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    DIFFERENTIAL ON-CHIP LOOP ANTENNA
    8.
    发明申请
    DIFFERENTIAL ON-CHIP LOOP ANTENNA 有权

    公开(公告)号：US20210351511A1

    公开(公告)日：2021-11-11

    申请号：US17381073

    申请日：2021-07-20

    Applicant: Intel Corporation

    Inventor： Nir Weisman ,  Omer Asaf ,  Eyal Goldberger

    IPC: H01Q7/00 ,  H01L23/66 ,  H01Q1/22 ,  H01Q21/06 ,  H01L23/552 ,  H01Q5/371 ,  H01Q25/00

    Abstract: Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. In some embodiments, the on-chip loop antenna is in an integrated circuit (IC) die. The IC die comprises metal loops substantially centered around a core region of the IC die in a metallization stack of the IC die, a dielectric between spaces of the metal loops, an electric circuit in the core region electrically connected to the metal loops with an interconnect, and a ground plane in the metallization stack electrically connected to the loops with a first plurality of vias and to the electric circuit with a second plurality of vias. The first plurality of vias is different from the second plurality of vias, and the electric circuit includes an inductor. In some embodiments, the on-chip loop antenna can be carried by a semiconductor package.

    DIFFERENTIAL ON-CHIP LOOP ANTENNA
    9.
    发明申请
    DIFFERENTIAL ON-CHIP LOOP ANTENNA 审中-公开

    公开(公告)号：US20190097320A1

    公开(公告)日：2019-03-28

    申请号：US15716930

    申请日：2017-09-27

    Applicant: Intel Corporation

    Inventor： Nir Weisman ,  Omer Asaf ,  Eyal Goldberger

    IPC: H01Q7/00 ,  H01Q1/22 ,  H01L23/66

    Abstract: Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. The on-chip loop antenna can be carried by a semiconductor package. The semiconductor package can include a printed circuit board coupled to an integrated circuit chip. The integrated circuit chip can include a semiconductor substrate, an integrated circuit; and a loop antenna surrounding the integrated circuit. In embodiments, the semiconductor package can include a metal shield enclosing the integrated circuit chip. In embodiments, the on-chip loop antenna can be impedance matched to the impedance of the integrated circuit. In embodiments, the integrated circuit can include an antenna driver to drive the antenna differentially, the on-chip loop antenna surrounding the antenna driver.

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