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    BOTTLE CAP HAVING A FIRST CAP MEMBER AND A SECOND CAP MEMBER ASSEMBLED THERETO
    42.
    发明申请
    BOTTLE CAP HAVING A FIRST CAP MEMBER AND A SECOND CAP MEMBER ASSEMBLED THERETO 审中-公开
    具有第一个帽子会员的帽子和组装的第二个帽子会员

    公开(公告)号：US20100213158A1

    公开(公告)日：2010-08-26

    申请号：US12738441

    申请日：2008-10-14

    申请人： Sang-Hoon Kim

    发明人： Sang-Hoon Kim

    IPC分类号： B65D51/00 ,  B65D41/32

    CPC分类号： B65D41/485 ,  B65D39/0076

    摘要： The bottle cap of the present invention consists of a first cap and a second cap fitted into the depressed portion of the first cap. The first cap includes a circumference portion formed so as to embrace the outer circumference of the neck of the bottle and a top edge portion formed on the top edge of said circumference portion so as to close the neck of the bottle. The top edge portion includes a depressed portion depressed downward so as to form a sidewall that comes into airtight contact with the inner circumference of the neck of the bottle. The second cap includes an insert portion inserted into the depressed portion and an elongated portion elongated outwardly from a top of the insert portion. Such a bottle cap provides an effect that sealability between the inside and outside of the neck of the bottle and the bottle cap can be improved.

    摘要翻译： 本发明的瓶盖由第一盖和装在第一盖的凹陷部中的第二盖组成。 第一盖包括形成为包围瓶颈的外周的圆周部分和形成在所述圆周部分的顶部边缘上的顶部边缘部分，以封闭瓶颈。 上边缘部包括向下方凹陷的凹部，以形成与瓶颈的内周气密接触的侧壁。 第二盖包括插入凹部中的插入部分和从插入部分的顶部向外伸长的细长部分。 这种瓶盖提供了可以提高瓶颈和瓶盖的内部和外部之间的密封性的效果。

    Method of manufacturing printed circuit board
    44.
    发明申请
    Method of manufacturing printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US20090223044A1

    公开(公告)日：2009-09-10

    申请号：US12453616

    申请日：2009-05-15

    申请人： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

    发明人： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

    IPC分类号： H05K3/10

    CPC分类号： G02B6/1221 ,  G02B6/136 ,  G02B6/28 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/20 ,  Y10T29/49155

    摘要： A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

    摘要翻译： 一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电 信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

    Electromagnetic bandgap structure and printed circuit board
    45.
    发明申请
    Electromagnetic bandgap structure and printed circuit board 有权
    电磁带隙结构和印刷电路板

    公开(公告)号：US20080314634A1

    公开(公告)日：2008-12-25

    申请号：US12155941

    申请日：2008-06-11

    申请人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

    发明人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

    IPC分类号： H01R12/04

    CPC分类号： H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

    摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

    摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔 通过第一金属层和金属板之间的金属线连接。 该电磁带隙结构可以具有小尺寸和低带隙频率。

    Solar simulator using a combination of mercury and halogen lamps
    46.
    发明申请
    Solar simulator using a combination of mercury and halogen lamps 有权
    使用汞和卤素灯组合的太阳能模拟器

    公开(公告)号：US20060176694A1

    公开(公告)日：2006-08-10

    申请号：US11177852

    申请日：2005-07-08

    申请人： Jae-Myung Lee ,  Gun-Young Park ,  Sang-Hwa Baek ,  Jeong-Yong Lee ,  Gil-Sang Nam ,  Sang-Hoon Kim ,  Baek-Hee Jeong

    发明人： Jae-Myung Lee ,  Gun-Young Park ,  Sang-Hwa Baek ,  Jeong-Yong Lee ,  Gil-Sang Nam ,  Sang-Hoon Kim ,  Baek-Hee Jeong

    IPC分类号： F21V33/00

    CPC分类号： G01N21/255

    摘要： A solar simulator combines mercury lamps and halogen lamps, to improve upon conventional solar simulators using halogen and infrared lamps which cannot recreate an environment close to that under real sunlight, and upon solar simulators using expensive and fragile metal halide lamps and arc xenon lamps. An environment recreation laboratory for solar simulation includes a lamp bank mounted at an upper portion thereof and including a plurality of halogen lamps, halogen filter lamps being halogen lamps provided with an infrared filter, respectively, and mercury lamps. A temperature control unit includes a cooling unit that discharges air to cool the lamp bank, and an air conditioner that distributes the air discharged by the cooling unit. An electrical panel controls operations of the lamp bank and the temperature control unit, such that an environment within the environment recreation laboratory may very closely simulate the environment under real sunlight.

    摘要翻译： 太阳能模拟器将汞灯和卤素灯组合在一起，以改进使用卤素灯和红外灯的常规太阳能模拟器，这些灯不能重现与真正阳光下的环境接近的环境，以及使用昂贵且脆弱的金属卤化物灯和电弧氙灯的太阳能模拟器。 用于太阳能模拟的环境娱乐实验室包括安装在其上部并包括多个卤素灯的灯组，分别设置有红外滤光器的卤素灯的卤素过滤灯和汞灯。 温度控制单元包括排出空气以冷却灯组的冷却单元和分配由冷却单元排出的空气的空调。 电气面板控制灯组和温度控制单元的操作，使得环境娱乐实验室内的环境可以非常模拟真实阳光下的环境。

    Three-dimensional semiconductor memory devices using direct strapping line connections
    47.
    发明授权
    Three-dimensional semiconductor memory devices using direct strapping line connections 有权
    使用直接捆扎线连接的三维半导体存储器件

    公开(公告)号：US08803222B2

    公开(公告)日：2014-08-12

    申请号：US13543312

    申请日：2012-07-06

    申请人： Bongyong Lee ,  Sang-Hoon Kim ,  Ae-Jeong Lee ,  Dongchan Kim

    发明人： Bongyong Lee ,  Sang-Hoon Kim ,  Ae-Jeong Lee ,  Dongchan Kim

    IPC分类号： H01L29/792

    CPC分类号： H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L27/11582

    摘要： Memory devices include a plurality of elongate gate stacks extending in parallel on a substrate and at least one insulation region disposed in a trench between adjacent ones of the gate stacks. The at least one insulation region has linear first portions having a first width and widened second portions having a second width greater than the first width. A common source region is disposed in the substrate underlying the at least one insulation region. The devices further include respective conductive plugs passing through respective ones of the widened second portions of the at least one insulation region and electrically connected to the common source region and at least one strapping line disposed on the conductive plugs between the adjacent ones of the gate stacks and in direct contact with the conductive plugs.

    摘要翻译： 存储器件包括在衬底上平行延伸的多个细长栅极叠层和设置在相邻栅极叠层之间沟槽中的至少一个绝缘区域。 所述至少一个绝缘区具有具有第一宽度的线性第一部分和具有大于第一宽度的第二宽度的加宽的第二部分。 公共源极区域设置在至少一个绝缘区域下方的衬底中。 这些器件还包括各自的导电插塞，其穿过至少一个绝缘区域的加宽的第二部分中的相应导电插塞并且电连接到公共源极区域，以及设置在相邻栅极叠层之间的导电插塞上的至少一个捆扎线 并与导电插头直接接触。

    Electromagnetic bandgap structure and printed circuit board
    48.
    发明授权
    Electromagnetic bandgap structure and printed circuit board 有权
    电磁带隙结构和印刷电路板

    公开(公告)号：US08368488B2

    公开(公告)日：2013-02-05

    申请号：US12155941

    申请日：2008-06-11

    申请人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

    发明人： Han Kim ,  Hyung-Sik Choi ,  Sang-Hoon Kim ,  Joon-Sung Kim

    IPC分类号： H01P1/203

    CPC分类号： H05K1/116 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H01L2224/0401

    摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.

    摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔 通过第一金属层和金属板之间的金属线连接。 该电磁带隙结构可以具有小尺寸和低带隙频率。

    Optical wiring board and manufacturing method thereof
    50.
    发明授权
    Optical wiring board and manufacturing method thereof 失效
    光接线板及其制造方法

    公开(公告)号：US08249403B2

    公开(公告)日：2012-08-21

    申请号：US12761716

    申请日：2010-04-16

    申请人： Sang-Hoon Kim ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

    发明人： Sang-Hoon Kim ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

    IPC分类号： G02B6/12 ,  G02B6/10

    CPC分类号： G02B6/4201 ,  G02B6/4214 ,  G02B6/428 ,  G02B6/43 ,  Y10T29/49117

    摘要： An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin.

    摘要翻译： 公开了一种光布线板及其制造方法。 根据本发明的实施例，该方法包括提供柔性光波导层，在光波导层的一个表面上选择性地形成加强包层，并在光波导层的另一个表面上根据 其中形成加强包层。 因此，只要在形成镜面凹槽的地方能够形成厚度的包层，即使光线路板通常薄，也可以制造具有挠性的挠性光布线板。