公开(公告)号：US20200091608A1

公开(公告)日：2020-03-19

申请号：US16472830

申请日：2017-12-20

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asl ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/24 ,  H01Q5/47 ,  H01Q3/24 ,  H01Q21/24 ,  H04B1/3827 ,  H04B15/04 ,  H04B7/0456 ,  H04B7/06 ,  H03L7/14

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：US20200082969A1

公开(公告)日：2020-03-12

申请号：US16616387

申请日：2017-06-28

Applicant: Intel Corporation

Inventor： Fay Hua ,  Sidharth Dalmia ,  Zhichao Zhang

IPC: H01F27/28 ,  H01L23/522 ,  H01L23/498 ,  H01L23/58 ,  H01L21/48 ,  H01L23/00 ,  H01F41/04

Abstract: An apparatus is provided which comprises: a planar dielectric surface, two or more conductive leads on the surface, the conductive leads extending away from the substrate surface, two or more conductive traces on the surface between the conductive leads, the traces substantially parallel to each other, and a wire coupling a first end of a first conductive trace to an opposite end of an adjacent second conductive trace, the wire extending away from the surface. Other embodiments are also disclosed and claimed.

公开(公告)号：US20190372229A1

公开(公告)日：2019-12-05

申请号：US16000795

申请日：2018-06-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/08 ,  H01Q1/22

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.