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公开(公告)号：US06351384B1
公开(公告)日：2002-02-26
申请号：US09637468
申请日：2000-08-11
IPC分类号： H05K720
CPC分类号： F28F3/02 , F28F3/12 , F28F13/12 , H01L23/3672 , H01L23/473 , H01L2224/16225 , H01L2224/73253 , H01L2924/00014 , H01L2924/09701 , H01L2224/0401
摘要： A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.
摘要翻译： 提供了同时有效地降低LSI芯片的温度上升的多芯片模块冷却装置，并且其具有优异的多芯片模块的生产率，例如其组装和拆卸能力。 多芯片模块包括用于去除由它们产生的热量的半导体器件和密封顶板。 密封顶板具有多个平行的冷却通道和部分横跨冷却通道延伸的多个横向槽。 冷却通道覆盖有冷却通道盖，其在其内壁上设置有湍流促进剂。 当冷却通道盖被放置在密封顶板上方时，湍流促进器与十字槽接合。 湍流促进剂位于相邻半导体器件之间的中间位置。
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公开(公告)号：US5774334A
公开(公告)日：1998-06-30
申请号：US520338
申请日：1995-08-28
申请人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
发明人： Keizo Kawamura , Noriyuki Ashiwake , Takahiro Daikoku , Akio Idei , Kenichi Kasai , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Shigeyuki Sasaki
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.
摘要翻译： 半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。 两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。 两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。 作为导热介质的液体封装在半导体模块中。 半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。 此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。 通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。
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公开(公告)号：US5705850A
公开(公告)日：1998-01-06
申请号：US290155
申请日：1994-08-15
申请人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
发明人： Noriyuki Ashiwake , Takahiro Daikoku , Kenichi Kasai , Keizou Kawamura , Hideyuki Kimura , Atsuo Nishihara , Toshio Hatada , Toshiki Iino
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473 , H01L21/10 , H01L23/34 , H02B1/00 , H02B1/01
CPC分类号： H01L23/4338 , H01L2224/16 , H01L2224/73253
摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
摘要翻译： 所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。 为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。 散热器一体地形成在壳体上。 利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。
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公开(公告)号：US5270572A
公开(公告)日：1993-12-14
申请号：US903458
申请日：1992-06-24
申请人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
发明人： Tadakatsu Nakajima , Shigeo Ohashi , Heikichi Kuwahara , Noriyuki Ashiwake , Motohiro Sato , Toshio Hatsuda , Takahiro Daikoku , Toshio Hatada , Shigeyuki Sasaki , Hiroshi Inouye , Atsuo Nishihara , Kenichi Kasai
IPC分类号： H01L23/44 , H01L23/473 , H05K7/20 , H01L23/02 , H01L25/04
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/12044
摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.
摘要翻译： 一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件 。 每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。 该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。
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公开(公告)号：US09078376B2
公开(公告)日：2015-07-07
申请号：US13811497
申请日：2011-07-25
IPC分类号： H05K7/20 , H01L23/367 , H02M7/00 , H01L23/473 , H01L23/552 , H01L25/07 , H02M7/48
CPC分类号： H05K7/20 , H01L23/367 , H01L23/473 , H01L23/552 , H01L25/072 , H01L2924/0002 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H02M7/48 , H01L2924/00
摘要： A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144. The flow passage control portion 16b is arranged in a gap formed between the flange portion 13b and the group of radiator fins 144, and introduces the cooling medium into the group of radiator fins 144 while preventing the cooling medium from flowing into gaps 51c.
摘要翻译： 电力转换装置包括：冷却基座5，其中形成有冷却介质流动的流动通道51和与流动通道51连通的开口部分50; 电源模块1; 和流路控制部16b。 功率模块1具有底部圆筒部13a，其中容纳有功率半导体元件，并且通过开口部50插入到流路51中;凸缘部13b，形成在圆筒部13a的开口上，并且是 固定在冷却基座5上，以封闭开口部分50;以及一组散热器散热片144，其安装在圆筒部分13a的外圆周表面上，具有形成在凸缘部分13b和 一组散热片144.流路控制部分16b布置在形成在凸缘部分13b和一组散热片144之间的间隙中，并且将冷却介质引入散热片144的一组中，同时防止冷却介质流动 进入间隙51c。
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公开(公告)号：US20110049976A1
公开(公告)日：2011-03-03
申请号：US12858208
申请日：2010-08-17
IPC分类号： B60L1/00
CPC分类号： H05K7/20936 , H05K7/203
摘要： An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the container forming a vapor-phase space.
摘要翻译： 一种用于车辆的电力转换器，包括输出电动机驱动电流的半导体元件，驱动半导体元件的驱动电路，控制驱动电路的控制电路，使要输入的直流电流平滑的电容器 半导体元件，容纳半导体元件的容器，驱动电路，控制电路和电容器，在容器内以气液两相平衡状态保持的制冷剂，以及将制冷剂冷凝的热交换器单元 作为液相的气相并与外部进行热交换，其中半导体元件，驱动电路，控制电路和电容器以将离开半导体元件，驱动电路，控制电路和 将电力转换器安装在车辆中时，将电容器浸入制冷剂中，将热交换器单元配置在a 容器的壁的一侧形成气相空间。
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公开(公告)号：US20110032676A1
公开(公告)日：2011-02-10
申请号：US12759824
申请日：2010-04-14
申请人： Takeshi MATSUO , Haruki Hamada , Atsuo Nishihara , Masanori Musou
发明人： Takeshi MATSUO , Haruki Hamada , Atsuo Nishihara , Masanori Musou
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L23/473 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the power module. Further, the base plate of the power module includes a metal in addition to copper to increase a hardness of the base plate, so that a deterioration of the flatness during fixing the fins with brazing is restrained.
摘要翻译： 用于通过安装在汽车上的动力转换器供给冷却水的水路平行布置，在水路上分别形成开口，散热片从开口突出，开口由电源模块的底板 。 此外，功率模块的基板除了铜之外还包括金属以增加基板的硬度，从而抑制了用钎焊固定散热片时的平坦度的劣化。
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8.发明申请SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A POWER MODULE 有权半导体功率模块，逆变器和制造功率模块的方法公开(公告)号：US20100208427A1
公开(公告)日：2010-08-19
申请号：US12707207
申请日：2010-02-17
CPC分类号： H05K7/20927 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor power module includes an insulated substrate mounting with a plurality of power semiconductor devices and a heat sink for radiating a heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the heat sink and the insulated substrate are bonded in metallic bonding with another surface opposite of one surface on which the radiation fins are formed with the base of the heat sink.
摘要翻译： 半导体功率模块包括安装有多个功率半导体器件的绝缘衬底和用于辐射由多个功率半导体器件产生的热量的散热器，其中散热器与多个功率半导体器件的一个表面上的多个辐射翅片一体地模制 通过锻造工件的平面基座，使得填充到预定形状的阴模中的金属材料被预定形状的阳模挤压，并且散热器和绝缘基板以与一个相反的另一表面的金属接合 辐射翅片与散热片的底部形成的表面。
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公开(公告)号：US06292365B1
公开(公告)日：2001-09-18
申请号：US09398036
申请日：1999-09-17
IPC分类号： H05K720
CPC分类号： H01L23/473 , H01L2224/73204 , H01L2924/09701
摘要： It is an object of the invention to provide a cooler of an electronic apparatus capable of keeping semiconductor chips at a low temperature without care of condensation and which is excellent in compactness. To achieve the above object, the present invention proposes an electronic apparatus in which a heating region is built in the multilayered wiring substrate of the semiconductor package or module on the side near to the input/output pins, the semiconductor package or module and the cooler mounted on the package or module are placed in a moisture proof case, a heat insulating material is filled in the gaps between the moisture proof case, semiconductor package or module and cooler, and a heater is provided on the outer periphery of the heat insulating material.
摘要翻译： 本发明的目的是提供一种电子设备的冷却器，其能够将半导体芯片保持在低温而不用冷凝，并且其紧凑性优异。 为了实现上述目的，本发明提出了一种电子设备，其中在靠近输入/输出引脚，半导体封装或模块和冷却器的一侧的半导体封装或模块的多层布线基板中内置加热区域 安装在包装或模块上的防潮壳体放置在防潮壳体，半导体封装件或模块与冷却器之间的间隙中，隔热材料填充在隔热材料的外周上， 。
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10.发明授权Semiconductor power module, inverter, and method of manufacturing a power module 有权半导体功率模块，逆变器及制造电源模块的方法公开(公告)号：US08472188B2
公开(公告)日：2013-06-25
申请号：US12707207
申请日：2010-02-17
CPC分类号： H05K7/20927 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.
摘要翻译： 半导体功率模块包括其上安装有多个功率半导体器件的绝缘衬底和用于散发由多个功率半导体器件产生的热量的散热器，其中散热器与多个辐射翅片在一个表面上整体模制 通过锻造工件的平面基座，使得填充到预定形状的阴模中的金属材料被预定形状的阳模挤压，并且绝缘基板通过金属接合粘结到散热片的基部的另一个表面 与其上形成有辐射翅片的散热器的基部的一个表面相对。
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