array of non-volatile memory cells
    46.
    发明申请
    Novel chalcogenide material, switching device and array of non-volatile memory cells 审中-公开
    新型硫族化物材料,开关器件和非易失性存储器单元阵列

    公开(公告)号:US20070278471A1

    公开(公告)日:2007-12-06

    申请号:US11443876

    申请日:2006-05-30

    申请人: Bomy Chen Yin Yin Lin

    发明人: Bomy Chen Yin Yin Lin

    IPC分类号: H01L29/06

    摘要: A novel chalcogenide material has a bulk composition which has a first material selected from the group of Si and Sn, a second material selected from the group of Sb, and a third material selected from the group of Te. The first material, second material, and third material are in a ratio of (Six or Sny) Sb2 Te5, where x is 1≦x≦5, and y is 0.5≦y≦2.0. The material can be used in a switch device, which includes a dielectric/heater layer having a first surface and a second surface opposite the first surface, and the material having a first surface and a second surface opposite the first surface; with the first surface of the material immediately adjacent to and in contact with the first surface of the dielectric/heater layer. A first electrical contact is on the second surface of the dielectric/heater layer. A second electrical contact is on the second surface of the phase changing chalcogenide material. A third electrical contact is on the second surface of the phase changing chalcogenide material, spaced apart from the second electrical contact. The switching device can be programmed such that the channel length separation between the second electrical contact and the third electrical contact on the phase changing chalcogenide material is changed to represent the desired state to be stored in the device. Finally, an array of the above described non-volatile memory cells can be formed in a dielectric/heater layer and the chalcogenide material.

    摘要翻译: 新型硫族化物材料具有本体组合物,其具有选自Si和Sn的第一材料,选自Sb的第二材料和选自Te组的第三材料。 第一材料,第二材料和第三材料的比例为(Si x Si x Si y Sb y Sb 2 Sb 2 O 3) ,其中x是1 <= x <= 5,y是0.5 <= y <= 2.0。 该材料可以用在开关装置中,其包括具有第一表面和与第一表面相对的第二表面的电介质/加热器层,并且该材料具有与第一表面相对的第一表面和第二表面; 其中材料的第一表面紧邻电介质/加热器层的第一表面并与其接触。 电介质/加热器层的第二表面上具有第一电接触。 第二个电触点位于相变硫族化物材料的第二个表面上。 相变硫族化物材料的第二表面上的第三电接触与第二电触点间隔开。 切换装置可以被编程为使得在相变硫属化物材料上的第二电接触和第三电接触之间的通道长度间隔被改变以表示要存储在设备中的期望状态。 最后,可以在电介质/加热器层和硫族化物材料中形成上述非易失性存储单元的阵列。

    Dynamically tunable resistor or capacitor using a non-volatile floating gate memory cell
    47.
    发明授权
    Dynamically tunable resistor or capacitor using a non-volatile floating gate memory cell 有权
    使用非易失性浮动栅极存储单元的动态可调谐电阻或电容

    公开(公告)号:US07245529B2

    公开(公告)日:2007-07-17

    申请号:US11092227

    申请日:2005-03-28

    IPC分类号: G11C11/34

    CPC分类号: G11C27/005 G11C16/10

    摘要: An integrated circuit programmable resistor or programmable capacitor has a floating gate memory cell connected either in series or in parallel to a fixed resistor or a fixed capacitor. The resistance or the capacitance of the floating gate memory cell can be changed by the amount of charge stored on the floating gate which affects the resistance or the capacitance of the channel from which the floating gate is spaced apart. A particular application of the programmable resistor/capacitor is used in a system whereby the resistance or the capacitance can be change or fine tuned as a result of either drift caused by time or by operating conditions such as temperature. Thus, the temperature of the substrate in which the floating gate memory cell is fabricated can be monitored and the resistance or the capacitance of the floating gate memory cell changed dynamically.

    摘要翻译: 集成电路可编程电阻器或可编程电容器具有与固定电阻器或固定电容器串联或并联连接的浮动栅极存储器单元。 可以通过浮动栅极上存储的电荷量来改变浮动栅极存储单元的电阻或电容,影响浮动栅极间隔开的沟道的电阻或电容。 可编程电阻器/电容器的特定应用在系统中使用,由此由于由时间引起的漂移或诸如温度的操作条件导致的电阻或电容可以改变或微调。 因此,可以监视其中制造浮动栅极存储单元的衬底的温度,并且动态地改变浮动栅极存储单元的电阻或电容。

    Self aligned method of forming a semiconductor memory array of floating gate memory cells with buried floating gate and pointed channel region
    48.
    发明授权
    Self aligned method of forming a semiconductor memory array of floating gate memory cells with buried floating gate and pointed channel region 有权
    形成具有埋置浮栅和尖通道区域的浮栅存储器单元的半导体存储器阵列的自对准方法

    公开(公告)号:US07208376B2

    公开(公告)日:2007-04-24

    申请号:US11070079

    申请日:2005-03-01

    IPC分类号: H01L21/8247

    摘要: A method of forming an array of floating gate memory cells, and an array formed thereby, wherein a trench is formed into a surface of a semiconductor substrate. The source region is formed underneath the trench, the drain region is formed along the substrate surface, and the channel region therebetween includes a first portion extending vertically along the trench sidewall and a second portion extending horizontally along the substrate surface. The floating gate is disposed in the trench adjacent to and insulated from the channel region first portion. The control gate is disposed over and insulated from the channel region second portion. The trench sidewall meets the substrate surface at an acute angle to form a sharp edge. The channel region second portion extends from the second region in a direction toward the sharp edge and the floating gate to define a path for programming the floating gate with electrons via hot electron injection.

    摘要翻译: 一种形成浮置栅极存储单元阵列的方法,以及由此形成的阵列,其中沟槽形成在半导体衬底的表面中。 源极区形成在沟槽下方,漏极区沿着衬底表面形成,并且其间的沟道区包括沿着沟槽侧壁垂直延伸的第一部分和沿衬底表面水平延伸的第二部分。 浮动栅极设置在与沟道区域第一部分相邻并与沟槽区域第一部分绝缘的沟槽中。 控制栅极设置在通道区域第二部分之上并与沟道区域第二部分绝缘。 沟槽侧壁以锐角与衬底表面相接触以形成锋利的边缘。 沟道区域第二部分从朝向尖锐边缘的方向从第二区域延伸,并且浮置栅极限定用于通过热电子注入用电子编程浮动栅极的路径。

    Dynamically tunable resistor or capacitor using a non-volatile floating gate memory cell
    49.
    发明申请
    Dynamically tunable resistor or capacitor using a non-volatile floating gate memory cell 有权
    使用非易失性浮动栅极存储单元的动态可调谐电阻或电容

    公开(公告)号:US20060220149A1

    公开(公告)日:2006-10-05

    申请号:US11092227

    申请日:2005-03-28

    申请人: Bomy Chen Kevin Jew

    发明人: Bomy Chen Kevin Jew

    IPC分类号: H01L29/76

    CPC分类号: G11C27/005 G11C16/10

    摘要: An integrated circuit programmable resistor or programmable capacitor has a floating gate memory cell connected either in series or in parallel to a fixed resistor or a fixed capacitor. The resistance or the capacitance of the floating gate memory cell can be changed by the amount of charge stored on the floating gate which affects the resistance or the capacitance of the channel from which the floating gate is spaced apart. A particular application of the programmable resistor/capacitor is used in a system whereby the resistance or the capacitance can be change or fine tuned as a result of either drift caused by time or by operating conditions such as temperature. Thus, the temperature of the substrate in which the floating gate memory cell is fabricated can be monitored and the resistance or the capacitance of the floating gate memory cell changed dynamically.

    摘要翻译: 集成电路可编程电阻器或可编程电容器具有与固定电阻器或固定电容器串联或并联连接的浮动栅极存储器单元。 可以通过浮动栅极上存储的电荷量来改变浮动栅极存储单元的电阻或电容,影响浮动栅极间隔开的沟道的电阻或电容。 可编程电阻器/电容器的特定应用在系统中使用,由此由于由时间引起的漂移或诸如温度的操作条件导致的电阻或电容可以改变或微调。 因此,可以监视其中制造浮动栅极存储单元的衬底的温度,并且动态地改变浮动栅极存储单元的电阻或电容。

    Memory device and method of operating same
    50.
    发明授权
    Memory device and method of operating same 有权
    存储器件及其操作方法

    公开(公告)号:US06937507B2

    公开(公告)日:2005-08-30

    申请号:US10729605

    申请日:2003-12-05

    申请人: Bomy Chen

    发明人: Bomy Chen

    IPC分类号: G11C11/00 G11C16/02 H01L27/24

    摘要: An array of phase changing memory cells that includes a current source, a voltage sensor, a plurality of conductive bit lines electrically connected to the current source, a plurality of conductive word lines each electrically connected to a ground plane via a first resistor and to the voltage sensor, and a plurality of memory cells. Each memory cell is connected between one of the bit lines and one of the word lines and includes phase change memory material. One of the memory cells is selected by turning on switches just on the bit line and word line connected thereto, or by turning a switch connected in series between the corresponding bit and word lines, where the read current flows through the selected memory cell and the voltage sensor measures a voltage drop across the selected memory cell.

    摘要翻译: 一种相变存储器单元的阵列,包括电流源,电压传感器,电连接到电流源的多个导电位线,多个导电字线,每个导电字线经由第一电阻器电连接到接地层, 电压传感器和多个存储单元。 每个存储单元连接在一个位线和一条字线之间,并且包括相变存储器材料。 其中一个存储单元是通过接通开关位于与其连接的位线和字线上,或者通过将串联连接在相应的位和字线之间的开关转换开来来选择的,其中读取的电流流过选定的存储单元, 电压传感器测量所选存储单元上的电压降。