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公开(公告)号：US20150006112A1
公开(公告)日：2015-01-01
申请号：US14242283
申请日：2014-04-01
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael S. Gordon , Kenneth P. Rodbell , Emmanuel Yashchin
IPC: G01N23/00
CPC classification number: G01T1/178 , H01L2924/0002 , H01L2924/00
Abstract: A system, method and computer program product for determining whether a material meets an alpha particle emissivity specification that includes measuring a background alpha particle emissivity for the counter and measuring a combined alpha particle emissivity from the counter containing a sample of the material. The combined alpha particle emissivity includes the background alpha particle emissivity in combination with a sample alpha particle emissivity. The decision statistic is computed based on the observed data and compared to a threshold value. When the decision statistic is less than the threshold value, the material meets the alpha particle emissivity specification. The testing times are computed based on pre-specified criteria so as to meet the needs of both Producer and Consumer.
Abstract translation: 一种用于确定材料是否满足α粒子发射率规范的系统，方法和计算机程序产品，其包括测量用于计数器的背景α粒子发射率并从包含材料样品的计数器测量组合的α粒子发射率。 组合的α粒子发射率包括背景α粒子发射率与样品α粒子发射率的组合。 根据观察到的数据计算决策统计量，并与阈值进行比较。 当判定统计量小于阈值时，材料满足α粒子发射率规格。 测试时间是根据预先确定的标准计算的，以满足生产者和消费者的需求。
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公开(公告)号：US20140329351A1
公开(公告)日：2014-11-06
申请号：US13886646
申请日：2013-05-03
Applicant: International Business Machines Corporation
Inventor： MICHAEL S. GORDON , Christopher V. Jahnes , Eric A. Joseph , Hiroyuki Miyazoe , Kenneth P. Rodbell , Arun Sharma , Sri M. Sri-Jayantha
IPC: H01L31/18
CPC classification number: H01L31/18 , G01T1/04 , G01T1/18 , H01J47/062 , H01J47/08
Abstract: A method for a constructing radiation detector includes fabricating a multi-layer structure upon a wafer, the multi-layer structure comprising a plurality of metal layers, a plurality of sacrificial layers, and a plurality of insulating layers, forming a cavity within the multi-layer structure, filling the cavity with a gas that ionizes in response to nuclear radiation, and sealing the gas within the cavity.
Abstract translation: 一种用于构造辐射探测器的方法包括在晶片上制造多层结构，所述多层结构包括多个金属层，多个牺牲层和多个绝缘层， 层结构，用响应于核辐射电离的气体填充空腔，并将气体密封在空腔内。
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公开(公告)号：US08828870B2
公开(公告)日：2014-09-09
申请号：US14152127
申请日：2014-01-10
Applicant: International Business Machines Corporation
Inventor： Cyril Cabral, Jr. , Jeffrey P. Gambino , Qiang Huang , Takeshi Nogami , Kenneth P. Rodbell
IPC: H01L21/44 , H01L21/288 , H01L21/768 , H01L23/532 , H01L23/535
CPC classification number: H01L21/7684 , H01L21/2885 , H01L21/76841 , H01L21/76873 , H01L21/76877 , H01L21/76883 , H01L23/53233 , H01L23/53238 , H01L23/535 , H01L2924/0002 , H01L2924/00
Abstract: A metal interconnect structure and a method of manufacturing the metal interconnect structure. Manganese (Mn) is incorporated into a copper (Cu) interconnect structure in order to modify the microstructure to achieve bamboo-style grain boundaries in sub-90 nm technologies. Preferably, bamboo grains are separated at distances less than the “Blech” length so that copper (Cu) diffusion through grain boundaries is avoided. The added Mn also triggers the growth of Cu grains down to the bottom surface of the metal line so that a true bamboo microstructure reaching to the bottom surface is formed and the Cu diffusion mechanism along grain boundaries oriented along the length of the metal line is eliminated.
Abstract translation: 金属互连结构和金属互连结构的制造方法。 锰（Mn）被掺入到铜（Cu）互连结构中，以便在90nm以下的技术中改变微观结构以实现竹型晶界。 优选地，竹颗粒在小于“漂白”长度的距离处分离，以便避免通过晶界的铜（Cu）扩散。 添加的Mn还触发Cu颗粒向金属线底部的生长，从而形成达到底面的真正的竹结构，消除沿着金属线长度取向的晶界的Cu扩散机理 。
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公开(公告)号：US12048254B2
公开(公告)日：2024-07-23
申请号：US17071528
申请日：2020-10-15
Applicant: International Business Machines Corporation
Inventor： Vivekananda P. Adiga , Martin O. Sandberg , Jeng-Bang Yau , David L. Rath , John Bruley , Cihan Kurter , Kenneth P. Rodbell , Hongwen Yan
CPC classification number: H10N60/0912 , H10N60/805 , H10N60/83 , H10N60/85
Abstract: Devices, systems, methods, and/or computer-implemented methods that can facilitate protection of a substrate in a qubit device using sacrificial material are provided. According to an embodiment, a device can comprise a superconducting lead provided on a pillar of a sacrificial material provided on a substrate. The device can further comprise a collapsed superconducting junction provided on the substrate and coupled to the superconducting lead.
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公开(公告)号：US11927616B2
公开(公告)日：2024-03-12
申请号：US17217341
申请日：2021-03-30
Applicant: International Business Machines Corporation
Inventor： Michael S. Gordon , Kenneth P. Rodbell , Conal Murray
CPC classification number: G01R31/002 , G01T1/178 , G01T1/24
Abstract: A method for measuring alpha particle emissions may include obtaining a wafer emission rate, wherein the wafer emission rate is measured with a counter. The method may further include covering the wafer with a metal mesh grounded to a cathode of the counter wherein the metal mesh is grounded to the cathode outboard of the wafer and obtaining a mesh and wafer emission rate, wherein the mesh and wafer emission rate is measured with the counter. The method may further include replacing the wafer with a wafer carcass, obtaining a wafer carcass and mesh emission rate, and calculating a wafer carcass emissivity.
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Patent Agency Ranking
公开(公告)号：US11538977B2
公开(公告)日：2022-12-27
申请号：US17116125
申请日：2020-12-09
Applicant: International Business Machines Corporation
Inventor： Ryan T. Gordon , Kenneth P. Rodbell , Robert L. Sandstrom , Jeffrey W. Sleight
Abstract: Techniques regarding qubit structures comprising ion implanted Josephson junctions are provided. For example, one or more embodiments described herein can comprise an apparatus that can include a strip of superconducting material coupling a first superconducting electrode and a second superconducting electrode. The strip of superconducting material can have a first region comprising an ion implant and a second region that is free from the ion implant.
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公开(公告)号：US20220317172A1
公开(公告)日：2022-10-06
申请号：US17217341
申请日：2021-03-30
Applicant: International Business Machines Corporation
Inventor： Michael S. Gordon , Kenneth P. Rodbell , Conal Murray
Abstract: A method for measuring alpha particle emissions may include obtaining a wafer emission rate, wherein the wafer emission rate is measured with a counter. The method may further include covering the wafer with a metal mesh grounded to a cathode of the counter wherein the metal mesh is grounded to the cathode outboard of the wafer and obtaining a mesh and wafer emission rate, wherein the mesh and wafer emission rate is measured with the counter. The method may further include replacing the wafer with a wafer carcass, obtaining a wafer carcass and mesh emission rate, and calculating a wafer carcass emissivity.
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公开(公告)号：US11152378B1
公开(公告)日：2021-10-19
申请号：US16829414
申请日：2020-03-25
Applicant: International Business Machines Corporation
Inventor： Daniel L. Stasiak , Hassan Naser , Michael J. Mueller , Kenneth P. Rodbell , Philip J. Oldiges
Abstract: An integrated circuit package with a buffer providing radiation protection to memory elements and components is described. The integrated circuit packages and the incorporated buffers provide a protective distance between potential sources of internal radiation particles within the integrated circuit package and any memory elements/components which may be sensitive to radiation such as alpha particles. This protective distance allows for the integrated circuit packages to be completed or assembled without needing added more expensive or redundant memory components.
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公开(公告)号：US20210257410A1
公开(公告)日：2021-08-19
申请号：US16692586
申请日：2019-11-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Matthew J. BrightSky , Cyril Cabral, JR. , Kenneth P. Rodbell
Abstract: A reactive material erasure element comprising a reactive material is located between PCM cells and is in close proximity to the PCM cells. The reaction of the reactive material is trigger by a current applied by a bottom electrode which has a small contact area with the reactive material erasure element, thereby providing a high current density in the reactive material erasure element to ignite the reaction of the reactive material. Due to the close proximity of the PCM cells and the reactive material erasure element, the heat generated from the reaction of the reactive material can be effectively directed to the PCM cells to cause phase transformation of phase change material elements in the PCM cells, which in turn erases data stored in the PCM cells.
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公开(公告)号：US20190311082A1
公开(公告)日：2019-10-10
申请号：US16433675
申请日：2019-06-06
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Qianwen Chen , Li-Wen Hung , Wanki Kim , John U. Knickerbocker , Kenneth P. Rodbell , Robert L. Wisnieff
IPC: G06F17/50 , H01L25/07 , G06F15/78 , H01L25/11 , H01L25/065 , H01L21/56 , H01L25/18 , H01L23/00 , H01L23/31 , H01L25/00 , H01L21/683
Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.
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