公开(公告)号：US12230525B2

公开(公告)日：2025-02-18

申请号：US17383012

申请日：2021-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Junsik Hwang

IPC: H01L21/68 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00

Abstract: A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.

公开(公告)号：US12166021B2

公开(公告)日：2024-12-10

申请号：US17990953

申请日：2022-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/13 ,  H01L23/00

Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

公开(公告)号：US12165890B2

公开(公告)日：2024-12-10

申请号：US17469390

申请日：2021-09-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Dongho Kim ,  Hyunjoon Kim ,  Seogwoo Hong ,  Kyungwook Hwang ,  Junsik Hwang

IPC: H01L21/67 ,  H01L21/673 ,  H01L33/00

Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

公开(公告)号：US12087754B2

公开(公告)日：2024-09-10

申请号：US17667241

申请日：2022-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/00 ,  H01L25/16 ,  H01L27/15

CPC classification number: H01L25/50 ,  H01L25/167 ,  H01L27/15

Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

公开(公告)号：US12068178B2

公开(公告)日：2024-08-20

申请号：US17736352

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Kyungwook Hwang

IPC: H01L21/67 ,  B65G51/02 ,  H01L21/673

CPC classification number: H01L21/67121 ,  B65G51/02 ,  H01L21/67333

Abstract: A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

公开(公告)号：US11855050B2

公开(公告)日：2023-12-26

申请号：US17232964

申请日：2021-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon Kim ,  Kyungwook Hwang ,  Joonyong Park ,  Seogwoo Hong ,  Junsik Hwang

IPC: H01L25/075 ,  H01L25/16 ,  H01L33/20

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/20

Abstract: Provided is a micro-LED display, a micro-LED transferring substrate, and a method of transferring micro-LEDs using the micro-LED transferring substrate. The micro-LED includes a backplane substrate; and a plurality of sub-pixels provided on the backplane substrate, wherein at least one sub-pixel from among the plurality of sub-pixels includes a first micro-LED; and a second micro-LED different from the first micro-LED.

公开(公告)号：US11764194B2

公开(公告)日：2023-09-19

申请号：US17174934

申请日：2021-02-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Kyungwook Hwang

IPC: H01L25/075 ,  H01L33/50 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L27/1214 ,  H01L33/50 ,  H01L33/62 ,  H01L2933/0066

Abstract: The present disclosure provides a micro-light-emitting diode display apparatus and a method of manufacturing the same. Provided is a micro-light-emitting diode (LED) display apparatus including a plurality of pixels, the micro-LED display apparatus including a driving circuit substrate, a first electrode provided on the driving circuit substrate, one or more micro-light-emitting diodes (LEDs) provided on the first electrode, an insulating layer provided on the one or more micro-LEDs, a via pattern provided in the insulating layer, electrical contacts provided in the via pattern, and a second electrode provided on the electrical contacts, wherein the via pattern exposes a portion of the one or more micro-LEDs.

公开(公告)号：US20230197477A1

公开(公告)日：2023-06-22

申请号：US18075078

申请日：2022-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM ,  Minchul Yu ,  Kyungwook Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67132 ,  H01L21/68 ,  H01L21/67051 ,  H01L21/67333

Abstract: A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.

公开(公告)号：US20230133466A1

公开(公告)日：2023-05-04

申请号：US17729769

申请日：2022-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik HWANG ,  Kyungwook Hwang ,  Seogwoo Hong

IPC: H01L33/38 ,  H01L33/32 ,  H01L33/24 ,  H01L27/15 ,  H01L33/62 ,  H01L33/50

Abstract: A micro light emitting device includes a first semiconductor layer doped with a first conductivity type, a light emitting layer arranged on an upper surface of the first semiconductor layer, a second semiconductor layer arranged on an upper surface of the light emitting layer and doped with a second conductivity type electrically opposite to the first conductivity type, an insulating layer arranged on an upper surface of the second semiconductor layer, a first electrode arranged on an upper surface of the insulating layer and electrically connected to the first semiconductor layer, a second electrode arranged on the upper surface of the insulating layer and electrically connected to the second semiconductor layer, and an aluminum nitride layer arranged on a lower surface of the first semiconductor layer and having a flat surface.

公开(公告)号：US20220328733A1

公开(公告)日：2022-10-13

申请号：US17708332

申请日：2022-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Joonyong Park ,  Dongho Kim ,  Hyunjoon Kim ,  Seogwoo Hong ,  Junsik Hwang

IPC: H01L33/50 ,  H01L25/075 ,  H01L25/04 ,  C09K11/02

Abstract: Disclosed are a color conversion structure, a display apparatus, and a method of manufacturing the display apparatus. The color conversion structure has a transferable film structure which includes a base layer and a quantum dot layer provided on the base layer.