公开(公告)号：US20190113545A1

公开(公告)日：2019-04-18

申请号：US16096968

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Jelena CULIC-VISKOTA ,  Thomas L. SOUNART ,  Feras EID ,  Sasha N. OSTER

IPC: G01R15/20 ,  H01L41/06 ,  H01L41/12

Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.

公开(公告)号：US20190036774A1

公开(公告)日：2019-01-31

申请号：US16152280

申请日：2018-10-04

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H04L12/24 ,  A61B5/0205 ,  A61B5/00 ,  H01H57/00 ,  H01L41/047 ,  H01L41/187

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US20190036002A1

公开(公告)日：2019-01-31

申请号：US16072166

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Feras EID ,  Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Baris BICEN ,  Thomas L. SOUNART ,  Johanna M. SWAN ,  Adel A. ELSHERBINI ,  Valluri R. RAO

IPC: H01L41/09 ,  G02F1/01 ,  H01L27/32 ,  F21S10/02 ,  H01L41/22 ,  H01L51/00

Abstract: Embodiments of the invention include piezoelectrically driven switches that are used for modifying a background color or light source color in display systems, and methods of forming such devices. In an embodiment, a piezoelectrically actuated switch for modulating a background color in a display may include a photonic crystal that has a plurality of blinds oriented substantially perpendicular to a surface of the display. In an embodiment, the blinds include a black surface and a white surface. The switch may also include an anchor spaced away from an edge of the photonic crystal and a piezoelectric actuator formed on the surface of the anchor and a surface of the photonic crystal. Some embodiments may include a photonic crystal that is a multi-layer polymeric structure or a polymer chain with a plurality of nanoparticles spaced at regular intervals on the polymer chain.

公开(公告)号：US20190033500A1

公开(公告)日：2019-01-31

申请号：US16072173

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Thomas L. SOUNART ,  Baris BICEN ,  Feras EID ,  Sasha N. OSTER ,  Aleksandar ALEKSOV ,  Shawna M. LIFF ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: G02B5/18 ,  G02B26/08 ,  H01L41/09

Abstract: Embodiments of the invention include an optical grating switch integrated into an organic substrate and methods of forming such devices. According to an embodiment, the optical grating switch may include a cavity formed into an organic substrate. Additionally, the optical grating switch may include an array of moveable beams anchored to the organic substrate and suspended over the cavity. In an embodiment of the invention, each of the moveable beams in the optical grating switch may include a piezoelectric region formed over end portions of the moveable beam and a top electrode formed over a top surface of each of the piezoelectric regions. In order to reflect or diffract light, embodiments of the invention may include moveable beams that include a reflective surface formed over a central portion of the moveable beam.

公开(公告)号：US20180240762A1

公开(公告)日：2018-08-23

申请号：US15773033

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Javier A. FALCON ,  Shawna M. LIFF ,  Yoshihiro TOMITA

IPC: H01L23/66 ,  H01L25/16 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/00 ,  H01L25/16 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104

Abstract: Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20180003569A1

公开(公告)日：2018-01-04

申请号：US15199907

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: G01K11/26 ,  H01L41/09 ,  H01L41/047

CPC classification number: G01K11/26 ,  H01L41/047 ,  H01L41/09 ,  H01L41/1132

Abstract: Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.

公开(公告)号：US20220415847A1

公开(公告)日：2022-12-29

申请号：US17357729

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Feras EID ,  Johanna M. SWAN ,  Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Aleksandar ALEKSOV

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/498

Abstract: Embodiments disclosed herein include multi-die modules and methods of assembling multi-die modules. In an embodiment, a multi-die module comprises a first die. In an embodiment the first die comprises a first pedestal, a plateau around the first pedestal, and a stub extending up from the plateau. In an embodiment, the multi-die module further comprises a second die. In an embodiment, the second die comprises a second pedestal, where the second pedestal is attached to the first pedestal.

公开(公告)号：US20220344247A1

公开(公告)日：2022-10-27

申请号：US17862300

申请日：2022-07-11

Applicant: Intel Corporation

Inventor： Debendra MALLIK ,  Robert L. SANKMAN ,  Robert NICKERSON ,  Mitul MODI ,  Sanka GANESAN ,  Rajasekaran SWAMINATHAN ,  Omkar KARHADE ,  Shawna M. LIFF ,  Amruthavalli ALUR ,  Sri Chaitra J. CHAVALI

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00

Abstract: Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semiconductor package is formed with one or more of: (i) metal pillars having an ultra-fine pitch (e.g., a pitch that is greater than or equal to 150 μm, etc.); (ii) a large die-to-package ratio (e.g., a ratio that is equal to or greater than 0.85, etc.); and (iii) a thin pitch translation interposer. Another exemplary semiconductor package is formed using coreless substrate technology, die back metallization, and low temperature solder technology for ball grid array (BGA) metallurgy. Other embodiments are described.

公开(公告)号：US20200312782A1

公开(公告)日：2020-10-01

申请号：US16651949

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Henning BRAUNISCH ,  Shawna M. LIFF ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/04 ,  H01L23/10 ,  H01L23/498 ,  H01L23/00

Abstract: A device package and a method of forming the device package are described. The device package includes a substrate having a ground plane and dies disposed on the substrate. The dies are electrically coupled to the substrate with solder balls or bumps surrounded by an underfill layer. The device package has a mold layer disposed over and around the dies, the underfill layer, and the substrate. The device package further includes an additively manufactured electromagnetic interference (EMI) shield layer disposed on an outer surface of the mold layer. The additively manufactured EMI shield layer is electrically coupled to the ground plane of the substrate. The outer surface of the mold layer may include a topmost surface and one or more sidewalls that are covered with the additively manufactured EMI shield layer. The additively manufactured EMI shield may include a first and second additively manufactured EMI shield layers and an additively manufactured EMI shield frame.

公开(公告)号：US20190317285A1

公开(公告)日：2019-10-17

申请号：US16473216

申请日：2017-09-12

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Henning BRAUNISCH ,  Timothy A. GOSSELIN ,  Prasanna RAGHAVAN ,  Yikang DENG ,  Zhiguo QIAN

IPC: G02B6/42 ,  F21V8/00 ,  G02B6/293

Abstract: An optoelectronic apparatus is presented. In embodiments, the apparatus may include a package including a substrate with a first side and a second side opposite the first side, wherein the first side comprises a ball grid array (BGA) field. The apparatus may further include one or more integrated circuits (ICs) disposed on the first side of the substrate, inside the BGA field, that thermally interface with a printed circuit board (PCB), to which the package is to be coupled, one or more optical ICs coupled to the second side and communicatively coupled with the one or more ICs via interconnects provided in the substrate, wherein at least one of the optical ICs is at least partially covered by an integrated heat spreader (IHS), to provide dissipation of heat produced by the at least one optical IC.