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公开(公告)号:US20220384956A1
公开(公告)日:2022-12-01
申请号:US17734529
申请日:2022-05-02
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asi , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q5/47 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US11424539B2
公开(公告)日:2022-08-23
申请号:US16472830
申请日:2017-12-20
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q5/47 , H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US11211688B2
公开(公告)日:2021-12-28
申请号:US16638567
申请日:2018-09-28
Applicant: Intel Corporation
Inventor: Omer Asaf , Nir Weisman , Naftali Landsberg , Eyal Goldberger , Pablo Herrero , Harry G. Skinner
Abstract: Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.
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公开(公告)号:US20200091608A1
公开(公告)日:2020-03-19
申请号:US16472830
申请日:2017-12-20
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q1/38 , H01Q1/48 , H01Q1/24 , H01Q5/47 , H01Q3/24 , H01Q21/24 , H04B1/3827 , H04B15/04 , H04B7/0456 , H04B7/06 , H03L7/14
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US11955732B2
公开(公告)日:2024-04-09
申请号:US18089220
申请日:2022-12-27
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
CPC classification number: H01Q9/0414 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/145 , H04B1/3827 , H04B7/0482 , H04B7/0639 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US20200220249A1
公开(公告)日:2020-07-09
申请号:US16638567
申请日:2018-09-28
Applicant: Intel Corporation
Inventor: Omer Asaf , Nir Weisman , Naftali Landsberg , Eyal Goldberger , Pablo Herrero , Harry G. Skinner
Abstract: Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.
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公开(公告)号:US12237589B2
公开(公告)日:2025-02-25
申请号:US17734529
申请日:2022-05-02
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q5/47 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q9/04 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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公开(公告)号:US20210351511A1
公开(公告)日:2021-11-11
申请号:US17381073
申请日:2021-07-20
Applicant: Intel Corporation
Inventor: Nir Weisman , Omer Asaf , Eyal Goldberger
Abstract: Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. In some embodiments, the on-chip loop antenna is in an integrated circuit (IC) die. The IC die comprises metal loops substantially centered around a core region of the IC die in a metallization stack of the IC die, a dielectric between spaces of the metal loops, an electric circuit in the core region electrically connected to the metal loops with an interconnect, and a ground plane in the metallization stack electrically connected to the loops with a first plurality of vias and to the electric circuit with a second plurality of vias. The first plurality of vias is different from the second plurality of vias, and the electric circuit includes an inductor. In some embodiments, the on-chip loop antenna can be carried by a semiconductor package.
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公开(公告)号:US20190097320A1
公开(公告)日:2019-03-28
申请号:US15716930
申请日:2017-09-27
Applicant: Intel Corporation
Inventor: Nir Weisman , Omer Asaf , Eyal Goldberger
Abstract: Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. The on-chip loop antenna can be carried by a semiconductor package. The semiconductor package can include a printed circuit board coupled to an integrated circuit chip. The integrated circuit chip can include a semiconductor substrate, an integrated circuit; and a loop antenna surrounding the integrated circuit. In embodiments, the semiconductor package can include a metal shield enclosing the integrated circuit chip. In embodiments, the on-chip loop antenna can be impedance matched to the impedance of the integrated circuit. In embodiments, the integrated circuit can include an antenna driver to drive the antenna differentially, the on-chip loop antenna surrounding the antenna driver.
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公开(公告)号:US20240243477A1
公开(公告)日:2024-07-18
申请号:US18442331
申请日:2024-02-15
Applicant: Intel Corporation
Inventor: Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Marian Verhelst , Yossi Tsfati , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC: H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
CPC classification number: H01Q9/0414 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/145 , H04B1/3827 , H04B7/0482 , H04B7/0639 , H04B15/04
Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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