Integrated multi-channel analog front end and digitizer for high speed imaging applications
    43.
    发明授权
    Integrated multi-channel analog front end and digitizer for high speed imaging applications 有权
    集成多通道模拟前端和数字化仪,用于高速成像应用

    公开(公告)号:US09462206B2

    公开(公告)日:2016-10-04

    申请号:US14272454

    申请日:2014-05-07

    Abstract: A module for high speed image processing includes an image sensor for generating a plurality of analog outputs representing an image and a plurality of HDDs for concurrently processing the plurality of analog outputs. Each HDD is an integrated circuit configured to process in parallel a predetermined set of the analog outputs. Each channel of the HDD can include an AFE for conditioning a signal representing one sensor analog output, an ADC for converting a conditioned signal into a digital signal, and a data formatting block for calibrations and formatting the digital signal for transport to an off-chip device. The HDDs and drive electronics are combined with the image sensor into one package to optimize signal integrity and high dynamic range, and to achieve high data rates through use of synchronized HDD channels. Combining multiple modules results in a highly scalable imaging subsystem optimized for inspection and metrology applications.

    Abstract translation: 用于高速图像处理的模块包括用于产生表示图像的多个模拟输出的图像传感器和用于同时处理多个模拟输出的多个HDD。 每个HDD是被配置为并行处理预定的一组模拟输出的集成电路。 HDD的每个通道可以包括用于调节表示一个传感器模拟输出的信号的AFE,用于将经调节的信号转换成数字信号的ADC,以及用于校准和格式化数字信号以传送到芯片外的数据格式化块 设备。 HDD和驱动电子设备与图像传感器组合成一个封装,以优化信号完整性和高动态范围,并通过使用同步的HDD通道实现高数据速率。 组合多个模块可实现高度可扩展的成像子系统,以优化检测和计量应用。

    EUV high throughput inspection system for defect detection on patterned EUV masks, mask blanks, and wafers
    45.
    发明授权
    EUV high throughput inspection system for defect detection on patterned EUV masks, mask blanks, and wafers 有权
    EUV高通量检测系统,用于在图案化的EUV掩模,掩模毛坯和晶片上进行缺陷检测

    公开(公告)号:US08692986B2

    公开(公告)日:2014-04-08

    申请号:US14014142

    申请日:2013-08-29

    Abstract: Inspection of EUV patterned masks, blank masks, and patterned wafers generated by EUV patterned masks requires high magnification and a large field of view at the image plane. An EUV inspection system can include a light source directed to an inspected surface, a detector for detecting light deflected from the inspected surface, and an optic configuration for directing the light from the inspected surface to the detector. In particular, the detector can include a plurality of sensor modules. Additionally, the optic configuration can include a plurality of mirrors that provide magnification of at least 100× within an optical path less than 5 meters long. In one embodiment, the optical path is approximately 2-3 meters long.

    Abstract translation: 对EUV图案化掩模,空白掩模和由EUV图案化掩模生成的图案化晶片的检查需要高倍率和在图像平面上的大视场。 EUV检查系统可以包括指向检查表面的光源,用于检测从被检查表面偏转的光的检测器和用于将来自被检查表面的光引导到检测器的光学配置。 特别地,检测器可以包括多个传感器模块。 另外,光学配置可以包括在小于5米长的光路内提供至少100倍的放大倍数的多个反射镜。 在一个实施例中,光路大约2-3米长。

    Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors

    公开(公告)号:US10197501B2

    公开(公告)日:2019-02-05

    申请号:US13710315

    申请日:2012-12-10

    Abstract: A focusing EBCCD includes a control device positioned between a photocathode and a CCD. The control device has a plurality of holes therein, wherein the plurality of holes are formed perpendicular to a surface of the photocathode, and wherein a pattern of the plurality of holes is aligned with a pattern of pixels in the CCD. Each hole is surrounded by at least one first electrode, which is formed on a surface of the control device facing the photocathode. The control device may include a plurality of ridges between the holes. The control device may be separated from the photocathode by approximately half a shorter dimension of a CCD pixel or less. A plurality of first electrodes may be provided, wherein each first electrode surrounds a given hole and is separated from the given hole by a gap.

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