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41.发明申请公开(公告)号：US20250167750A1
公开(公告)日：2025-05-22
申请号：US18944067
申请日：2024-11-12
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Marianne Berolini , Jonathan Herr
Abstract: Filters, filter assemblies, and methods of forming filters are provided. For example, a filter includes a plurality of dielectric layers stacked in a Z-direction to form a substrate having a top and a bottom, and at least one conductive layer is formed over a dielectric layer. The conductive layer is positioned at a location along the Z-direction between the top and bottom of the substrate that is about 200 μm or less from the bottom of the substrate. An assembly includes the filter attached to a device substrate. A method of forming the filter includes forming the dielectric layers and the at least one conductive layer, such as by forming the conductive layer over a dielectric layer, and stacking the plurality of layers to form a substrate with the conductive layer disposed about 200 μm or less from a bottom of the substrate.
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42.发明申请公开(公告)号：US20250106979A1
公开(公告)日：2025-03-27
申请号：US18973212
申请日：2024-12-09
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Jeff Borgman , Marianne Berolini
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.
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公开(公告)号：US20250079404A1
公开(公告)日：2025-03-06
申请号：US18805594
申请日：2024-08-15
Applicant: KYOCERA AVX Components Corporation
Inventor： Jonathan Herr , Cory Nelson , Marianne Berolini , Joseph Hock
IPC: H01L25/065 , H01L23/48 , H01L23/538 , H01L25/00
Abstract: A vertical component stack, assembly, and method are provided. For example, a vertical component stack may include a plurality of components that each include an upper surface and a lower surface opposite the upper surface along a vertical direction. The plurality of components are stacked along the vertical direction such that a lower surface of a second component of the plurality of components is disposed over an upper surface of a first component of the plurality of components. An input and an output of each component of the plurality of components is exposed on a lower surface of the first component of the plurality of components.
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公开(公告)号：US20250022638A1
公开(公告)日：2025-01-16
申请号：US18895475
申请日：2024-09-25
Applicant: KYOCERA AVX Components Corporation
Inventor： Palaniappan Ravindranathan , Marianne Berolini , Michael W. Kirk
Abstract: A varistor can include a monolithic body including a plurality of dielectric layers stacked in a Z-direction that is perpendicular to a longitudinal direction. The monolithic body can have a first end and a second end that is spaced apart from the first end in the longitudinal direction. A first external terminal can be disposed along the first end. A second external terminal can be disposed along the second end. A first plurality of electrodes can be connected with the first external terminal and can extend from the first end towards the second end of the monolithic body. A second plurality of electrodes can be connected with the second external terminal and can extend from the second end towards the first end of the monolithic body. At least one of the first external terminal or the second external terminal can include a conductive polymeric composition.
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公开(公告)号：US12051548B2
公开(公告)日：2024-07-30
申请号：US18194675
申请日：2023-04-03
Applicant: KYOCERA AVX Components Corporation
Inventor： Michael W. Kirk , Marianne Berolini
CPC classification number: H01G4/38 , H01G4/12 , H01G4/40 , H01L27/0805 , H01L28/60
Abstract: A low inductance component may include a multilayer, monolithic device including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The lead(s) may be coupled with the first active termination, second active termination, and/or the at least one ground termination. The lead(s) may have respective length(s) and maximum width(s). A ratio of the length(s) to the respective maximum width(s) of the lead(s) may be less than about 20.
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Patent Agency Ranking
公开(公告)号：US20240249880A1
公开(公告)日：2024-07-25
申请号：US18408647
申请日：2024-01-10
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Jeffrey Horn , Marianne Berolini
Abstract: Multilayer capacitors are provided. For example, a multilayer capacitor may include first and second terminals adjacent first and second opposing end surfaces, respectively, and a plurality of active electrode layers, each active electrode layer including a first active electrode electrically connected with the first terminal and a second active electrode electrically connected with the second terminal. The first active electrode may be spaced apart from the second active electrode in a lengthwise direction to form an active electrode end gap. The multilayer capacitor also may include a plurality of floating electrode layers, including topmost and bottommost floating electrode layers. The plurality of active electrode layers may be an odd number such that a topmost active electrode layer is disposed between the topmost floating electrode layer and a top surface and a bottommost active electrode layer is disposed between the bottommost floating electrode layer and a bottom surface.
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公开(公告)号：US12033775B2
公开(公告)日：2024-07-09
申请号：US17692284
申请日：2022-03-11
Applicant: KYOCERA AVX Components Corporation
Inventor： Michael W. Kirk , Marianne Berolini , Palaniappan Ravindranathan
Abstract: A varistor array can include a monolithic body including a plurality of dielectric layers. A first varistor can be formed in the monolithic body. The first varistor can include a first external terminal on a first end of the monolithic body, a first plurality of electrodes connected with the first external terminal, a second external terminal on a second end of the monolithic body, and a second plurality of electrodes connected with the second external terminal. The second plurality of electrodes can be interleaved with the first plurality of electrodes and can overlap the first plurality of electrodes at an overlapping area that is insensitive to a relative misalignment between the first plurality of electrodes and the second plurality of electrodes when the misalignment is less than a threshold. A second varistor can be formed in the monolithic body that is distinct from the first varistor.
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公开(公告)号：US11887784B2
公开(公告)日：2024-01-30
申请号：US17557114
申请日：2021-12-21
Applicant: KYOCERA AVX Components Corporation
Inventor： Marianne Berolini , Jeffrey A. Horn , Richad C. VanAlstine
Abstract: The present invention is directed to a multilayer ceramic capacitor. A plurality of active electrodes may be arranged within a monolithic body of the capacitor and parallel with a longitudinal direction. A first shield electrode may be arranged within the monolithic body and parallel with the longitudinal direction. The first shield electrode may be connected with a first external terminal. The first shield electrode may have a first longitudinal edge and a second longitudinal edge that are each aligned with the lateral direction and face away from the first external terminal. The second longitudinal edge may be offset in the longitudinal direction from the first longitudinal edge by a shield electrode offset distance. A second shield electrode may be connected with a second external terminal. The second shield electrode may be approximately aligned with the first shield electrode in the Z-direction.
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公开(公告)号：US11664169B2
公开(公告)日：2023-05-30
申请号：US17830460
申请日：2022-06-02
Applicant: KYOCERA AVX Components Corporation
Inventor： Marianne Berolini , Jeffrey A. Horn , Richard C. VanAlstine
CPC classification number: H01G4/302 , H01G2/065 , H01G4/012 , H01G4/1227 , H01G4/2325
Abstract: A multilayer capacitor may include a monolithic body including a plurality of dielectric layers. A first external terminal may be disposed along a first end, and a second external terminal may be disposed along a second end of the capacitor. The external terminals may include respective bottom portions that extend along a bottom surface of the capacitor. The bottom portions of the external terminals may be spaced apart by a bottom external terminal spacing distance. A bottom shield electrode may be arranged within the monolithic body between a plurality of active electrodes and the bottom surface of the capacitor. The bottom shield electrode may be spaced apart from the bottom surface of the capacitor by a bottom-shield-to-bottom distance that may range from about 3 microns to about 100 microns. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be less than about 4.
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50.发明申请公开(公告)号：US20220418081A1
公开(公告)日：2022-12-29
申请号：US17849841
申请日：2022-06-27
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Jeff Borgman , Marianne Berolini
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.
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