Abstract:
A system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer. The first substrate may include a bonding surface and the second substrate may include a complementary bonding surface. The composite bonding layer may be positioned between the first substrate and the second substrate. The composite boding layer may include a metal matrix and a plurality of stress-reducing additives disposed in the metal matrix. Each stress-reducing additive may include a three-dimensional shape The stress-reducing additives may include a ratio of length:height of at least about 2:1. An elastic modulus of a material of the stress-reducing additive may be less than an elastic modulus of the material of the metal matrix.
Abstract:
Transient liquid phase compositions and bonding assemblies are disclosed. In one embodiment, a transient liquid phase composition includes a plurality of particles. Each particle includes a core, an inner shell surrounding the core, the inner shell, and an outer shell surrounding the inner shell. The core is made of a first high melting temperature material, the inner shell is made of a second high melting temperature material, and the outer shell is made of a low melting temperature material. The melting temperature of the low melting temperature material is less than the melting temperature of both the first and second high melting temperature materials.
Abstract:
Jet-impingement, two-phase cooling apparatuses and power electronics modules having a target surface with single- and two-phase surface enhancement features are disclosed. In one embodiment, a cooling apparatus includes a jet plate surface and a target layer. The jet plate surface includes a jet orifice having a jet orifice geometry, wherein the jet orifice is configured to generate an impingement jet of a coolant fluid. The target layer has a target surface, single-phase surface enhancement features, and two-phase surface enhancement features. The target surface is configured to receive the impingement jet, and the single-phase surface enhancement features and the two-phase enhancement features are arranged on the target surface according to the jet orifice geometry. The single-phase surface enhancement features are positioned on the target surface at regions associated with high fluid velocity, and the two-phase surface enhancement features are positioned on the target surface at regions associated with low fluid velocity.
Abstract:
Jet-impingement, two-phase cooling apparatuses and power electronics modules having a target surface with single- and two-phase surface enhancement features are disclosed. In one embodiment, a cooling apparatus includes a jet plate surface and a target layer. The jet plate surface includes a jet orifice having a jet orifice geometry, wherein the jet orifice is configured to generate an impingement jet of a coolant fluid. The target layer has a target surface, single-phase surface enhancement features, and two-phase surface enhancement features. The target surface is configured to receive the impingement jet, and the single-phase surface enhancement features and the two-phase enhancement features are arranged on the target surface according to the jet orifice geometry. The single-phase surface enhancement features are positioned on the target surface at regions associated with high fluid velocity, and the two-phase surface enhancement features are positioned on the target surface at regions associated with low fluid velocity.
Abstract:
Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.
Abstract:
The present disclosure is directed to systems and methods for cooling electronic devices. The system comprises a pump, a distribution manifold fluidly coupled to the pump, one or more capillary coolers fluidly coupled to the distribution manifold, one or more electronic devices coupled to the one or more capillary coolers, a vapor line fluidly coupled to the one or more capillary coolers, and a condenser comprising an inlet and an outlet, wherein the inlet is fluidly coupled to the vapor line and the outlet is fluidly coupled to the pump.
Abstract:
A system for providing power to devices from a magnetoelectric energy harvester can include a processor and a memory. The memory can store a rate analysis module and a controller module. The rate analysis module can include instructions that cause the processor to determine a rate at which an energy storage device bank stores energy received from a magnetoelectric energy harvester. The controller module can include instructions that cause the processor to cause, in response to an existence of a condition and the rate being: (1) greater than a power consumption rate of a first device, the first device to receive power from the energy storage device bank and (2) greater than a power consumption rate of a second device, but less than the power consumption rate of the first device, the second device to receive the power from the energy storage device bank.
Abstract:
A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.
Abstract:
Systems, methods, and other embodiments described herein relate to predicting anomalous operation of a device and an associated remaining useful life (RUL). In one embodiment, a method includes acquiring usage information about operation of an electronic device. The method includes selecting at least one feature from the usage information according to an optimization. The method includes determining whether the least one feature indicates a presence of an anomaly in the operation of the electronic device according to an anomaly model. The method includes, responsive to detecting the anomaly, determining a remaining useful life (RUL) for the electronic device according to a RUL model. The method includes providing the RUL.
Abstract:
A passive thermal management system and methods of using a thermoresponsive hydrogel coating configured to autonomously switch between a heating state and a cooling state based on ambient temperature. At temperature greater than a lower critical solution temperature of the thermoresponsive hydrogel, the thermoresponsive hydrogel coating becomes solar reflective and has enhanced radiative cooling ability to achieve daytime radiative cooling. At temperatures less than the lower critical solution temperature, the thermoresponsive hydrogel coating becomes transparent to facilitate absorption of solar radiation by sun absorber.