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公开(公告)号:US20210046700A1
公开(公告)日:2021-02-18
申请号:US16978869
申请日:2018-04-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kristopher J. Erickson , Anthony McLennan , Lihua Zhao
IPC: B29C64/188 , B29C64/264
Abstract: An example system includes a three-dimensional (3D) printer to generate a 3D object and a surface feature formation arrangement to receive the 3D object. The 3D object has at least one surface with a layer of at least partly uncured material. The surface feature formation arrangement includes a controller and a heat source. The controller is to operate the heat source to selectively apply heat to the at least one surface of the 3D object. The heat from the heat source is to transform the at least partly uncured material to form a selected feature on the at least one surface.
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公开(公告)号:US10781228B2
公开(公告)日:2020-09-22
申请号:US16079361
申请日:2017-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Adekunle Olubummo , Lihua Zhao , Aja Hartman , Howard S. Tom , Kristopher J. Erickson
IPC: C07F15/04 , C07C321/18 , B29C64/165 , C07F15/00 , B33Y70/00 , B33Y30/00 , B33Y50/02 , B29C64/393
Abstract: An example of a fusing agent includes a metal bis(dithiolene) complex, a thiol surfactant, a polar aprotic solvent, and a balance of water. In an example of a method of making the fusing agent, the metal bis(dithiolene) complex is exposed to an aqueous solution including a reducing agent and a thiol surfactant to form a reduced metal bis(dithiolene) complex and to dissolve the reduced metal bis(dithiolene) complex in the aqueous solution. The aqueous solution is incorporated into a vehicle including a water soluble organic solvent and an additive selected from the group consisting of an emulsifier, a surface tension reduction agent, a wetting agent, a scale inhibitor, an anti-deceleration agent, a chelating agent, an antimicrobial agent, and a combination thereof. The fusing agent may be utilized in a three-dimensional printing method and/or incorporated into a three-dimensional printing system.
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公开(公告)号:US20190143453A1
公开(公告)日:2019-05-16
申请号:US16098075
申请日:2016-07-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Thomas Anthony , Kristopher J. Erickson , Krzysztof Nauka
IPC: B23K26/342 , B33Y70/00 , B23K26/06 , B33Y50/02 , B23K26/18 , B33Y30/00 , B23K26/00 , B23K26/0622 , B23K26/352 , B33Y10/00 , B23K26/14 , B23K26/08
Abstract: In a three-dimensional printing method example, a metallic build material is applied. A positive masking agent is selectively applied on at least a portion of the metallic build material. The positive masking agent includes a radiation absorption amplifier that is compatible with the metallic build material. The metallic build material is exposed to radiation from a spatially broad, high energy light source to melt the portion of the metallic build material in contact with the positive masking agent to form a layer. The radiation absorption amplifier i) has an absorbance for the radiation that is higher than an absorbance for the radiation of the metallic build material, or ii) modifies a surface topography of the at least the portion of the metallic build material to reduce specular reflection of the radiation off of the at least the portion of the metallic build material, or both i) and ii).
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公开(公告)号:US20190030800A1
公开(公告)日:2019-01-31
申请号:US16073256
申请日:2016-05-12
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Stephen G. Rudisill , Alexey S Kabalnov , Kristopher J. Erickson , Howard S Tom , Lihua Zhao
IPC: B29C64/165 , B33Y10/00 , B33Y50/02 , B33Y70/00 , B22F3/00
Abstract: In an example of a three-dimensional (3D) printing method, a crystalline or semi-crystalline build material is applied. A temperature of the crystalline or semi-crystalline build material is maintained within 100° C. below a melting point of the crystalline or semi-crystalline build material. A melt flow property reduction agent is applied to at least a portion of the crystalline or semi-crystalline build material, and the at least the portion of the crystalline or semi-crystalline build material in contact with the melt flow property reduction agent melts or coalesces at the temperature.
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公开(公告)号:US20240375350A1
公开(公告)日:2024-11-14
申请号:US18663833
申请日:2024-05-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kristopher J. Erickson , Thomas C. Anthony
IPC: B29C64/165 , B22F1/054 , B22F10/14 , B28B1/00 , B33Y10/00 , B33Y70/00 , C04B35/622 , C04B35/634 , C04B35/64
Abstract: According to an example, a green body may include from about 1 wt. % to about 20 wt. % of a metal nanoparticle binder and a build material powder, wherein the metal nanoparticle binder is selectively located within an area of the green body to impart a strength greater than about 3 MPa.
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公开(公告)号:US12128612B2
公开(公告)日:2024-10-29
申请号:US17045783
申请日:2018-08-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kristopher J. Erickson , John Samuel Dilip Jangam , Adekunle Olubummo
IPC: B22F1/054 , B22F1/10 , B22F1/103 , B22F10/14 , B22F10/20 , B29C64/165 , B33Y10/00 , B33Y70/00 , C08L71/02 , B22F12/13 , B82Y30/00 , B82Y40/00
CPC classification number: B29C64/165 , B22F1/054 , B22F1/10 , B22F1/103 , B22F10/14 , B22F10/20 , B33Y10/00 , B33Y70/00 , C08L71/02 , B22F12/13 , B22F2999/00 , B82Y30/00 , B82Y40/00 , C08G2650/58 , B22F2999/00 , B22F1/054 , B22F10/10 , B22F10/20 , B22F1/103 , B22F2999/00 , B22F10/14 , B22F10/20 , B22F1/103 , B22F1/054
Abstract: Examples of binder agents for a three-dimensional (3D) printing process are disclosed. In an example, the binder agent includes copper nanoparticles and a liquid vehicle. In this example, the liquid vehicle includes an antioxidant, polyethylene glycol hexadecyl ether, and a balance of water. Another example of the binder agent includes stainless steel nanoparticles and a liquid vehicle. In this example, the liquid vehicle includes polyethylene glycol hexadecyl ether, and a balance of water. Still another example of the binder agent includes nickel nanoparticles and a liquid vehicle. The liquid vehicle includes an antioxidant; a symmetric triblock copolymer including poly(ethylene oxide) and poly(propylene oxide), and a balance of water.
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公开(公告)号:US12017406B2
公开(公告)日:2024-06-25
申请号:US17288552
申请日:2019-04-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Jarrid A. Wittkopf , Kristopher J. Erickson , Lihua Zhao
IPC: B29C41/22 , B29C64/112 , B29C64/165 , B29C70/88 , B33Y10/00 , B33Y70/00 , H01C17/065 , B29C35/08 , B29K105/16 , B29K505/00 , B29L31/34
CPC classification number: B29C64/165 , B29C70/882 , B33Y10/00 , B33Y70/00 , H01C17/06526 , B29C2035/0827 , B29C2795/005 , B29K2105/162 , B29K2505/00 , B29K2995/0005 , B29K2995/0006 , B29K2995/0007 , B29L2031/3406 , B29L2031/3487
Abstract: In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.
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公开(公告)号:US11878346B2
公开(公告)日:2024-01-23
申请号:US16076159
申请日:2017-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Kristopher J. Erickson , Thomas C. Anthony , Lihua Zhao
IPC: B22F10/16 , B33Y10/00 , B33Y70/00 , B33Y80/00 , B29C64/165 , B28B1/00 , C09D11/037 , C09D11/101 , B22F10/38 , B22F10/14 , B22F1/10 , B22F1/102 , B29K505/00 , B29K509/02 , B22F12/55
CPC classification number: B22F10/16 , B22F1/10 , B22F1/102 , B22F10/14 , B22F10/38 , B28B1/001 , B29C64/165 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C09D11/037 , C09D11/101 , B22F12/55 , B22F2302/45 , B29K2505/00 , B29K2509/02 , B22F2999/00 , B22F1/10 , B22F1/0545 , B22F2998/10 , B22F10/14 , B22F3/1021 , B22F3/10
Abstract: According to examples, an object may include a shell including a polymer binder and build material powder; and a core at least partially encompassed by the shell, the core including build material powder and a metal nanoparticle binder.
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公开(公告)号:US11840016B2
公开(公告)日:2023-12-12
申请号:US17843222
申请日:2022-06-17
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Kristopher J. Erickson , Thomas C. Anthony , Lihua Zhao
IPC: B29C64/165 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B29C64/393 , B29C64/30 , B33Y40/20 , B29C71/00 , B29C71/02 , C23C18/16 , C25D5/56 , B22F10/14 , B29C64/112 , B22F10/50 , B22F10/62 , B22F10/64 , B29C70/88 , B29C64/336 , B33Y80/00 , B33Y99/00 , B22F10/12 , B22F10/18 , B22F10/28
CPC classification number: B29C64/165 , B22F10/14 , B22F10/50 , B22F10/62 , B22F10/64 , B29C64/112 , B29C64/30 , B29C64/336 , B29C64/393 , B29C70/882 , B29C71/0009 , B29C71/02 , B33Y10/00 , B33Y30/00 , B33Y40/20 , B33Y50/02 , C23C18/1603 , C25D5/56 , B22F10/12 , B22F10/18 , B22F10/28 , B29C2071/022 , B33Y99/00 , B22F2999/00 , B22F10/14 , B22F3/003 , B22F12/45 , B22F12/55 , B22F12/67 , B22F2998/10 , B22F10/14 , B22F3/10
Abstract: A device includes a coater, a dispenser, and a treatment portion. The coater is to coat, layer-by-layer, a build material relative to a build pad to form a 3D object. The dispenser is to at least dispense a fluid including a first at least potentially electrically conductive material in at least some selected locations of an external surface of the 3D object. The treatment portion is to treat the 3D object to substantially increase electrically conductivity on the external surface of the 3D object at the at least some selected locations.
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公开(公告)号:US11697153B2
公开(公告)日:2023-07-11
申请号:US16605406
申请日:2018-06-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Krzysztof Nauka , John Samuel Dilip Jangam , Kristopher J. Erickson
IPC: B22F10/14 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B22F12/43 , B22F12/63 , B22F10/28 , B22F1/052 , B22F1/105 , B22F1/17 , B33Y70/10
CPC classification number: B22F1/17 , B22F1/052 , B22F1/105 , B22F10/14 , B22F10/28 , B22F12/43 , B22F12/63 , B33Y10/00 , B33Y30/00 , B22F2301/35 , B22F2304/10 , B33Y70/00 , B33Y70/10
Abstract: The present disclosure is drawn to a material set including a powder bed material and a binder fluid. The powder bed material can be from 80 wt % to 100 wt % metal particles having a metal core and a thin metal layer on the core, and the metal particles having a D50 particle size distribution value ranging from 4 μm to 150 μm and the thin metal layer having an average thickness from 20 nm to 2 μm. The binder fluid can adhere a first portion of the powder bed material relative to a second portion of the powder bed material not in contact with the binder fluid.
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