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公开(公告)号：US10257617B2
公开(公告)日：2019-04-09
申请号：US15814256
申请日：2017-11-15
Applicant: STMICROELECTRONICS S.R.L. , OMRON CORPORATION
Inventor： Takashi Kasai , Shobu Sato , Yuki Uchida , Igino Padovani , Filippo David , Sebastiano Conti
Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.
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42.发明申请公开(公告)号：US20190011694A1
公开(公告)日：2019-01-10
申请号：US16130765
申请日：2018-09-13
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Carminati , Enri Duqi , Sebastiano Conti
IPC: G02B26/08 , H04N9/31 , H02M3/335 , G05F3/26 , H02M1/12 , H02M1/15 , H02M1/42 , B81B3/00 , H02M1/00
Abstract: A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.
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公开(公告)号：US10024738B2
公开(公告)日：2018-07-17
申请号：US14539640
申请日：2014-11-12
Applicant: STMicroelectronics S.r.l.
Inventor： Sebastiano Conti , Daniele Prati , Domenico Giusti
IPC: G01L1/14
Abstract: A MEMS force sensor has: a substrate; a fixed electrode coupled to the substrate; and a mobile electrode suspended above the substrate at the fixed electrode to define a sensing capacitor, the mobile electrode being designed to undergo deformation due to application of a force to be detected. A dielectric material region is set on the fixed electrode and spaced apart by an air gap from the mobile electrode, in resting conditions. The mobile electrode comes to bear upon the dielectric material region upon application of a minimum detectable value of the force, so that a contact surface between the mobile electrode and the dielectric material region increases, in particular in a substantially linear way, as the force increases.
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44.发明申请公开(公告)号：US20180003950A1
公开(公告)日：2018-01-04
申请号：US15368184
申请日：2016-12-02
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Roberto Carminati , Enri Duqi , Sebastiano Conti
CPC classification number: G02B26/0833 , B81B3/0045 , B81B2201/042 , B81B2203/0315 , B81B2203/056 , G05F3/26 , H02M1/12 , H02M1/15 , H02M1/42 , H02M1/4225 , H02M1/4258 , H02M3/33507 , H02M2001/0025 , H02M2001/0032 , H04N9/3155 , H04N9/3173 , Y02B70/126 , Y02B70/16
Abstract: A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.
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公开(公告)号：US09628919B2
公开(公告)日：2017-04-18
申请号：US14265053
申请日：2014-04-29
Applicant: STMicroelectronics S.r.l.
Inventor： Sebastiano Conti , Matteo Perletti , Roberto Carminati , Lorenzo Baldo , Alessandro Morcelli
CPC classification number: H04R19/005 , H01L29/84 , H04R1/04 , H04R19/04
Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.
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Patent Agency Ranking
公开(公告)号：US09544573B2
公开(公告)日：2017-01-10
申请号：US14151471
申请日：2014-01-09
Applicant: STMicroelectronics S.r.l.
Inventor： Roberto Carminati , Sebastiano Conti , Sonia Costantini
CPC classification number: G02B26/0833 , G01B11/2518 , G02B26/0841 , G02B26/085 , G02B26/0858 , G02B26/105 , G03B21/008 , H04N5/2254 , H04N5/2256 , H04N5/2257 , H04N13/211 , H04N13/236 , H04N13/254 , Y10T29/49
Abstract: A mirror micromechanical structure has a mobile mass carrying a mirror element. The mass is drivable in rotation for reflecting an incident light beam with a desired angular range. The mobile mass is suspended above a cavity obtained in a supporting body. The cavity is shaped so that the supporting body does not hinder the reflected light beam within the desired angular range. In particular, the cavity extends as far as a first side edge wall of the supporting body of the mirror micromechanical structure. The cavity is open towards, and in communication with, the outside of the mirror micromechanical structure at the first side edge wall.
Abstract translation: 镜面微机械结构具有携带镜子元件的移动质量。 质量可旋转驱动，以反射具有期望角度范围的入射光束。 移动块悬挂在支撑体中获得的空腔上方。 空腔的形状使得支撑体不会将反射的光束阻碍在期望的角度范围内。 特别地，腔延伸到反射镜微机械结构的支撑体的第一侧边缘壁。 腔体在第一侧边缘壁处朝着反射镜微机械结构的外部打开并且与其连通。
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47.发明授权Micromechanical detection structure for a MEMS acoustic transducer and corresponding manufacturing process 有权MEMS声学传感器的微机械检测结构及相应的制造工艺公开(公告)号：US09332354B2
公开(公告)日：2016-05-03
申请号：US14254511
申请日：2014-04-16
Applicant: STMicroelectronics S.r.l.
Inventor： Sebastiano Conti , Marco Salina , Luca Lamagna , Matteo Perletti
CPC classification number: H04R23/00 , H04R19/005 , H04R19/04 , H04R31/00 , Y10T29/49005
Abstract: A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate made of semiconductor material, having a front surface lying in a horizontal plane; a membrane, coupled to the substrate and designed to undergo deformation in the presence of incident acoustic-pressure waves; a fixed electrode, which is rigid with respect to the acoustic-pressure waves and is coupled to the substrate by means of an anchorage structure, in a suspended position facing the membrane to form a detection capacitor. The anchorage structure has at least one pillar element, which is at least in part distinct from the fixed electrode and supports the fixed electrode in a position parallel to the horizontal plane.
Abstract translation: 一种用于MEMS电容式声换能器的微机械结构，具有：由半导体材料制成的基板，其前表面位于水平面; 膜，其耦合到基底并设计成在存在入射声压波的情况下经历变形; 固定电极，其相对于声压波是刚性的，并且通过锚定结构耦合到衬底，处于面向膜的悬挂位置以形成检测电容器。 锚固结构具有至少一个柱元件，其至少部分地不同于固定电极，并且将固定电极支撑在平行于水平面的位置。
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公开(公告)号：US20160094831A1
公开(公告)日：2016-03-31
申请号：US14961507
申请日：2015-12-07
Applicant: STMicroelectronics S.r.l.
Inventor： Roberto Carminati , Sebastiano Conti , Sonia Constantini
CPC classification number: G02B26/0833 , G01B11/2518 , G02B26/0841 , G02B26/085 , G02B26/0858 , G02B26/105 , G03B21/008 , H04N5/2254 , H04N5/2256 , H04N5/2257 , H04N13/211 , H04N13/236 , H04N13/254 , Y10T29/49
Abstract: A mirror micromechanical structure has a mobile mass carrying a mirror element. The mass is drivable in rotation for reflecting an incident light beam with a desired angular range. The mobile mass is suspended above a cavity obtained in a supporting body. The cavity is shaped so that the supporting body does not hinder the reflected light beam within the desired angular range. In particular, the cavity extends as far as a first side edge wall of the supporting body of the mirror micromechanical structure. The cavity is open towards, and in communication with, the outside of the mirror micromechanical structure at the first side edge wall.
Abstract translation: 镜面微机械结构具有携带镜子元件的移动质量。 质量可旋转驱动，以反射具有期望角度范围的入射光束。 移动块悬挂在支撑体中获得的空腔上方。 空腔的形状使得支撑体不会将反射的光束阻碍在期望的角度范围内。 特别地，腔延伸到反射镜微机械结构的支撑体的第一侧边缘壁。 腔体在第一侧边缘壁处朝着反射镜微机械结构的外部打开并且与其连通。
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49.发明申请DETECTION STRUCTURE FOR A MEMS ACOUSTIC TRANSDUCER WITH IMPROVED ROBUSTNESS TO DEFORMATION 审中-公开具有改进的稳定性的MEMS声学传感器的检测结构公开(公告)号：US20140353780A1
公开(公告)日：2014-12-04
申请号：US14288106
申请日：2014-05-27
Applicant: STMicroelectronics S.r.l.
Inventor： Matteo Perletti , Sebastiano Conti , Roberto Carminati , Marcella Capezzuto
CPC classification number: B81B3/0051 , B81B3/0021 , B81B2201/0257 , B81C1/00158 , H04R19/005
Abstract: A micromechanical structure for a MEMS capacitive acoustic transducer, has: a substrate of semiconductor material; a rigid electrode, at least in part of conductive material, coupled to the substrate; a membrane, at least in part of conductive material, facing the rigid electrode and coupled to the substrate, which undergoes deformation in the presence of incident acoustic pressure waves and is arranged between the substrate and the rigid electrode and has a first surface and a second surface, in fluid communication, respectively, with a first chamber and a second chamber, the first chamber being delimited at least in part by a first wall portion and by a second wall portion formed by the substrate, and the second chamber being delimited at least in part by the rigid electrode; and a stopper element, connected between the first and second wall portions for limiting the deformations of the membrane. At least one electrode-anchorage element couples the rigid electrode to the stopper element.
Abstract translation: 用于MEMS电容式声学换能器的微机械结构具有：半导体材料的衬底; 耦合到所述衬底的至少部分导电材料的刚性电极; 至少部分导电材料的膜面向刚性电极并且耦合到衬底，所述衬底在存在入射声压波的情况下经历变形，并且布置在衬底和刚性电极之间并且具有第一表面和第二表面 分别与第一室和第二室分别流体连通的表面，第一室至少部分地由第一壁部分和由衬底形成的第二壁部分限定，并且第二室至少界定 部分由刚性电极; 以及连接在第一和第二壁部分之间以限制膜的变形的止动元件。 至少一个电极固定元件将刚性电极连接到止动元件。
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50.发明授权公开(公告)号：US08836111B2
公开(公告)日：2014-09-16
申请号：US13916416
申请日：2013-06-12
Inventor： Sebastiano Conti , Benedetto Vigna
CPC classification number: B81B3/0021 , B81C1/00158 , H01L2224/48091 , H01L2224/48137 , H01L2924/16151 , H01L2924/16152 , H04R19/005 , H01L2924/00014
Abstract: Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the package facing the internal space. The second die is shaped so as to partially overlap the first die, above the inner surface, with a portion suspended in cantilever fashion above the first die, by an overlapping distance.
Abstract translation: 这里描述的是一种半导体集成器件组件，其设想为：限定内部空间的封装; 包括半导体材料的第一裸片; 以及与第一模具不同的第二模具，还包括半导体材料; 第一模具和第二模具耦合到面向内部空间的封装的内表面。 第二模具成形为使得第一模具在内表面上部分地以悬臂方式悬挂在第一模具上方的部分重叠距离。
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