公开(公告)号：US07087010B2

公开(公告)日：2006-08-08

申请号：US10017743

申请日：2001-12-14

申请人： Takashi Ootawara ,  Akira Suzuki ,  Hiroaki Kubokawa ,  Hidenobu Kimura ,  Osamu Tamada ,  Mamoru Nakada ,  Masayuki Iwasaka

发明人： Takashi Ootawara ,  Akira Suzuki ,  Hiroaki Kubokawa ,  Hidenobu Kimura ,  Osamu Tamada ,  Mamoru Nakada ,  Masayuki Iwasaka

IPC分类号： A61B1/00

CPC分类号： A61B1/00098 ,  A61B1/0052 ,  A61B1/01 ,  A61B2017/22038 ,  A61B2017/22045

摘要： Guide wire fixing means is provided for an insertion portion of an endoscope, and a guide wire is releasably engaged when inserting/removing a therapeutic instrument running on the guide wire with a distal end portion of the guide wire inserted into a therapeutic instrument insertion channel of the endoscope being led out from a distal end opening portion of the channel.

公开(公告)号：US07105074B2

公开(公告)日：2006-09-12

申请号：US10202279

申请日：2002-07-22

申请人： Osamu Tamada ,  Tsuyoshi Mitsuhashi ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Masakazu Sanada ,  Takashi Nagao ,  Mitsumasa Kodama

发明人： Osamu Tamada ,  Tsuyoshi Mitsuhashi ,  Minobu Matsunaga ,  Katsushi Yoshioka ,  Kenji Sugimoto ,  Kaoru Aoki ,  Moritaka Yano ,  Satoshi Yamamoto ,  Masakazu Sanada ,  Takashi Nagao ,  Mitsumasa Kodama

IPC分类号： B05B3/00 ,  B08B3/00

CPC分类号： H01L21/6715 ,  H01L21/31133

摘要： A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.

公开(公告)号：US6057511A

公开(公告)日：2000-05-02

申请号：US139292

申请日：1998-08-25

申请人： Kenji Ikeda ,  Osamu Tamada ,  Yoshihiro Tamura

发明人： Kenji Ikeda ,  Osamu Tamada ,  Yoshihiro Tamura

IPC分类号： H01B7/04 ,  H01B7/08 ,  H02G11/00 ,  H01B7/00

CPC分类号： H01B7/0853

摘要： A flexible flat belt made up of a plurality of covered wires abutting each other in side-by-side relationship. Imaginary lines on the peripheries of the covered wires which are parallel to and remote from the axes of the wires determine at least one plane. The adjacent wires form troughs parallel to and spaced apart from the axes and adhesive is applied to the troughs between adjacent wires. It is preferred that a first adhesive, which sets instantaneously, be applied at spaced apart intervals between adjacent wires. Since this adhesive is spaced apart, flexibility is not impaired. This is used in conjunction with the second adhesive which is non-setting and is supplied substantially throughout the length of adjacent wires. Due to its character, it does not interfere with the flexibility of the flat cable. When wires of different diameters are used, they are either placed on a planar work surface and the adhesives applied between adjacent wires on the opposite side from the work surface or the work surface is provided with an offset so that the smaller diameter wires are placed on the offset surface and the larger diameter wires are placed on the surface portion. Since the offset equals the difference between the two diameters, the first set of imaginary lines forms the first plane, thus permitting easy application of the two adhesives.

摘要翻译： 由多个包覆线组成的柔性平带彼此并排地相互抵接。 平行于和远离导线轴线的被覆线的周边上的假想线确定至少一个平面。 相邻的线形成平行于轴线并与其间隔开的槽，并且粘合剂被施加到相邻线之间的槽。 优选地，立即设置的第一粘合剂以相邻导线间隔开的间隔施加。 由于这种粘合剂间隔开，所以不损害柔软性。 这与未设置的第二粘合剂结合使用，并且基本上在相邻线的整个长度上供应。 由于其特点，它不会干扰扁平电缆的灵活性。 当使用不同直径的电线时，它们被放置在平坦的工作表面上，并且施加在与工作表面或工作表面相对的相邻电线之间的粘合剂设置有偏移，使得较小直径的电线放置在 偏移面和较大直径的线被放置在表面部分上。 由于偏移量等于两个直径之间的差异，所以第一组假想线形成第一平面，从而允许两个粘合剂的容易应用。

公开(公告)号：US20080053487A1

公开(公告)日：2008-03-06

申请号：US11846890

申请日：2007-08-29

申请人： Tomohiro Goto ,  Masakazu Sanada ,  Kazuhito Shigemori ,  Osamu Tamada ,  Shuichi Yasuda

发明人： Tomohiro Goto ,  Masakazu Sanada ,  Kazuhito Shigemori ,  Osamu Tamada ,  Shuichi Yasuda

IPC分类号： B08B1/02

CPC分类号： B08B3/024 ,  F26B5/08 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

摘要： A method capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning is provided. A substrate W is held in a horizontal posture by a spin chuck 10 and rotated about a vertical axis by a rotation motor 14, and when an outlet of the nozzle 20 is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle 20 has started to move, only one dried core is produced in the vicinity of the center of the substrate W, and thus production of not less than two dried cores in the vicinity of the center of the substrate W is prevented. The dried region is spread all over the surface of the substrate W.

摘要翻译： 提供了当去除去离子水喷嘴20被扫描以通过纺丝干燥基板时能够消除显影破坏的发生的方法。 基板W由旋转卡盘10保持在水平姿态，并通过旋转马达14绕垂直轴旋转，并且当喷嘴20的出口从与基板W的中心相对的位置扫描到位置 在喷嘴20开始移动之后立即排出清洗液时，与圆周边缘相对，在基板W的中心附近仅产生一个干燥的芯，从而在基板W的中心生成不少于2个的干燥芯 防止了基板W的中心附近。 干燥的区域遍布衬底W的整个表面。

公开(公告)号：US20050205113A1

公开(公告)日：2005-09-22

申请号：US11081266

申请日：2005-03-16

申请人： Osamu Tamada ,  Masakazu Sanada

发明人： Osamu Tamada ,  Masakazu Sanada

IPC分类号： G03F7/30 ,  B05C5/02 ,  B05C11/08 ,  B08B3/02 ,  H01L21/00 ,  H01L21/027

CPC分类号： H01L21/6715 ,  H01L21/67051

摘要： A processing solution supply nozzle is moved relatively from one end to the opposite end of a semiconductor wafer having undergone a developing operation while discharging an anti-static processing solution in a discharge width equal to or greater than the width of the semiconductor wafer. The anti-static processing solution is thereby supplied onto the semiconductor wafer. The prevention of charging of the substrate avoids the occurrence of defects. The processing solution supplied almost uniformly on the entire surface of the substrate also avoids the occurrence of defects.

摘要翻译： 处理溶液供给喷嘴相对于已经经历显影操作的半导体晶片的一端相对移动，同时以等于或大于半导体晶片的宽度的放电宽度排出防静电处理溶液。 由此将抗静电处理液供给到半导体晶片上。 防止基板充电，避免了缺陷的发生。 在基板的整个表面上几乎均匀地提供的处理溶液也避免了缺陷的发生。

公开(公告)号：US09059221B2

公开(公告)日：2015-06-16

申请号：US11846890

申请日：2007-08-29

申请人： Tomohiro Goto ,  Masakazu Sanada ,  Kazuhito Shigemori ,  Osamu Tamada ,  Shuichi Yasuda

发明人： Tomohiro Goto ,  Masakazu Sanada ,  Kazuhito Shigemori ,  Osamu Tamada ,  Shuichi Yasuda

IPC分类号： H01L21/02 ,  B08B3/04 ,  F26B5/08 ,  H01L21/67

CPC分类号： B08B3/024 ,  F26B5/08 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

摘要： A method capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning is provided. A substrate W is held in a horizontal posture by a spin chuck 10 and rotated about a vertical axis by a rotation motor 14, and when an outlet of the nozzle 20 is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle 20 has started to move, only one dried core is produced in the vicinity of the center of the substrate W, and thus production of not less than two dried cores in the vicinity of the center of the substrate W is prevented. The dried region is spread all over the surface of the substrate W.

摘要翻译： 提供了当去除去离子水喷嘴20被扫描以通过纺丝干燥基板时能够消除显影破坏的发生的方法。 基板W由旋转卡盘10保持在水平姿态，并通过旋转马达14绕垂直轴旋转，并且当喷嘴20的出口从与基板W的中心相对的位置扫描到位置 在喷嘴20开始移动之后立即排出清洗液时，与圆周边缘相对，在基板W的中心附近仅产生一个干燥的芯，从而在基板W的中心生成不少于2个的干燥芯 防止了基板W的中心附近。 干燥的区域遍布衬底W的整个表面。

公开(公告)号：US20130214079A1

公开(公告)日：2013-08-22

申请号：US13879126

申请日：2012-01-12

申请人： Eiji Kobayashi ,  Osamu Tamada

发明人： Eiji Kobayashi ,  Osamu Tamada

IPC分类号： H01B13/00

CPC分类号： H01B13/00 ,  H01B13/2606

摘要： A capstan device for taking up a braided wire in a braided wire manufacturing apparatus for braiding a plurality of wires to manufacture the braided wire. The capstan device includes a capstan roller having a tapered outer peripheral surface and provided with a flange portion on an end at a small diameter side thereof, and a guide member. The guide member has a first guide surface provided to be turned toward a large diameter side of the capstan roller in an axial direction of the capstan roller in a position on a larger diameter side than a portion having the smallest diameter in the tapered outer peripheral surface, and a second guide surface provided to be protruded from the first guide surface at an outer peripheral side of the tapered outer peripheral surface.

摘要翻译： 一种用于在编织线制造装置中卷绕编织线的绞盘装置，用于编织多根线以制造编织线。 绞盘装置包括具有锥形外周面的主导辊，并且在其小直径侧的端部上设置有凸缘部分和引导构件。 引导构件具有第一引导表面，该第一引导表面设置成沿着主动轮的轴向方向朝向主动轮的大直径侧在比在锥形外周面中具有最小直径的部分更大直径侧的位置 以及设置成在锥形外周面的外周侧从第一引导面突出的第二引导面。

公开(公告)号：US20090269936A1

公开(公告)日：2009-10-29

申请号：US12242296

申请日：2008-09-30

申请人： Osamu Tamada ,  Masakazu Sanada ,  Tadashi Miyagi

发明人： Osamu Tamada ,  Masakazu Sanada ,  Tadashi Miyagi

IPC分类号： H01L21/302 ,  B05B12/04

CPC分类号： H01L21/6715 ,  G03F7/16

摘要： A thermal processing unit of a thermal processor for anti-reflection films includes: a covering nozzle for covering a substrate from above supported by a thermal processing plate and discharging an adhesion enhancing agent to a periphery of a substrate supported by the thermal processing plate; and a vaporization processor for supplying an adhesion enhancing agent in the vapor phase to the covering nozzle. While a substrate placed over the thermal processing plate is being subjected to thermal process, a control part causes the covering nozzle to discharge an adhesion enhancing agent in the vapor phase onto a periphery of a substrate to realize adhesion enhancement process. Thus, the adhesion between a resist coating film and a substrate surface in the periphery of a substrate is enhanced. Further, parallel implementation of thermal process and adhesion enhancement process exerts no influence on throughput.

摘要翻译： 用于防反射膜的热处理器的热处理单元包括：覆盖喷嘴，用于从由热处理板支撑的上方覆盖基板，并将粘附增强剂排放到由热处理板支撑的基板的周边; 以及用于将气相中的粘附增强剂供给到覆盖喷嘴的蒸发处理器。 当放置在热处理板上的基板经受热处理时，控制部分使得覆盖喷嘴将气相中的粘附增强剂排出到基板的周边上，以实现粘附增强过程。 因此，增强了抗蚀剂涂膜与基板周边的基板表面之间的粘合性。 此外，热处理和附着增强过程的并行实施对生产量没有影响。

公开(公告)号：US20050065399A1

公开(公告)日：2005-03-24

申请号：US10899693

申请日：2004-07-27

申请人： Isao Sasaki ,  Tsuyoshi Nakagawa ,  Yasushi Okoshi ,  Jin Ito ,  Kenichi Adachi ,  Hiroaki Kubokawa ,  Hidenobu Kimura ,  Osamu Tamada ,  Tae Mitsuya ,  Takashi Otawara

发明人： Isao Sasaki ,  Tsuyoshi Nakagawa ,  Yasushi Okoshi ,  Jin Ito ,  Kenichi Adachi ,  Hiroaki Kubokawa ,  Hidenobu Kimura ,  Osamu Tamada ,  Tae Mitsuya ,  Takashi Otawara

IPC分类号： A61B19/00 ,  A61B1/00 ,  A61B1/018

CPC分类号： A61B1/00137 ,  A61B1/018

摘要： An adapter for an endoscope of the present invention includes: a locking device for attaching and detaching that attaches and locks this adapter for an endoscope onto a predefined position on an endoscope control part; and a first treatment tool locking device that keeps a treatment tool at a first predefined position. Furthermore, at the first predefined position, a guidewire entry aperture of the treatment tool and an entry aperture of a forceps plug are separated in such a way as to face each other along substantially the same line.

摘要翻译： 本发明的内窥镜适配器包括：用于安装和拆卸的锁定装置，将用于内窥镜的该适配器连接并锁定到内窥镜控制部件上的预定位置; 以及将治疗工具保持在第一预定义位置的第一治疗工具锁定装置。 此外，在第一预定位置处，处理工具的导丝进入孔和镊子塞的入口孔以基本上相同的线彼此面对的方式分离。

公开(公告)号：US08887610B2

公开(公告)日：2014-11-18

申请号：US13879126

申请日：2012-01-12

申请人： Eiji Kobayashi ,  Osamu Tamada

发明人： Eiji Kobayashi ,  Osamu Tamada

IPC分类号： D04C3/48 ,  H01B13/00 ,  H01B13/26

CPC分类号： H01B13/00 ,  H01B13/2606

摘要： A capstan device for taking up a braided wire in a braided wire manufacturing apparatus for braiding a plurality of wires to manufacture the braided wire. The capstan device includes a capstan roller having a tapered outer peripheral surface and provided with a flange portion on an end at a small diameter side thereof, and a guide member. The guide member has a first guide surface provided to be turned toward a large diameter side of the capstan roller in an axial direction of the capstan roller in a position on a larger diameter side than a portion having the smallest diameter in the tapered outer peripheral surface, and a second guide surface provided to be protruded from the first guide surface at an outer peripheral side of the tapered outer peripheral surface.

摘要翻译： 一种用于在编织线制造装置中卷绕编织线的绞盘装置，用于编织多根线以制造编织线。 绞盘装置包括具有锥形外周面的主导辊，并且在其小直径侧的端部上设置有凸缘部分和引导构件。 引导构件具有第一引导表面，该第一引导表面设置成沿着主动轮的轴向方向朝向主动轮的大直径侧在比在锥形外周面中具有最小直径的部分更大直径侧的位置 以及设置成在锥形外周面的外周侧从第一引导面突出的第二引导面。