公开(公告)号：US06890799B2

公开(公告)日：2005-05-10

申请号：US10338485

申请日：2003-01-07

申请人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

发明人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

IPC分类号： H01L23/10 ,  H01L23/473 ,  H01L21/48 ,  H01L23/34 ,  H05K7/20

CPC分类号： H01L23/10 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1626

摘要： According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

摘要翻译： 根据本发明，多芯片模块中的密封顶板由具有与多层电路基板的热膨胀系数一致的高导热性的陶瓷形成。 覆盖整个冷却流路槽的冷却流路盖形成为单独的金属部件。 密封顶板的形成冷却流路槽的背面使用焊料直接接合在半导体装置的背面。 提供具有低热阻的导热护套。 多芯片模块密封框架焊接到密封顶板的边缘。 此外，诸如O形圈的密封材料简单地介于密封顶板的边缘和冷却水通道盖之间，并且紧固装置用于紧固金属冷却流路盖和多芯片模块密封框架 对彼此。

公开(公告)号：US06632780B2

公开(公告)日：2003-10-14

申请号：US09798051

申请日：2001-03-05

申请人： Takao Uematsu ,  Yutaka Ito ,  Takahiro Daikoku ,  Akio Idei ,  Akihiro Yasuda

发明人： Takao Uematsu ,  Yutaka Ito ,  Takahiro Daikoku ,  Akio Idei ,  Akihiro Yasuda

IPC分类号： C10M11308

CPC分类号： C10M169/00 ,  C10M169/06 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2205/0206 ,  C10M2205/0265 ,  C10M2207/0406 ,  C10M2207/2825 ,  C10M2207/2835 ,  C10M2207/289 ,  C10M2209/103 ,  C10M2209/104 ,  C10M2209/108 ,  C10M2209/109 ,  C10M2213/0606 ,  C10N2220/082 ,  C10N2240/201 ,  C10N2240/204 ,  C10N2250/10

摘要： There are provided a highly thermal conductive grease composition having both a thermal conductivity and a satisfactory dispense property, and a cooling device applied with same. The grease composition comprises from 70 to 90% by volume of an inorganic powder which is a mixture containing at least two kinds of inorganic powders different from each other in each average particle size, and from 10 to 30% by volume of a base oil containing a mineral oil or a synthetic oil, the base oil further containing a surfactant in an amount of from 0.2 to 2.0% by weight based on the weight of the inorganic powder.

摘要翻译： 提供了具有导热性和令人满意的分配性能的高导热性润滑脂组合物，以及与此相应的冷却装置。 该润滑脂组合物含有70〜90体积％的无机粉末，该无机粉末是含有平均粒径不同的至少两种无机粉末的混合物，10〜30体积％的含有 矿物油或合成油，基础油还含有基于无机粉末重量的0.2-2.0重量％的表面活性剂。

公开(公告)号：US5818694A

公开(公告)日：1998-10-06

申请号：US800460

申请日：1997-02-14

申请人： Takahiro Daikoku ,  Shigeyasu Tsubaki

发明人： Takahiro Daikoku ,  Shigeyasu Tsubaki

IPC分类号： H05K7/20 ,  F28F3/02 ,  H01L23/467

CPC分类号： F28F3/02 ,  H01L23/467 ,  H01L2924/0002

摘要： The cooling apparatus has cooling fins attached to heat generating units of electronic devices and provided with a plurality of elemental fins. According to one embodiment, the cooling apparatus has a first cooling fin composed of elemental fins that are uniform in fin density in the height direction of the cooling fin from a fin base. The cooling apparatus also has a second cooling fin composed of elemental fins with a zero or small fin density at the lower portion close to a fin base of the cooling fin as compared with the fin density at the upper portion of the cooling fin. The first and second cooling fins are positioned adjacent to one another. Various different embodiments of cooling fins are disclosed.

摘要翻译： 冷却装置具有附接到电子装置的发热单元并具有多个元件翅片的散热片。 根据一个实施例，冷却装置具有由散热片基部的冷却翅片的高度方向上的翅片密度均匀的元件翅片构成的第一冷却翅片。 与冷却翅片上部的翅片密度相比，冷却装置还具有第二冷却翅片，其在靠近冷却翅片的翅片底部的下部处具有零或小翅片密度的元件翅片。 第一和第二冷却片彼此相邻地定位。 公开了散热片的各种不同实施例。

公开(公告)号：US4561497A

公开(公告)日：1985-12-31

申请号：US561070

申请日：1983-12-14

申请人： Tadakatsu Nakajima ,  Wataru Nakayama ,  Takahiro Daikoku ,  Heikichi Kuwahara ,  Akira Yasukawa ,  Katsuhiko Kasuya ,  Kazuaki Yokoi ,  Hideo Nakae ,  Hiromichi Yoshida

发明人： Tadakatsu Nakajima ,  Wataru Nakayama ,  Takahiro Daikoku ,  Heikichi Kuwahara ,  Akira Yasukawa ,  Katsuhiko Kasuya ,  Kazuaki Yokoi ,  Hideo Nakae ,  Hiromichi Yoshida

IPC分类号： F28F13/02 ,  F28F1/10 ,  F28F13/18

CPC分类号： F28F13/187 ,  Y10T29/49378

摘要： In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.

摘要翻译： 在具有空腔组和外表面区域中的限制开口组的传热表面中，空腔组由多排空隙条构件组成。 空腔条构件平行地布置在传热表面的基底构件上，并且层叠成一层或多层。 每个带状构件具有横向布置成平行的多个细长空腔。 细长的空腔在上表面封闭并且在两端开口。 相同层中的相邻空腔通过各个设置在空腔条形构件之间的连通部分和开口彼此连通。 限制的开口组形成在连通部的上表面上。 受限制的开口组使一个层中的通信部分，另一层中的通信部分和外部彼此通信。 还公开了制造这种传热表面的方法。

公开(公告)号：US4558395A

公开(公告)日：1985-12-10

申请号：US604003

申请日：1984-04-26

申请人： Minoru Yamada ,  Akira Masaki ,  Masakazu Yamamoto ,  Keiichirou Nakanishi ,  Takashi Nishida ,  Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Kuninori Imai

发明人： Minoru Yamada ,  Akira Masaki ,  Masakazu Yamamoto ,  Keiichirou Nakanishi ,  Takashi Nishida ,  Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Kuninori Imai

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4332 ,  H01L2224/16225

摘要： A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.

摘要翻译： 一种用于集成电路芯片的冷却模块，包括安装在布线基板上的多个集成电路芯片，分别设置用于集成电路芯片的冷却构件，每个冷却构件具有用于使冷却剂循环的空间，以及连接到各个冷却构件的柔性管道 通过柔性管使冷却剂流入或流出所述冷却构件的所述空间，以便从集成电路芯片去除热量。

公开(公告)号：US4532770A

公开(公告)日：1985-08-06

申请号：US625241

申请日：1984-06-27

申请人： Yoshinori Hakuraku ,  Hisanao Ogata ,  Takahiro Daikoku ,  Noboru Suzuki

发明人： Yoshinori Hakuraku ,  Hisanao Ogata ,  Takahiro Daikoku ,  Noboru Suzuki

IPC分类号： F25B21/00 ,  F25B21/02

CPC分类号： F25B21/00 ,  F25B2321/0021 ,  F25B2321/0023 ,  Y02B30/66 ,  Y10S505/891

摘要： In a magnetic refrigerator comprising working substances for the magnetic refrigeration and a magnetic field generating device which magnetizes and demagnetizes these working substances, this magnetic refrigerator is provided with a plurality of superconducting coils arranged around the outer periphery of a rotor, a plurality of working substances are arranged around the periphery of said rotor, and the rotor is rotated so that the strength of magnetic fields impressed on the working substances is varied.

摘要翻译： 在包含用于磁性制冷的工作物质的磁性制冷机和对这些工作物质进行磁化和去磁的磁场产生装置中，该磁性制冷机具有设置在转子的外周周围的多个超导线圈，多个工作物质 布置在所述转子的周边周围，并且转子旋转，使得施加在工作物质上的磁场的强度变化。

公开(公告)号：US4166498A

公开(公告)日：1979-09-04

申请号：US815028

申请日：1977-07-12

申请人： Kunio Fujie ,  Wataru Nakayama ,  Takahiro Daikoku ,  Shigeki Hirasawa ,  Kimio Kakizaki

发明人： Kunio Fujie ,  Wataru Nakayama ,  Takahiro Daikoku ,  Shigeki Hirasawa ,  Kimio Kakizaki

IPC分类号： F25B39/04 ,  F28F13/02 ,  F28F13/04 ,  F28B9/08 ,  F28F3/04 ,  F28F13/18

CPC分类号： F28F13/04

摘要： A condensing, a heat-transfer wall for liquefying vapor having a temperature higher than the wall by bringing the vapor in contact therewith. There are provided many parallel grooves in the basic surface of the heat-transfer wall, thereby defining ridge portions or build-up portions thereamong. These ridge portions have their tip portions tapered at sharp acute angle. Recessed or concave portions are provided in the tip portions of these ridge portions, and these recessed portions have their surfaces inclined to the basic surface of the heat-transfer wall. The width of the respective grooves ranges from 0.05 to 2.5 mm, and the depth thereof is not more than 10 mm. The thickness of the respective ridge portions ranges from 0.01 to 2.5 mm, and the height there of is not more than 10 mm. The depth of the recessed portions ranges from 0.02 to 0.8 times the depth of the grooves, and the pitch of recessed portion is not more than 2.0 mm. The width of the tip portions of the portions is 0.01 to 1.0 times the pitch of the recessed portions.

摘要翻译： 冷凝物，通过使蒸气与其接触而液化具有高于壁温度的蒸气的传热壁。 在传热壁的基面上设有许多平行的凹槽，从而在其之间形成脊部或组合部分。 这些脊部的尖端部分以锐角锐化。 在这些脊部的前端设置有凹部或凹部，这些凹部的表面倾斜于传热壁的基面。 各槽的宽度为0.05〜2.5mm，其深度为10mm以下。 各脊部的厚度为0.01〜2.5mm，高度为10mm以下。 凹部的深度为凹槽深度的0.02〜0.8倍，凹部的间距为2.0mm以下。 这些部分的前端部的宽度为凹部的间距的0.01〜1.0倍。

公开(公告)号：US06351384B1

公开(公告)日：2002-02-26

申请号：US09637468

申请日：2000-08-11

申请人： Takahiro Daikoku ,  Junri Ichikawa ,  Atsuo Nishihara ,  Kenichi Kasai

发明人： Takahiro Daikoku ,  Junri Ichikawa ,  Atsuo Nishihara ,  Kenichi Kasai

IPC分类号： H05K720

CPC分类号： F28F3/02 ,  F28F3/12 ,  F28F13/12 ,  H01L23/3672 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2224/0401

摘要： A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.

摘要翻译： 提供了同时有效地降低LSI芯片的温度上升的多芯片模块冷却装置，并且其具有优异的多芯片模块的生产率，例如其组装和拆卸能力。 多芯片模块包括用于去除由它们产生的热量的半导体器件和密封顶板。 密封顶板具有多个平行的冷却通道和部分横跨冷却通道延伸的多个横向槽。 冷却通道覆盖有冷却通道盖，其在其内壁上设置有湍流促进剂。 当冷却通道盖被放置在密封顶板上方时，湍流促进器与十字槽接合。 湍流促进剂位于相邻半导体器件之间的中间位置。

公开(公告)号：US06281575B1

公开(公告)日：2001-08-28

申请号：US09348260

申请日：1999-07-07

申请人： Toru Nishikawa ,  Masahide Harada ,  Kaoru Katayama ,  Takeshi Miitsu ,  Takayuki Uda ,  Takahiro Daikoku

发明人： Toru Nishikawa ,  Masahide Harada ,  Kaoru Katayama ,  Takeshi Miitsu ,  Takayuki Uda ,  Takahiro Daikoku

IPC分类号： H01L2310

CPC分类号： H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2224/0401

摘要： A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.

摘要翻译： 多芯片模块具有用于在焊接部分处设置大量剩余焊料的结构。 在该多芯片模块中，冷却构件（结构）直接焊接在诸如半导体集成电路元件的发热构件的背面。 为了配置剩余焊料，本发明具有形成在冷却部件处的第一金属化部分，其大于形成在与第一金属化部件焊接的半导体集成电路元件的背面的第二金属化部分。

公开(公告)号：US5047837A

公开(公告)日：1991-09-10

申请号：US388943

申请日：1989-08-03

申请人： Makoto Kitano ,  Takahiro Daikoku ,  Sueo Kawai ,  Ichio Shimizu ,  Kazuo Yamazaki ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi

发明人： Makoto Kitano ,  Takahiro Daikoku ,  Sueo Kawai ,  Ichio Shimizu ,  Kazuo Yamazaki ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi

IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/3672 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815

摘要： A packaged semiconductor device having heat transfer leads carrying a semiconductor chip directly or indirectly through a chip pad and extended to the exterior of the plastic or ceramics seal of the package, and a heat transfer cap held in surface contact with the extended heat transfer leads and covering upper side of the package. The heat generated in the semiconductor chip is transmitted to the upper side of the package and to the printed circuit board only through metallic parts so that the heat transfer is enhanced to remarkably reduce thermal resistance, thus enabling packaging of a semiconductor chip having a large heat generation rate.

摘要翻译： 一种封装的半导体器件，其具有直接或间接通过芯片焊盘并延伸到封装的塑料或陶瓷密封件的外部的半导体芯片的传热引线，以及与扩展的传热引线保持表面接触的传热盖， 覆盖包装的上侧。 在半导体芯片中产生的热量仅通过金属部件传输到封装的上侧和印刷电路板，从而增强了传热，显着降低了热阻，从而能够封装具有大的热量的半导体芯片 发电率。