公开(公告)号：US07192494B2

公开(公告)日：2007-03-20

申请号：US10611589

申请日：2003-06-30

申请人： B. Michelle Chen ,  Ho Seon Shin ,  Yezdi Dordi ,  Ratson Morad ,  Robin Cheung

发明人： B. Michelle Chen ,  Ho Seon Shin ,  Yezdi Dordi ,  Ratson Morad ,  Robin Cheung

IPC分类号： C25D5/50

CPC分类号： H01L21/6723 ,  C22F1/02 ,  C22F1/08 ,  C25D5/48 ,  C25D5/50 ,  C25D7/123 ,  H01L21/67098 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/76838 ,  H01L21/7684 ,  H01L21/76886

摘要： A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system.

摘要翻译： 一种退火铜的方法和装置。 该方法包括通过电镀在一体化处理系统中的基板上形成铜层，并对集成处理系统内的室内的铜层退火。

公开(公告)号：US20060166487A1

公开(公告)日：2006-07-27

申请号：US11393999

申请日：2006-03-30

申请人： Stan Tsai ,  Liang-Yuh Chen ,  Lizhong Sun ,  Shijian Li ,  Feng Liu ,  Rashid Mavliev ,  Ratson Morad ,  Daniel Carl

发明人： Stan Tsai ,  Liang-Yuh Chen ,  Lizhong Sun ,  Shijian Li ,  Feng Liu ,  Rashid Mavliev ,  Ratson Morad ,  Daniel Carl

IPC分类号： H01L21/4763 ,  H01L21/461

CPC分类号： H01L21/7684 ,  B24B37/042 ,  B24B49/16 ,  H01L21/3212 ,  Y02P80/30

摘要： Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

公开(公告)号：US07060606B2

公开(公告)日：2006-06-13

申请号：US10972191

申请日：2004-10-22

申请人： Stan D. Tsai ,  Liang-Yuh Chen ,  Lizhong Sun ,  Shijian Li ,  Feng Q. Liu ,  Rashid Mavliev ,  Ratson Morad ,  Daniel A. Carl

发明人： Stan D. Tsai ,  Liang-Yuh Chen ,  Lizhong Sun ,  Shijian Li ,  Feng Q. Liu ,  Rashid Mavliev ,  Ratson Morad ,  Daniel A. Carl

IPC分类号： H01L21/4763

CPC分类号： H01L21/7684 ,  B24B37/042 ,  B24B49/16 ,  H01L21/3212 ,  Y02P80/30

摘要： Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

公开(公告)号：US06979248B2

公开(公告)日：2005-12-27

申请号：US10140010

申请日：2002-05-07

申请人： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Ratson Morad ,  Sasson Somekh

发明人： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Ratson Morad ,  Sasson Somekh

IPC分类号： C25D7/12 ,  B23H5/08 ,  B24B37/04 ,  B24D13/14 ,  C25F3/00 ,  C25F3/30 ,  C25F7/00 ,  H01L21/304 ,  B24B1/00 ,  C25C7/04 ,  C25D17/00

CPC分类号： B24B37/16 ,  B23H5/08 ,  B24B37/046 ,  B24B37/14 ,  Y10S977/902

摘要： An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.

摘要翻译： 提供了一种用于平坦化基板表面的制造方法和装置。 在一个方面，提供了一种制造用品，用于抛光包括抛光制品的基材，所述抛光制品具有主体，该主体包括涂覆有导电材料的纤维的至少一部分，导电填料或其组合，并适于抛光该基材。 在另一方面，抛光制品包括具有适于抛光基底的表面和嵌入在抛光表面中的至少一个导电元件的主体，该导电元件包括​​涂覆有导电材料的电介质或导电纤维，导电填料或其组合 。 导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。 可以在制品中形成多个穿孔和多个凹槽以促进材料通过和抛光制品周围的流动。

公开(公告)号：US06897146B2

公开(公告)日：2005-05-24

申请号：US10602225

申请日：2003-06-23

申请人： Ratson Morad ,  Ho Seon Shin

发明人： Ratson Morad ,  Ho Seon Shin

IPC分类号： C23C16/02 ,  C23C16/54 ,  H01L21/00 ,  H01L21/4763

CPC分类号： H01L21/67167 ,  C23C16/0227 ,  C23C16/54 ,  H01L21/67184 ,  H01L21/67207

摘要： A semiconductor manufacturing equipment wherein degas chamber(s) are integrated to the conventional pass-through chamber location. A preferred embodiment for depositing Cu barrier and seed layers on a semiconductor wafer comprises a front opening unified pod(s), a single wafer loadlock chamber(s), a degas chamber(s), a preclean chamber(s), a Ta or TaN process chamber(s), and a Cu process chamber(s). The degas chamber is integrated to a pass-through chamber. Such system may achieve system throughput higher than 100 wafers per hour.

摘要翻译： 一种半导体制造设备，其中脱气室与常规的通过腔室位置集成。 用于在半导体晶片上沉积Cu阻挡层和种子层的优选实施例包括前开口统一吊舱，单个晶片负荷锁定室，脱气室，预清洁室，Ta或 TaN处理室和一个或多个Cu处理室。 脱气室集成到通气室。 这样的系统可以实现高于每小时100个晶片的系统吞吐量。

公开(公告)号：US06893548B2

公开(公告)日：2005-05-17

申请号：US09882208

申请日：2001-06-13

申请人： Robin Cheung ,  Daniel A. Carl ,  Liang-Yuh Chen ,  Yezdi Dordi ,  Paul F. Smith ,  Ratson Morad ,  Peter Hey ,  Ashok Sinha

发明人： Robin Cheung ,  Daniel A. Carl ,  Liang-Yuh Chen ,  Yezdi Dordi ,  Paul F. Smith ,  Ratson Morad ,  Peter Hey ,  Ashok Sinha

IPC分类号： C23C18/16 ,  C25D7/12 ,  C25D21/12 ,  C25D21/18 ,  C25D5/00

CPC分类号： C25D21/18 ,  C23C18/1617 ,  C23C18/1683 ,  C25D21/12

摘要： An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a first electrochemical bath having a first bath composition, utilizing the first electrochemical bath in an electrochemical deposition process to form a second electrochemical bath having a second bath composition and analyzing the first and second compositions to identify one or more constituents generated in the electrochemical deposition process. Additive material having a composition that is substantially the same as all or at least some of the one or more constituents generated in the electrochemical deposition process may be added to another electrochemical bath to produce a desired chemical composition. The constituents may be added at the beginning of the use of the bath to initially condition the electrochemical bath or may be added, preferably either continuously or periodically, during the electrochemical deposition process.

摘要翻译： 提供了一种用于分析或调理电化学浴的装置和方法。 本发明的一个方面提供了一种用于在电化学沉积方法中分析电化学浴的方法，包括提供具有第一浴组成的第一电化学浴，利用电化学沉积工艺中的第一电化学浴形成具有第二浴的第二电化学浴 组合和分析第一和第二组合物以鉴定在电化学沉积过程中产生的一种或多种成分。 具有与在电化学沉积工艺中产生的一种或多种成分中的全部或至少一些基本上相同的组成的添加剂材料可以加入到另一电化学浴中以产生所需的化学组成。 可以在使用浴的开始时添加组分以最初调节电化学浴，或者可以在电化学沉积过程期间连续地或周期性地添加。

公开(公告)号：US5003266A

公开(公告)日：1991-03-26

申请号：US379353

申请日：1989-07-12

申请人： Alex Palkovich ,  Ratson Morad

发明人： Alex Palkovich ,  Ratson Morad

IPC分类号： G01R33/3873

CPC分类号： G01R33/3873

摘要： Shim holding independently accessible open cavities are attached to the magnet bore. The holding independently accessible open cavities are arranged in rows and columns to provide readily identifiable locations. The shim holding indpendently accessible open cavities increase the effeciency of shimming to improve the homogeneity of magnets in magnetic resonance systems.

摘要翻译： 保持独立开放的腔的垫片附接到磁体孔。 保持独立开放的腔体以行和列布置以提供易于识别的位置。 保持独立开口的垫片增加了垫片的有效性，以提高磁共振系统中磁体的均匀性。

公开(公告)号：US08686279B2

公开(公告)日：2014-04-01

申请号：US12781706

申请日：2010-05-17

申请人： Gilad Almogy ,  Ratson Morad ,  Amir Bar ,  Amir Arie Weiss ,  Ofer Ricklis ,  Andrey Bochkariov

发明人： Gilad Almogy ,  Ratson Morad ,  Amir Bar ,  Amir Arie Weiss ,  Ofer Ricklis ,  Andrey Bochkariov

IPC分类号： H01L31/052

CPC分类号： H01L31/0525 ,  F24S23/74 ,  F24S25/12 ,  F24S25/13 ,  F24S30/425 ,  G02B7/1822 ,  H01L31/0521 ,  H01L31/0547 ,  Y02E10/45 ,  Y02E10/47

摘要： A concentrating solar energy collector comprises a linearly extending receiver comprising solar cells, a plurality of linearly extending reflective elements arranged in side-by-side rows, oriented parallel to a long axis of the receiver, and fixed in position with respect to each other and with respect to the receiver to form a linearly extending reflector, and a linearly extending support structure supporting the receiver and the reflector and pivotally mounted to accommodate rotation of the support structure, the reflector, and the receiver about a rotation axis parallel to the long axis of the receiver.

摘要翻译： 集中太阳能收集器包括线性延伸的接收器，其包括太阳能电池，并排布置的多个线性延伸的反射元件，其平行于接收器的长轴定向并相对于彼此固定就位， 相对于接收器形成线性延伸的反射器，以及支撑接收器和反射器并枢转地安装的线性延伸的支撑结构，以适应支撑结构，反射器和接收器围绕平行于长轴的旋转轴的旋转 的接收器。

公开(公告)号：US08580037B2

公开(公告)日：2013-11-12

申请号：US12482263

申请日：2009-06-10

申请人： Ratson Morad

发明人： Ratson Morad

IPC分类号： C23C16/50 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC分类号： C30B23/02 ,  H01L21/02568 ,  H01L21/02631 ,  H01L21/67754 ,  H01L21/6776

摘要： A method of depositing materials on a non-planar surface is disclosed. The method is effectuated by rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a method effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.

公开(公告)号：US08318609B2

公开(公告)日：2012-11-27

申请号：US12633589

申请日：2009-12-08

申请人： Dan Marohl ,  Timothy J. Franklin ,  Ratson Morad

发明人： Dan Marohl ,  Timothy J. Franklin ,  Ratson Morad

IPC分类号： H01L21/31

CPC分类号： H01L21/67706 ,  C23C14/505 ,  H01L21/6776

摘要： A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.

摘要翻译： 公开了一种用于在非平面基板上实现半导体处理的载体。 载体构造成用于在整个半导体处理步骤中保持至少一个非平面基底，并且当它们沿着处理室的平移路径行进时同时旋转非平面基底。 随着非平面基板同时旋转并且向下平移处理室，旋转将非平面基板的表面积的整个或任何所需部分暴露于沉积工艺，从而允许根据需要均匀沉积。 或者，任何预定图案能够暴露在非平面基板的表面上。 这种载体实现非平面半导体器件的制造，包括但不限于非平面发光二极管，非平面光伏电池等。