摘要:
A structure and method of forming a fully planarized polymer thin-film transistor by using a first planar carrier to process a first portion of the device including gate, source, drain and body elements. Preferably, the thin-film transistors made with all organic materials. The gate dielectric can be a high-k polymer to boost the device performance. Then, the partially-finished device structures are flipped upside-down and transferred to a second planar carrier. A layer of wax or photo-sensitive organic material is then applied, and can be used as the temporary glue. The device, including its body area, is then defined by an etching process. Contacts to the devices are formed by conductive material deposition and chemical-mechanical polish.
摘要:
A micromachined electromechanical random access memory (MEMRAM) array is disclosed which includes a plurality of MEM memory cells, where each MEM memory cell has an MEM switch and a capacitor. The MEM switch includes a contact portion configured for moving from a first position to a second position for reading out a charge stored within the capacitor or for writing the charge to the capacitor. A method is also disclosed for fabricating each MEM memory cell of the MEMRAM array.
摘要:
Thermal cooling structures of diamond or diamond-like materials are provided for conducting heat away from semiconductor devices. A first silicon-on-insulator embodiment comprises a plurality of thermal paths, formed after shallow trench and device fabrication steps are completed, which extend through the buried oxide and provide heat dissipation through to the underlying bulk silicon substrate. The thermal conduction path material is preferably diamond which has high thermal conductivity with low electrical conductivity. A second diamond trench cooling structure, formed after device fabrication has been completed, comprises diamond shallow trenches disposed between the devices and extending through the buried oxide layer. An alternative diamond thermal cooling structure includes a diamond insulation layer deposited over the semiconductor devices in either an SOI or bulk silicon structure. Yet another embodiment comprises diamond sidewalls formed along the device walls in thermal contact with the device junctions to provide heat dissipation through the device junctions to underlying cooling structures. It is also proposed that the foregoing structures, and combinations of the foregoing structures, could be used in conjunction with other known cooling schemes.
摘要:
A power management circuit for an SRAM system including one or more isolated memory arrays and implementing a power source including a local power supply associated with each memory array and an external power supply connected to local supplies during an active mode of operation. The power management circuit comprises: a switch mechanism for disconnecting the external power supply to each of local power supply during a low power mode of operation; and, a refresh timing circuit implementing memory array refresh operation by selectively connecting the external power supply to a respective local power supply during the low power mode. During the low power mode, the refresh circuit intentionally enables the local power supply to float and allow it to drift to a lower predetermined voltage level prior to the memory array refresh operation.
摘要:
A complete solution to block noise from eDRAM macro to the analog core, and vice verse, in a system-on-chip IC design. Specifically, there is provided a first isolated triple well structure formed in the IC for reducing noise component resulting from operative elements of a DC generator circuit fabricated therein; and, a second isolated triple well structure formed in the IC for reducing noise component resulting from operative elements of a noise sense amplifier bank and DRAM arrays fabricated therein. A power supply source is provided for supplying power to each DC generator circuit, noise sense amplifier bank and DRAM array; as is a power bus for providing power and a separate power bus for providing a ground to each of the DC generator circuit, and the noise sense amplifier circuit and DRAM array components. In this manner, noise contamination with noise sensitive devices in said IC is reduced and, further noise contamination of the DRAM array as sourced from the IC is reduced.
摘要:
A content addressable memory (“CAM”) system includes a plurality of segments arranged in an array, wherein each of the plurality of segments includes a plurality of CAM cells, each of the plurality of CAM cells includes a wordline, a matchline and a sinkline, the wordline being shared by all of the cells in the same row, the matchline and sinkline being shared by all of the cells in the same segment; and a corresponding method of searching within a CAM system includes providing an input word to the CAM system, comparing a portion of the input word in a segment of the CAM system, and propagating a mismatch to obviate the need for comparison in other segments of the CAM system.
摘要:
A hybrid substrate, i.e., a substrate fabricated from different materials, and method for fabricating the same are presented. The hybrid substrate is configured for fabricating more than two different devices thereon, has a high thermal conductivity, and is configured for patterning interconnects thereon for interconnecting the different devices fabricated on the hybrid substrate.
摘要:
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.
摘要:
A hybrid substrate, i.e., a substrate fabricated from different materials, and method for fabricating the same are presented. The hybrid substrate is configured for fabricating more than two different devices thereon, has a high thermal conductivity, and is configured for patterning interconnects thereon for interconnecting the different devices fabricated on the hybrid substrate.
摘要:
A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.