公开(公告)号：US11804490B2

公开(公告)日：2023-10-31

申请号：US17533212

申请日：2021-11-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joong Gun Oh ,  Sung Il Park ,  Jae Hyun Park ,  Hyung Suk Lee ,  Eun Sil Park ,  Yun Il Lee

IPC: H01L27/092 ,  H01L29/66 ,  H01L21/8238 ,  H01L29/78 ,  H01L29/06 ,  H01L29/08 ,  H01L21/308 ,  H01L29/423 ,  H01L21/768

CPC classification number: H01L27/0924 ,  H01L21/3086 ,  H01L21/76895 ,  H01L21/823821 ,  H01L21/823871 ,  H01L21/823878 ,  H01L29/0642 ,  H01L29/0847 ,  H01L29/42356 ,  H01L29/6656 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/7851

Abstract: A semiconductor device includes a fin type pattern extending in a first direction on a substrate, a first gate electrode extending in a second direction intersecting the first direction on the fin type pattern, a source/drain region on a side wall of the first gate electrode and in the fin type pattern, a separation structure extending in the first direction on the substrate, the separation structure including a first trench and being spaced apart from the fin type pattern and separating the first gate electrode, an interlayer insulating layer on a side wall of the separation structure and covering the source/drain region, the interlayer insulating layer including a second trench having a lower surface lower than a lower surface of the first trench, and a contact connected to the source/drain region and filling the first trench and the second trench.

公开(公告)号：US11522736B2

公开(公告)日：2022-12-06

申请号：US17461070

申请日：2021-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeong Gyu Park ,  Jun Han Bae ,  Yun Geun Nam ,  Jae Hyun Park ,  Gyeong Seok Song ,  Ho-Bin Song

IPC: H04L25/03 ,  H03F3/45 ,  H04B1/18 ,  H04B3/08

Abstract: An analog front-end receiver including a termination resistor configured to receive first and second differential signals from different data lines, the second differential signal being differential with respect to the first differential signal, an active equalizer configured to receive a first input differential signal through a first input node and a second input differential signal through a second input node, the first and second input differential signals both having an input common mode voltage, the first and second input differential signals being based on the first and second differential signal, respectively, and output first and output differential signals to first and second output nodes, respectfully, the second output differential signal being differential with respect to the first output differential signal, and an input common mode voltage generator configured to adjust the input common mode voltage to be equal to an output common mode voltage of the first output differential signal.

公开(公告)号：US11195833B2

公开(公告)日：2021-12-07

申请号：US16218796

申请日：2018-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joong Gun Oh ,  Sung Il Park ,  Jae Hyun Park ,  Hyung Suk Lee ,  Eun Sil Park ,  Yun Il Lee

IPC: H01L21/8238 ,  H01L27/092 ,  H01L29/66 ,  H01L29/78 ,  H01L29/06 ,  H01L29/08 ,  H01L21/308 ,  H01L29/423 ,  H01L21/768

Abstract: A semiconductor device includes a fin type pattern extending in a first direction on a substrate, a first gate electrode extending in a second direction intersecting the first direction on the fin type pattern, a source/drain region on a side wall of the first gate electrode and in the fin type pattern, a separation structure extending in the first direction on the substrate, the separation structure including a first trench and being spaced apart from the fin type pattern and separating the first gate electrode, an interlayer insulating layer on a side wall of the separation structure and covering the source/drain region, the interlayer insulating layer including a second trench having a lower surface lower than a lower surface of the first trench, and a contact connected to the source/drain region and filling the first trench and the second trench.

公开(公告)号：US11011938B2

公开(公告)日：2021-05-18

申请号：US16790251

申请日：2020-02-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Hyun Park ,  Young Ho Ryu ,  Sang Wook Kwon ,  Ki Young Kim ,  Yun Kwon Park ,  Keum Su Song ,  Chi Hyung Ahn

IPC: H02J50/12 ,  H01P7/00 ,  H01P7/10

Abstract: A wireless power transmitter for wirelessly transmitting power is provided. The wireless power transmitter includes four cells configured to wirelessly transmit power to a wireless power receiver; a power source configured to provide power to one of the four cells; and a connection unit configured to connect the four cells to each other, wherein the connection unit is further configured to connect the four cells in a cross configuration.

公开(公告)号：US10714599B2

公开(公告)日：2020-07-14

申请号：US16249298

申请日：2019-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun II Lee ,  Sung II Park ,  Jae Hyun Park ,  Hyung Suk Lee

IPC: H01L29/66 ,  H01L27/092 ,  H01L29/06 ,  H01L21/8238 ,  H01L29/78 ,  H01L21/02 ,  H01L29/08

Abstract: A semiconductor device including a first fin type pattern and a second fin type pattern which protrude from a substrate and are spaced apart from each other to extend in a first direction, a dummy fin type pattern protruding from the substrate between the first fin type pattern and the second fin type pattern, a first gate structure extending in a second direction intersecting with the first direction, on the first fin type pattern, a second gate structure extending in the second direction, on the second fin type pattern, and a capping pattern extending in the second direction, on the first gate structure and the second gate structure, wherein the capping pattern includes a separation part which is in contact with an upper surface of the dummy fin type pattern, and the dummy fin type pattern and the separation part separate the first gate structure and the second gate structure.

公开(公告)号：US10432028B2

公开(公告)日：2019-10-01

申请号：US15438524

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chi Hyung Ahn ,  Sang Wook Kwon ,  Ki Young Kim ,  Nam Yun Kim ,  Dong Zo Kim ,  Bong Chul Kim ,  Yun Kwon Park ,  Jae Hyun Park ,  Keum Su Song ,  Young Ho Ryu ,  Byoung Hee Lee

IPC: H02J50/12 ,  B60L53/30 ,  B60L53/65 ,  B60L58/12 ,  H01F6/06 ,  H01F38/14 ,  H02J5/00 ,  H02J7/02 ,  H02J50/40 ,  H02J50/50 ,  H02J50/70 ,  H02M3/04 ,  H02M7/04 ,  H02M7/06 ,  H04B5/00 ,  B60L53/12

Abstract: A wireless power relay apparatus includes a relay resonator configured to relay power from a source resonator configured to wirelessly transmit the power, to a target resonator configured to wirelessly receive the power through a mutual resonance, the relay resonator having a higher quality factor than the source resonator and the target resonator.

公开(公告)号：US10389182B2

公开(公告)日：2019-08-20

申请号：US15438524

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chi Hyung Ahn ,  Sang Wook Kwon ,  Ki Young Kim ,  Nam Yun Kim ,  Dong Zo Kim ,  Bong Chul Kim ,  Yun Kwon Park ,  Jae Hyun Park ,  Keum Su Song ,  Young Ho Ryu ,  Byoung Hee Lee

IPC: H02J50/12 ,  H01F38/14 ,  H02J5/00 ,  H02J7/02 ,  H02M7/06 ,  H04B5/00 ,  H02J50/50 ,  H02J50/40 ,  H02J50/70 ,  H01F6/06 ,  H02M3/04 ,  H02M7/04 ,  B60L53/12 ,  B60L53/30 ,  B60L53/65 ,  B60L58/12

Abstract: A wireless power relay apparatus includes a relay resonator configured to relay power from a source resonator configured to wirelessly transmit the power, to a target resonator configured to wirelessly receive the power through a mutual resonance, the relay resonator having a higher quality factor than the source resonator and the target resonator.

公开(公告)号：US20190206867A1

公开(公告)日：2019-07-04

申请号：US16030224

申请日：2018-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Han LEE ,  Sungchul Park ,  Yunil Lee ,  Byoung-gi Kim ,  Yeongmin Jeon ,  Daewon Ha ,  Inchan Hwang ,  Jae Hyun Park ,  Woocheol Shin

IPC: H01L27/092 ,  H01L29/423 ,  H01L27/02 ,  H01L29/08 ,  H01L21/8238 ,  H01L21/306 ,  H01L29/66 ,  H01L21/3213 ,  H01L21/02 ,  H01L29/78 ,  H01L29/165

CPC classification number: H01L27/0924 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/02636 ,  H01L21/30604 ,  H01L21/32139 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823828 ,  H01L21/823864 ,  H01L21/823878 ,  H01L27/0207 ,  H01L29/0847 ,  H01L29/165 ,  H01L29/42372 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/66636 ,  H01L29/7848

Abstract: A semiconductor substrate includes a plurality of gate electrodes crossing active patterns on a substrate and extending in a second direction, the gate electrodes spaced apart in the second direction from each other, a gate separation pattern having a major axis in the first direction and between two of the gate electrodes, the two of the gate electrodes adjacent to each other in the second direction, and a plurality of gate spacers covering sidewalls of respective ones of the gate electrodes, the gate spacers crossing the gate separation pattern and extending in the second direction. The gate separation pattern includes a lower portion extending in the first direction, an intermediate portion protruding from the lower portion and having a first width, and an upper portion between two adjacent gate spacers and protruding from the intermediate portion, the upper portion having a second width less than the first width.

公开(公告)号：US10250079B2

公开(公告)日：2019-04-02

申请号：US15484203

申请日：2017-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nam Yun Kim ,  Sang Wook Kwon ,  Hyuk Choon Kwon ,  Bong Chul Kim ,  Yun Kwon Park ,  Jae Hyun Park

IPC: H02J7/00 ,  H02J50/40 ,  H02J50/80 ,  H02J50/12 ,  H02J17/00

Abstract: A method of operating a wireless power transmission apparatus includes receiving, from a wireless power reception apparatus, information on an operating power of a micro control unit (MCU) of the wireless power reception apparatus and information on an output of a direct current-to-direct current (DC/DC) converter of the wireless power reception apparatus; determining whether a charging power is to be transmitted to the wireless power reception apparatus based on the received information on the output of DC/DC converter; and transmitting, to the wireless power reception apparatus, an MCU operating power calculated based on the received information on the operating power of the MCU in response to a determination that the charging power is not to be transmitted to the wireless power reception apparatus.

公开(公告)号：US09954966B2

公开(公告)日：2018-04-24

申请号：US14806797

申请日：2015-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo Hyuk Jang ,  Jae Hyun Park ,  Hey Young Park ,  Jong Kyu Bae ,  Yeo Rok Yoon ,  Ki Won Lee ,  Je Hyun Lee ,  Ki Young Lim ,  Jong Yeol Choi

IPC: G06F15/16 ,  H04L29/08 ,  H04L29/06

CPC classification number: H04L67/26 ,  H04L67/18 ,  H04L67/42

Abstract: A server is provided comprising a processor configured to: receive an indication of a location of a first device that is subscribed to a disaster notification service; in response to receiving a disaster alert, detect that the first device is located in an area associated with the disaster based on the indication of the location of the first device; identify a second device that has registered the first device as a friend; and transmit a first indication of the disaster to the first device and a second indication of the disaster to the second device.