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公开(公告)号：US10115951B2
公开(公告)日：2018-10-30
申请号：US14435779
申请日：2013-11-18
Applicant: LG Chem, Ltd.
Inventor： Ji Young Hwang , Byung Kyu Jung , Yoon Tae Hwang , Se Woo Yang , Suk Ky Chang , Sung Jong Kim , Min Soo Park , Cha Hun Ku
IPC: H01M6/02 , H01M2/14 , H01M10/0569 , C09J7/22 , C09J7/38 , H01M2/16 , C09J7/40 , H01M6/16 , H01M10/04 , H01M10/0587
Abstract: The present application relates to a swelling tape and a method of filling a gap. The swelling tape is, for example, applied in gaps in which a fluid is present and deformed into a three-dimensional shape to fill the gaps and fix in place objects separated by gaps as needed.
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公开(公告)号：US10103353B2
公开(公告)日：2018-10-16
申请号：US15129349
申请日：2015-03-27
Applicant: LG CHEM, LTD.
Inventor： Yoon Gyung Cho , Hyun Jee Yoo , Kyung Yul Bae , Suk Ky Chang , Jung Hyoung Lee , Jun Rye Choi
Abstract: The present application relates to an encapsulation film and an organic electronic device including the encapsulation film, and provides an encapsulation film and an organic electronic device which effectively prevents the penetration of moisture or oxygen from the outside into the organic electronic device and also achieves the light diffusion and extraction effects.
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公开(公告)号：US09966562B2
公开(公告)日：2018-05-08
申请号：US14263677
申请日：2014-04-28
Applicant: LG CHEM, LTD.
Inventor： Yoon Gyung Cho , Hyun Jee Yoo , Jung Sup Shim , Suk Ky Chang
IPC: H01L51/52 , C09J133/06 , C09J133/12 , C09J133/14 , C09J163/00 , C09J175/04 , C08G18/62 , C08G18/76 , C08G18/00 , C09J7/00 , C08G59/68
CPC classification number: H01L51/5253 , C08G18/003 , C08G18/6229 , C08G18/7642 , C08G59/68 , C08G2170/40 , C08L33/06 , C09J7/00 , C09J7/10 , C09J133/066 , C09J133/12 , C09J133/14 , C09J163/00 , C09J175/04 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2433/006 , C09J2463/00 , C09J2463/006 , H01L51/5246 , H01L51/5259 , C08F220/14 , C08F2220/1875 , C08F220/20
Abstract: Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, an organic electronic device having an encapsulant including a photocured product of the composition using a curable pressure-sensitive adhesive film which is a film-state product including the composition, and a method for manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, due to the method including laminating a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator to an top substrate, and radiating light to an entire surface of the curable pressure-sensitive adhesive layer to perform photocuring, and laminating the photocured curable pressure-sensitive adhesive layer to a bottom substrate on which an organic light emitting element is formed to cover an entire surface of the organic light emitting element, mechanical strength and a simple process caused by photocuring to the organic light emitting element without direct light irradiation may be achieved, and a lifespan of the element may be increased.
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公开(公告)号：US09802294B2
公开(公告)日：2017-10-31
申请号：US14311662
申请日：2014-06-23
Applicant: LG CHEM, LTD.
Inventor： Se Woo Yang , Suk Ky Chang , Min Soo Park
CPC classification number: B24D3/002 , B24B13/0018 , B24B37/042 , B24B37/20 , B24B37/24 , C09J7/20 , C09J7/385 , C09J133/08 , C09J2201/134 , C09J2201/606 , C09J2201/622 , C09J2203/318 , C09J2433/00 , G02F2202/28 , Y10T428/2848 , C08F220/18 , C08F2220/1891 , C08F220/06 , C08F220/20
Abstract: Provided are a pressure-sensitive adhesive tape, a polishing pad, a method of manufacturing the same, a polishing device and a method of manufacturing a glass substrate. The illustrative pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape for a polishing material. The pressure-sensitive adhesive tape may be effectively fixed to a surface plate without bubbles, and have excellent resistance to water and a polishing solution and shear strength applied in a polishing process. In addition, the pressure-sensitive adhesive tape may be easily removed from a carrier or surface plate for a polishing pad without residues after polishing.
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公开(公告)号：US09391293B2
公开(公告)日：2016-07-12
申请号：US14142347
申请日：2013-12-27
Applicant: LG CHEM, LTD.
Inventor： Yoon Gyung Cho , Hyun Jee Yoo , Seung Min Lee , Suk Ky Chang , Jung Sup Shim
CPC classification number: H01L51/5246 , C08K3/013 , C08K3/22 , C08K3/24 , C08K3/32 , C08K2003/2227 , C09J7/00 , C09J7/10 , C09J7/35 , C09J11/00 , C09J2201/134 , C09J2201/36 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L51/524 , H01L51/5253 , H01L51/5259 , Y10T428/24942 , Y10T428/24959
Abstract: An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process.
Abstract translation: 提供了用于封装有机电子二极管（OED）的粘合膜。 当封装有机电子二极管时，粘合膜可有效地防止湿气渗透到有机电子二极管的封装结构中，并且在适度条件下有效地执行封装工艺，而不会在封装过程中对有机电子二极管造成损害 。
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Patent Agency Ranking
公开(公告)号：US09343696B2
公开(公告)日：2016-05-17
申请号：US14337990
申请日：2014-07-22
Applicant: LG CHEM, LTD.
Inventor： Hyun Jee Yoo , Suk Ky Chang , Seung Min Lee
CPC classification number: H01L51/5246 , C08K5/0025 , C09J7/00 , C09J7/10 , C09J7/20 , C09J7/22 , C09J7/35 , C09J2201/128 , C09J2201/40 , C09J2203/322 , C09J2205/102 , C09J2400/163 , H01L51/5237 , H01L51/5253 , H01L51/5259 , H01L2251/566 , Y10T156/1052 , Y10T428/1471 , Y10T428/26 , Y10T428/2835 , Y10T428/2848
Abstract: An adhesive film, a method for preparing an adhesive film, and an organic electronic device are provided. According to the adhesive film in exemplary embodiments of the present invention, fluidity of an adhesive can be controlled in the case of applying the adhesive between objects to be subsequently adhered to each other and then thermal-compressing by including an adhesive layer with cured side faces contacting with the outside. The adhesive film is used, for example for assembling a panel and the like, and thereby a defect rate at the time of assembling a panel and the like can be reduced and excellent work characteristics can be provided. In addition, before being applied to a panel or the like, a moisture absorbent included inside an adhesive layer of an adhesive film can be protected from external moisture or the like, thereby being easily stored, and also when it is applied to a product, reliability of life span, and the like can be secured.
Abstract translation: 提供粘合膜，制备粘合膜的方法和有机电子器件。 根据本发明的示例性实施方案中的粘合剂膜，在将粘合剂彼此粘合的物体之间施加粘合剂的情况下可以控制粘合剂的流动性，然后通过包括具有固化侧面的粘合剂层进行热压缩 与外界接触。 使用粘合膜，例如用于组装面板等，从而可以减少组装面板等时的缺陷率，并且可以提供优异的工作特性。 此外，在涂布到面板等之前，可以防止包含在粘合剂膜的粘合剂层内的吸湿剂免受外部湿气等的影响，从而容易地储存，并且当将其应用于产品时， 寿命的可靠性等可以确保。
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公开(公告)号：US08816025B2
公开(公告)日：2014-08-26
申请号：US13897973
申请日：2013-05-20
Applicant: LG Chem, Ltd.
Inventor： Jong Rok Jeon , Se Woo Yang , Suk Ky Chang
IPC: C08F2/38 , C08F2/00 , C08F20/06 , C08F118/02 , C08F283/00 , C08L31/00
CPC classification number: C09J133/08 , C08K5/053 , C08K5/13 , C08K5/1545 , C08L2312/00 , C09J133/066 , C08F2220/1825 , C08F220/06 , C08F2220/1875 , C08F220/20
Abstract: There is provided a pressure sensitive adhesive composition and a pressure sensitive adhesive. A pressure sensitive adhesive composition example of the present application can provide a pressure sensitive adhesive having, for example, a high shear resistance together with an excellent peeling property or tacking property with respect to an attachment target surface.
Abstract translation: 提供压敏粘合剂组合物和压敏粘合剂。 本申请的压敏粘合剂组合物实施例可以提供具有例如高抗剪切性以及相对于附着目标表面的优异的剥离性或粘合性的压敏粘合剂。
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公开(公告)号：US11370942B2
公开(公告)日：2022-06-28
申请号：US16547344
申请日：2019-08-21
Applicant: LG CHEM, LTD.
Inventor： Yoon Gyung Cho , Hyun Jee Yoo , Kyung Yul Bae , Suk Ky Chang , Jung Sup Shim
Abstract: The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.
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公开(公告)号：US10522786B2
公开(公告)日：2019-12-31
申请号：US16125244
申请日：2018-09-07
Applicant: LG CHEM, LTD.
Inventor： Hyun Jee Yoo , Seung Min Lee , Hyun Suk Kim , Suk Ky Chang , Jung Ok Moon
Abstract: Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.
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公开(公告)号：US20190382632A1
公开(公告)日：2019-12-19
申请号：US16547344
申请日：2019-08-21
Applicant: LG CHEM, LTD.
Inventor： Yoon Gyung CHO , Hyun Jee Yoo , Kyung Yul Bae , Suk Ky Chang , Jung Sup Shim
IPC: C09J123/20 , C08K3/34 , H01L51/00
Abstract: The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.
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