摘要:
An array of grooves (23) is formed in a first side (12) of a wafer (10) during a wafer processing method. A back grinding tape (16) is adhered to the first side. An amount of material is removed from the second side (20) of the wafer. An adhesive layer (30) is applied to the second side. Dicing tape (24) is applied to the adhesive layer to create a first wafer assembly (32). The first wafer assembly is supported on a support surface (34) with the dicing tape facing the support surface and the back grinding tape exposed. The back grinding tape is removed and the adhesive layer is severed through the array of grooves to create individually removable die (28).
摘要:
Disclosed is a method for decoding an image block. The method comprises a step of decoding an image block of a first layer based on a corresponding block of a second layer encoded with an intra mode, wherein a first area is formed with pixels, which are adjacent to a corner pixel positioned in the corresponding block in a diagonal direction and extend in vertical and horizontal directions away from the corresponding block, and data are padded in the first area based on the corner pixel and the pixels positioned in the first area and at least one of first and second blocks, which are simultaneously adjacent to the corresponding block and encoded with the intra mode. Accordingly, a reference block required when a macro block is encoded in an intra base mode or when a macro block encoded in the intra base mode is decoded has more precise values, thereby enabling improvement of a coding efficiency.
摘要:
A method for coding vector refinement information required to use motion vectors in base layer pictures when encoding a video signal and a method for decoding video data using the coded vector refinement information are provided. A value for vector refinement information of an image block present in a frame in an enhanced layer, which represents the difference between a position pointed to by a motion vector of the image block and a position pointed to by a scaled motion vector obtained by scaling a motion vector of a corresponding block in a temporally coincident frame in a bitstream of the base layer by half of the ratio of the enhanced layer picture size to the base layer picture size, is selected from 8 values allocated to 8 quarter-pixels surrounding the position pointed to by the scaled motion vector, and the vector refinement information having the selected value is recorded.
摘要:
A method for encoding video signals by inverse motion compensated temporal filtering where video frames of a base layer are used to encode video frames of an enhanced layer into predicted images. For each image block in an arbitrary frame in an enhanced layer frame sequence, an area including a block, which is present in a base layer frame temporally coincident with the arbitrary frame and is at the same position as the image block, is enlarged according to the ratio between screen sizes of the two layers. A reference block most highly correlated with the image block is searched for in the enlarged area in the temporally coincident base layer frame through motion estimation and is used to obtain pixel difference values and a motion vector of the image block for encoding the image block into a predicted image, thereby improving coding efficiency.
摘要:
The present invention provides systems and methods for mixing precursors such that a mixture of precursors are present together in a chamber during a single pulse step in an atomic layer deposition (ALD) process to form a multi-component film. The precursors are comprised of at least one different chemical component, and such different components will form a mono-layer to produce a multi-component film. In a further aspect of the present invention, a dielectric film having a composition gradient is provided.
摘要:
An array of grooves (23) is formed in a first side (12) of a wafer (10) during a wafer processing method. A back grinding tape (16) is adhered to the first side. An amount of material is removed from the second side (20) of the wafer. An adhesive layer (30) is applied to the second side. Dicing tape (24) is applied to the adhesive layer to create a first wafer assembly (32). The first wafer assembly is supported on a support surface (34) with the dicing tape facing the support surface and the back grinding tape exposed. The back grinding tape is removed and the adhesive layer is severed through the array of grooves to create individually removable die (28).
摘要:
The present invention relates to a method of providing a routing protocol in a sensor network. The routing protocol is a new model which is made considering a battery efficiency so that an AODV protocol, which is widely used because of its simplified and reliable algorithm, can be matched to a sensor condition. An energy information of a node is contained in the RREQ message of the AODV, thereby allowing the neighboring nodes and the nodes on the path to know their energy states. The method of providing a routing protocol in a sensor network includes the steps of: initializing a routing table and searching a network device of a node to initialize a host; opening a socket when there is a request for forwarding of an IP (Internet Protocol) packet from an upper layer or when there is a request through the network device; determining whether there is the IP packet forwarding request of the upper layer node or whether the packet is received from the network device; if there is the IP packet forwarding request of the upper layer, searching the routing table, and determining whether or not there is a destination node which intends to transmit the packet, and returning to a main loop if there is the destination node; and if the packet is received through the network device, determining types of the received packets and performing RREQ process, IDLE process, RREP process, RERR process, and RREP_ACK process.
摘要:
Disclosed is an LED (Light Emitting Diode) lamp including a light emitting diode having first and second electrodes; a first lead frame, provided with a cup portion formed at one end thereof and a first lead portion extended from the cup portion to the other end thereof, and electrically connected to the first electrode; a second lead frame, provided with a diode connecting portion adjacent to the cup portion and a second lead portion adjacent to the first lead portion, spaced from the first lead, and electrically connected to the second electrode; a mold for sealing the light emitting diode, the cup and diode connecting portion; and a heat dissipating portion, having a designated area, formed on at least one selected from the group consisting of a lower portion of the cup portion, a lower portion of the diode connecting portion, the first lead portion and the second lead portion.
摘要:
The present invention is an Emergency Response Center (ERC) which provides a variety of emergency and information functions in public environments. The ERC operates in a number of modes, including Information Mode, Emergency Response Mode, Security Mode, and Surveillance Mode. The Emergency Response Center functions are software selectable on a large video touch screen. A video screen displays emergency information to users and allows videoconferencing with various authorities as well as any individuals that own the account and apparatus. News, maps, weather, store directories, and other non-emergency information are also displayed by the ERC. The ERC can conduct surveillance of passersby using video cameras configured to stream and record the area in the vicinity of the ERC. The ERC can also scan employee IDs, capture employee facial images, and register employee data in the ERC database. An ERC server allows remote administration of the ERC.
摘要:
A semiconductor device and a method of manufacturing the same capable of preventing a not open fail of a landing plug contact caused by the leaning of a gate. The method includes the steps of preparing a semiconductor substrate, forming first recesses by etching an active area of the semiconductor substrate, filling a conductive layer in the first recesses, forming a second recess by etching a predetermined part of the active area, forming under stepped gates, forming a gate insulating layer on a surface of the semiconductor substrate, forming a channel layer on the gate insulating layer, forming source/drain areas in the semiconductor substrate, forming an interlayer insulating film on an entire surface of the semiconductor substrate, and forming a landing plug in the interlayer insulating film such that the landing plug makes contact with the source/drain areas, respectively.