Electrostatic RF MEMS switches
    41.
    发明申请
    Electrostatic RF MEMS switches 有权
    静电RF MEMS开关

    公开(公告)号:US20050040486A1

    公开(公告)日:2005-02-24

    申请号:US10951612

    申请日:2004-09-29

    摘要: A micro switch having a dielectric layer having a movement region formed on a substrate, a conductive layer formed on a predetermined portion of the movement region, a dielectric film formed on the conductive layer, first and second electric conductors formed a predetermined distance above the dielectric film, one or two lower electrodes formed on the movement region, and one or two upper electrodes formed a predetermined distance above the two lower electrodes, the one or two upper electrodes moving the conductive layer and the dielectric film upwards when an electrostatic force occurs between the upper and lower electrodes, and capacitively coupled with the first and second electric conductors to allow a current to flow between the first and second electric conductors. Such a micro switch has a high on/off ratio and isolation degree and a simple structure, and can be fabricated in a very easy process.

    摘要翻译: 一种具有介电层的微型开关,具有形成在基板上的移动区域,形成在所述移动区域的预定部分上的导电层,形成在所述导电层上的电介质膜,在所述电介质上形成预定距离的第一和第二导电体 膜,形成在移动区域上的一个或两个下电极,以及在两个下电极之上形成预定距离的一个或两个上电极,一个或两个上电极在静电力发生时向上移动导电层和电介质膜 上电极和下电极,并且与第一和第二电导体电容耦合以允许电流在第一和第二电导体之间流动。 这种微型开关具有高的开/关比和隔离度和简单的结构,并且可以在非常容易的过程中制造。

    MEMS RF-switch using semiconductor
    44.
    发明申请
    MEMS RF-switch using semiconductor 失效
    使用半导体的MEMS射频开关

    公开(公告)号:US20060012940A1

    公开(公告)日:2006-01-19

    申请号:US11179460

    申请日:2005-07-13

    IPC分类号: H01L21/683

    CPC分类号: H01H59/0009 H01H2059/0018

    摘要: A MEMS RF-switch is provided for controlling switching on/off of transmission of AC signals. The MEMS RF-switch of the present invention includes: a first electrode coupled to one terminal of the power source; a semiconductor layer combined with an upper surface of the first electrode, and forming a potential barrier to become insulated when a bias signal is applied from the power source; and a second electrode disposed at a predetermined distance away from the semiconductor layer, and being coupled to the other terminal of the power source, wherein the second electrode contacts the semiconductor layer when a bias signal is applied from the power source. Therefore, although the bias signal may not be cut off, free electrons and holes are recombined in the semiconductor layer, whereby charge buildup and sticking can be prevented.

    摘要翻译: 提供了用于控制AC信号的传输的接通/断开的MEMS RF开关。 本发明的MEMS RF开关包括:耦合到电源的一个端子的第一电极; 与所述第一电极的上表面组合的半导体层,并且当从所述电源施加偏置信号时,形成电位势垒以变得绝缘; 以及第二电极,设置在距离半导体层预定距离处,并且耦合到电源的另一个端子,其中当从电源施加偏置信号时,第二电极接触半导体层。 因此,尽管偏置信号可能不会被切断,但自由电子和空穴在半导体层中重新结合,从而可以防止电荷积累和粘附。

    MEMS RF-SWITCH USING SEMICONDUCTOR
    45.
    发明申请

    公开(公告)号:US20100133077A1

    公开(公告)日:2010-06-03

    申请号:US12697629

    申请日:2010-02-01

    IPC分类号: H01H59/00

    CPC分类号: H01H59/0009 H01H2059/0018

    摘要: A MEMS RF-switch is provided for controlling switching on/off of transmission of AC signals. The MEMS RF-switch of the present invention includes: a first electrode coupled to one terminal of the power source; a semiconductor layer combined with an upper surface of the first electrode, and forming a potential barrier to become insulated when a bias signal is applied from the power source; and a second electrode disposed at a predetermined distance away from the semiconductor layer, and being coupled to the other terminal of the power source, wherein the second electrode contacts the semiconductor layer when a bias signal is applied from the power source. Therefore, although the bias signal may not be cut off, free electrons and holes are recombined in the semiconductor layer, whereby charge buildup and sticking can be prevented.

    摘要翻译: 提供了用于控制AC信号的传输的接通/断开的MEMS RF开关。 本发明的MEMS RF开关包括:耦合到电源的一个端子的第一电极; 与所述第一电极的上表面组合的半导体层,并且当从所述电源施加偏置信号时,形成电位势垒以变得绝缘; 以及第二电极,设置在距离半导体层预定距离处,并且耦合到电源的另一个端子,其中当从电源施加偏置信号时,第二电极接触半导体层。 因此,尽管偏置信号可能不会被切断,但自由电子和空穴在半导体层中重新结合,从而可以防止电荷积累和粘附。

    METHOD OF MANUFACTURING FILM BULK ACOUSTIC RESONATOR USING INTERNAL STRESS OF METALLIC FILM AND RESONATOR MANUFACTURED THEREBY
    46.
    发明申请
    METHOD OF MANUFACTURING FILM BULK ACOUSTIC RESONATOR USING INTERNAL STRESS OF METALLIC FILM AND RESONATOR MANUFACTURED THEREBY 有权
    使用金属膜内部应力和制造的谐振器制造薄膜泡沫谐振器的方法

    公开(公告)号:US20100132174A1

    公开(公告)日:2010-06-03

    申请号:US12684454

    申请日:2010-01-08

    IPC分类号: H01L41/22

    摘要: A method of manufacturing a film bulk acoustic resonator and the resonator manufactured thereby. The method includes the laminating a sacrificial layer on a semiconductor substrate, removing a predetermined area from the sacrificial layer to realize electric contact between a signal line of the semiconductor substrate and a lower electrode, forming the lower electrode by depositing metal film for lower electrode on the sacrificial layer, by patterning based on a shape of the sacrificial layer, forming a piezoelectric layer by depositing a piezoelectric material on the lower electrode and by patterning based on a shape of the lower electrode, and forming an upper electrode by depositing metal film on the piezoelectric layer and by patterning based on a shape of the piezoelectric layer, wherein at least one of a deposition pressure and a deposition power is controlled to generate upward stress when depositing the metal film for the lower electrode.

    摘要翻译: 一种制造薄膜体声波谐振器的方法和由此制造的谐振器。 该方法包括在半导体衬底上层叠牺牲层,从牺牲层去除预定区域以实现半导体衬底的信号线与下电极之间的电接触,通过在下电极上沉积金属膜形成下电极 牺牲层,通过基于牺牲层的形状进行图案化,通过在下电极上沉积压电材料并基于下电极的形状进行图案化形成压电层,并且通过将金属膜沉积在上而形成上电极 压电层和基于压电层的形状的图案化,其中当沉积用于下电极的金属膜时,沉积压力和沉积功率中的至少一个被控制以产生向上的应力。

    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby
    47.
    发明授权
    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby 有权
    使用金属膜的内部应力和由此制造的谐振器制造膜体声波谐振器的方法

    公开(公告)号:US07671427B2

    公开(公告)日:2010-03-02

    申请号:US10838326

    申请日:2004-05-05

    IPC分类号: H01L47/00

    摘要: A method of manufacturing a film bulk acoustic resonator and the resonator manufactured thereby. The method includes the laminating a sacrificial layer on a semiconductor substrate, removing a predetermined area from the sacrificial layer to realize electric contact between a signal line of the semiconductor substrate and a lower electrode, forming the lower electrode by depositing metal film for lower electrode on the sacrificial layer, by patterning based on a shape of the sacrificial layer, forming a piezoelectric layer by depositing a piezoelectric material on the lower electrode and by patterning based on a shape of the lower electrode, and forming an upper electrode by depositing metal film on the piezoelectric layer and by patterning based on a shape of the piezoelectric layer, wherein at least one of a deposition pressure and a deposition power is controlled to generate upward stress when depositing the metal film for the lower electrode.

    摘要翻译: 一种制造薄膜体声波谐振器的方法和由此制造的谐振器。 该方法包括在半导体衬底上层叠牺牲层,从牺牲层去除预定区域以实现半导体衬底的信号线与下电极之间的电接触,通过在下电极上沉积金属膜形成下电极 牺牲层,通过基于牺牲层的形状进行图案化,通过在下电极上沉积压电材料并基于下电极的形状进行图案化形成压电层,并且通过将金属膜沉积在上而形成上电极 压电层和基于压电层的形状的图案化,其中当沉积用于下电极的金属膜时,沉积压力和沉积功率中的至少一个被控制以产生向上的应力。

    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby
    48.
    发明授权
    Method of manufacturing film bulk acoustic resonator using internal stress of metallic film and resonator manufactured thereby 有权
    使用金属膜的内部应力和由此制造的谐振器制造膜体声波谐振器的方法

    公开(公告)号:US07939356B2

    公开(公告)日:2011-05-10

    申请号:US12684454

    申请日:2010-01-08

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a film bulk acoustic resonator and the resonator manufactured thereby. The method includes the laminating a sacrificial layer on a semiconductor substrate, removing a predetermined area from the sacrificial layer to realize electric contact between a signal line of the semiconductor substrate and a lower electrode, forming the lower electrode by depositing metal film for lower electrode on the sacrificial layer, by patterning based on a shape of the sacrificial layer, forming a piezoelectric layer by depositing a piezoelectric material on the lower electrode and by patterning based on a shape of the lower electrode, and forming an upper electrode by depositing metal film on the piezoelectric layer and by patterning based on a shape of the piezoelectric layer, wherein at least one of a deposition pressure and a deposition power is controlled to generate upward stress when depositing the metal film for the lower electrode.

    摘要翻译: 一种制造薄膜体声波谐振器的方法和由此制造的谐振器。 该方法包括在半导体衬底上层叠牺牲层,从牺牲层去除预定区域以实现半导体衬底的信号线与下电极之间的电接触,通过在下电极上沉积金属膜形成下电极 牺牲层,通过基于牺牲层的形状进行图案化,通过在下电极上沉积压电材料并基于下电极的形状进行图案化形成压电层,并且通过将金属膜沉积在上而形成上电极 压电层和基于压电层的形状的图案化,其中当沉积用于下电极的金属膜时,沉积压力和沉积功率中的至少一个被控制以产生向上的应力。

    MEMS RF-switch using semiconductor
    49.
    发明授权
    MEMS RF-switch using semiconductor 失效
    使用半导体的MEMS射频开关

    公开(公告)号:US07911300B2

    公开(公告)日:2011-03-22

    申请号:US12697629

    申请日:2010-02-01

    IPC分类号: H01H51/22

    CPC分类号: H01H59/0009 H01H2059/0018

    摘要: A MEMS RF-switch is provided for controlling switching on/off of transmission of AC signals. The MEMS RF-switch of the present invention includes: a first electrode coupled to one terminal of the power source; a semiconductor layer combined with an upper surface of the first electrode, and forming a potential barrier to become insulated when a bias signal is applied from the power source; and a second electrode disposed at a predetermined distance away from the semiconductor layer, and being coupled to the other terminal of the power source, wherein the second electrode contacts the semiconductor layer when a bias signal is applied from the power source. Therefore, although the bias signal may not be cut off, free electrons and holes are recombined in the semiconductor layer, whereby charge buildup and sticking can be prevented.

    摘要翻译: 提供了用于控制AC信号的传输的接通/断开的MEMS RF开关。 本发明的MEMS RF开关包括:耦合到电源的一个端子的第一电极; 与所述第一电极的上表面组合的半导体层,并且当从所述电源施加偏置信号时,形成电位势垒以变得绝缘; 以及第二电极,设置在距离半导体层预定距离处,并且耦合到电源的另一个端子,其中当从电源施加偏置信号时,第二电极接触半导体层。 因此,尽管偏置信号可能不会被切断,但自由电子和空穴在半导体层中重新结合,从而可以防止电荷积累和粘附。