Method for preparing catalysts
    45.
    发明授权
    Method for preparing catalysts 失效
    制备催化剂的方法

    公开(公告)号:US07097880B2

    公开(公告)日:2006-08-29

    申请号:US10742279

    申请日:2003-12-18

    CPC classification number: B01J35/04 B01J37/0201 B01J37/0211 B01J37/0215

    Abstract: A method for impregnating porous monolith supports with catalytically active materials is disclosed. The impregnation is carried out at a temperature which substantially reduces chemisorption rates such that reactions between the monolith substrate and catalytically active materials in the catalyst solution are minimized. The process can be completed in a practical time that allows for unit selectivity of the weight ratio of catalytically active materials in the substrate to the weight ratio of catalytically active materials in the catalyst solution.

    Abstract translation: 公开了一种用催化活性材料浸渍多孔整料载体的方法。 浸渍在基本上降低化学吸附速率的温度下进行,使得催化剂溶液中的整料衬底和催化活性材料之间的反应最小化。 该过程可以在实际的时间内完成,其允许衬底中催化活性材料的重量比与催化剂溶液中催化活性材料的重量比的单位选择性。

    MOLD THERMOPHYSICAL PROPERTIES FOR THICKNESS UNIFORMITY OPTIMIZATION OF EXOCAST SHEET
    49.
    发明申请
    MOLD THERMOPHYSICAL PROPERTIES FOR THICKNESS UNIFORMITY OPTIMIZATION OF EXOCAST SHEET 审中-公开
    模具厚度均匀性优化的热塑性物理特性

    公开(公告)号:US20130052802A1

    公开(公告)日:2013-02-28

    申请号:US13214366

    申请日:2011-08-22

    CPC classification number: C30B29/06 C30B11/002 C30B15/007 C30B19/12

    Abstract: The disclosure relates to substrate molds with variable thermal mass. The disclosure relates to substrate molds comprising refractory materials having a leading edge and a trailing edge, wherein the substrate mold has a graded thermal mass comprising a leading edge thermal mass (Mt(lead)) and a trailing edge thermal mass (Mt(trail)), wherein Mt(lead) is less than Mt(trail). The disclosure also relates to methods of making articles of semiconducting material and methods of minimizing total thickness variation in articles of semiconducting material, said methods comprising using the molds disclosed.

    Abstract translation: 本公开涉及具有可变热质量的基底模具。 本公开涉及包括具有前缘和后缘的耐火材料的基底模具,其中所述基底模具具有包括前缘热质(Mt(铅))和后缘热质(Mt(线))的分级热质, ),其中Mt(铅)小于Mt(trail)。 本公开还涉及制造半导体材料的方法和使半导体材料制品中的总厚度变化最小化的方法,所述方法包括使用所公开的模具。

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