公开(公告)号：US4558395A

公开(公告)日：1985-12-10

申请号：US604003

申请日：1984-04-26

申请人： Minoru Yamada ,  Akira Masaki ,  Masakazu Yamamoto ,  Keiichirou Nakanishi ,  Takashi Nishida ,  Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Kuninori Imai

发明人： Minoru Yamada ,  Akira Masaki ,  Masakazu Yamamoto ,  Keiichirou Nakanishi ,  Takashi Nishida ,  Takahiro Daikoku ,  Fumiyuki Kobayashi ,  Kuninori Imai

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4332 ,  H01L2224/16225

摘要： A cooling module for integrated circuit chips comprising a plurality of integrated circuit chips mounted on a wiring substrate, cooling members respectively provided for integrated circuit chips, each of the cooling members having therein space for circulating the coolant, and flexible pipes connected to respective cooling members, the coolant being caused to flow into or out of said space of said cooling member through the flexible pipes in order to remove heat from the integrated circuit chip.

摘要翻译： 一种用于集成电路芯片的冷却模块，包括安装在布线基板上的多个集成电路芯片，分别设置用于集成电路芯片的冷却构件，每个冷却构件具有用于使冷却剂循环的空间，以及连接到各个冷却构件的柔性管道 通过柔性管使冷却剂流入或流出所述冷却构件的所述空间，以便从集成电路芯片去除热量。

公开(公告)号：US4532770A

公开(公告)日：1985-08-06

申请号：US625241

申请日：1984-06-27

申请人： Yoshinori Hakuraku ,  Hisanao Ogata ,  Takahiro Daikoku ,  Noboru Suzuki

发明人： Yoshinori Hakuraku ,  Hisanao Ogata ,  Takahiro Daikoku ,  Noboru Suzuki

IPC分类号： F25B21/00 ,  F25B21/02

CPC分类号： F25B21/00 ,  F25B2321/0021 ,  F25B2321/0023 ,  Y02B30/66 ,  Y10S505/891

摘要： In a magnetic refrigerator comprising working substances for the magnetic refrigeration and a magnetic field generating device which magnetizes and demagnetizes these working substances, this magnetic refrigerator is provided with a plurality of superconducting coils arranged around the outer periphery of a rotor, a plurality of working substances are arranged around the periphery of said rotor, and the rotor is rotated so that the strength of magnetic fields impressed on the working substances is varied.

摘要翻译： 在包含用于磁性制冷的工作物质的磁性制冷机和对这些工作物质进行磁化和去磁的磁场产生装置中，该磁性制冷机具有设置在转子的外周周围的多个超导线圈，多个工作物质 布置在所述转子的周边周围，并且转子旋转，使得施加在工作物质上的磁场的强度变化。

公开(公告)号：US4166498A

公开(公告)日：1979-09-04

申请号：US815028

申请日：1977-07-12

申请人： Kunio Fujie ,  Wataru Nakayama ,  Takahiro Daikoku ,  Shigeki Hirasawa ,  Kimio Kakizaki

发明人： Kunio Fujie ,  Wataru Nakayama ,  Takahiro Daikoku ,  Shigeki Hirasawa ,  Kimio Kakizaki

IPC分类号： F25B39/04 ,  F28F13/02 ,  F28F13/04 ,  F28B9/08 ,  F28F3/04 ,  F28F13/18

CPC分类号： F28F13/04

摘要： A condensing, a heat-transfer wall for liquefying vapor having a temperature higher than the wall by bringing the vapor in contact therewith. There are provided many parallel grooves in the basic surface of the heat-transfer wall, thereby defining ridge portions or build-up portions thereamong. These ridge portions have their tip portions tapered at sharp acute angle. Recessed or concave portions are provided in the tip portions of these ridge portions, and these recessed portions have their surfaces inclined to the basic surface of the heat-transfer wall. The width of the respective grooves ranges from 0.05 to 2.5 mm, and the depth thereof is not more than 10 mm. The thickness of the respective ridge portions ranges from 0.01 to 2.5 mm, and the height there of is not more than 10 mm. The depth of the recessed portions ranges from 0.02 to 0.8 times the depth of the grooves, and the pitch of recessed portion is not more than 2.0 mm. The width of the tip portions of the portions is 0.01 to 1.0 times the pitch of the recessed portions.

摘要翻译： 冷凝物，通过使蒸气与其接触而液化具有高于壁温度的蒸气的传热壁。 在传热壁的基面上设有许多平行的凹槽，从而在其之间形成脊部或组合部分。 这些脊部的尖端部分以锐角锐化。 在这些脊部的前端设置有凹部或凹部，这些凹部的表面倾斜于传热壁的基面。 各槽的宽度为0.05〜2.5mm，其深度为10mm以下。 各脊部的厚度为0.01〜2.5mm，高度为10mm以下。 凹部的深度为凹槽深度的0.02〜0.8倍，凹部的间距为2.0mm以下。 这些部分的前端部的宽度为凹部的间距的0.01〜1.0倍。

公开(公告)号：US06351384B1

公开(公告)日：2002-02-26

申请号：US09637468

申请日：2000-08-11

申请人： Takahiro Daikoku ,  Junri Ichikawa ,  Atsuo Nishihara ,  Kenichi Kasai

发明人： Takahiro Daikoku ,  Junri Ichikawa ,  Atsuo Nishihara ,  Kenichi Kasai

IPC分类号： H05K720

CPC分类号： F28F3/02 ,  F28F3/12 ,  F28F13/12 ,  H01L23/3672 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2224/0401

摘要： A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.

摘要翻译： 提供了同时有效地降低LSI芯片的温度上升的多芯片模块冷却装置，并且其具有优异的多芯片模块的生产率，例如其组装和拆卸能力。 多芯片模块包括用于去除由它们产生的热量的半导体器件和密封顶板。 密封顶板具有多个平行的冷却通道和部分横跨冷却通道延伸的多个横向槽。 冷却通道覆盖有冷却通道盖，其在其内壁上设置有湍流促进剂。 当冷却通道盖被放置在密封顶板上方时，湍流促进器与十字槽接合。 湍流促进剂位于相邻半导体器件之间的中间位置。

公开(公告)号：US06281575B1

公开(公告)日：2001-08-28

申请号：US09348260

申请日：1999-07-07

申请人： Toru Nishikawa ,  Masahide Harada ,  Kaoru Katayama ,  Takeshi Miitsu ,  Takayuki Uda ,  Takahiro Daikoku

发明人： Toru Nishikawa ,  Masahide Harada ,  Kaoru Katayama ,  Takeshi Miitsu ,  Takayuki Uda ,  Takahiro Daikoku

IPC分类号： H01L2310

CPC分类号： H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2224/0401

摘要： A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.

摘要翻译： 多芯片模块具有用于在焊接部分处设置大量剩余焊料的结构。 在该多芯片模块中，冷却构件（结构）直接焊接在诸如半导体集成电路元件的发热构件的背面。 为了配置剩余焊料，本发明具有形成在冷却部件处的第一金属化部分，其大于形成在与第一金属化部件焊接的半导体集成电路元件的背面的第二金属化部分。

公开(公告)号：US5705850A

公开(公告)日：1998-01-06

申请号：US290155

申请日：1994-08-15

申请人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Kenichi Kasai ,  Keizou Kawamura ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Toshiki Iino

发明人： Noriyuki Ashiwake ,  Takahiro Daikoku ,  Kenichi Kasai ,  Keizou Kawamura ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Toshiki Iino

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/473 ,  H01L21/10 ,  H01L23/34 ,  H02B1/00 ,  H02B1/01

CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

摘要： The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

摘要翻译： 所公开的发明的目的在于提供一种具有高吸收热变形能力的半导体模块结构，散热能力优异，能够容易地进行维护操作。 为此，在本发明的半导体模块中，提供了热导体构件，其各自具有与半导体器件或壳体的内表面接触的区域并且具有相对的传热表面。 散热器一体地形成在壳体上。 利用这种结构，可以吸收由高的发热密度设计引起的大的热变形，并且同时可以有效地辐射来自半导体器件的热量。

公开(公告)号：US5558493A

公开(公告)日：1996-09-24

申请号：US477653

申请日：1995-06-07

申请人： Yutaka Hayashi ,  Mitsuo Miyamoto ,  Michihito Watarai ,  Takayuki Atarashi ,  Tetsuya Tanaka ,  Toshio Hatada ,  Yoshihiro Takada ,  Takahiro Daikoku

发明人： Yutaka Hayashi ,  Mitsuo Miyamoto ,  Michihito Watarai ,  Takayuki Atarashi ,  Tetsuya Tanaka ,  Toshio Hatada ,  Yoshihiro Takada ,  Takahiro Daikoku

IPC分类号： F25D1/00 ,  C04B28/18 ,  F04D29/42 ,  H05K7/20 ,  F04D29/66

CPC分类号： F04D29/4213

摘要： A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.

摘要翻译： 一种强制用空气冷却装置，其特征在于，具有鼓风机，所述鼓风机用于将鼓风机从壳体或机架上进行操作的设备中，从鼓风机的进气表面或进气口吸入的空气吹向电子设备，其中， 装置具有垂直于入口表面垂直相交的流动调节板，其紧靠在进气表面之前安装。 通过这种结构，可以防止在进气表面附近的涡流流动，从鼓风机获得的冷却能力最优化，从而达到能够有效地冷却电子设备的效果，而不需要在进气表面 的鼓风机和安装有鼓风机的框架或壳体的壁面相比，与同一设备的常规安装相比，在没有流量调节板的情况下。

公开(公告)号：US5515912A

公开(公告)日：1996-05-14

申请号：US664605

申请日：1991-03-04

申请人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

发明人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/34

CPC分类号： H01L23/4338 ,  H01L2224/16225

摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

摘要翻译： 一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散 并去除电子设备中产生的热量。 为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的沟槽宽度更大的宽度，并且还更大 比形成在导热构件上的翅片之间的槽宽度大。 在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位 这个设置空间。

公开(公告)号：US5270572A

公开(公告)日：1993-12-14

申请号：US903458

申请日：1992-06-24

申请人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

发明人： Tadakatsu Nakajima ,  Shigeo Ohashi ,  Heikichi Kuwahara ,  Noriyuki Ashiwake ,  Motohiro Sato ,  Toshio Hatsuda ,  Takahiro Daikoku ,  Toshio Hatada ,  Shigeyuki Sasaki ,  Hiroshi Inouye ,  Atsuo Nishihara ,  Kenichi Kasai

IPC分类号： H01L23/44 ,  H01L23/473 ,  H05K7/20 ,  H01L23/02 ,  H01L25/04

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/12044

摘要： A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

摘要翻译： 一种半导体冷却单元，用于将冷却介质直接喷射到用于高速计算机等的半导体器件的表面上，以有效地从半导体器件移除热量，其中用于将空间分隔成半导体器件放置的区域的分隔构件 。 每个分隔区域在其顶侧具有开口，并且通过所述开口供给或排出冷却介质的管设置成朝向每个半导体器件的背面的中心部分突出。 该管也用于将冷却介质供应集管或冷却介质返回集管分成一部分，从而可以平滑地去除从半导体器件表面产生的气泡，从而冷却介质可以顺利地流动到半导体器件上。

公开(公告)号：US5047837A

公开(公告)日：1991-09-10

申请号：US388943

申请日：1989-08-03

申请人： Makoto Kitano ,  Takahiro Daikoku ,  Sueo Kawai ,  Ichio Shimizu ,  Kazuo Yamazaki ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi

发明人： Makoto Kitano ,  Takahiro Daikoku ,  Sueo Kawai ,  Ichio Shimizu ,  Kazuo Yamazaki ,  Asao Nishimura ,  Hideo Miura ,  Akihiro Yaguchi

IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/3672 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815

摘要： A packaged semiconductor device having heat transfer leads carrying a semiconductor chip directly or indirectly through a chip pad and extended to the exterior of the plastic or ceramics seal of the package, and a heat transfer cap held in surface contact with the extended heat transfer leads and covering upper side of the package. The heat generated in the semiconductor chip is transmitted to the upper side of the package and to the printed circuit board only through metallic parts so that the heat transfer is enhanced to remarkably reduce thermal resistance, thus enabling packaging of a semiconductor chip having a large heat generation rate.

摘要翻译： 一种封装的半导体器件，其具有直接或间接通过芯片焊盘并延伸到封装的塑料或陶瓷密封件的外部的半导体芯片的传热引线，以及与扩展的传热引线保持表面接触的传热盖， 覆盖包装的上侧。 在半导体芯片中产生的热量仅通过金属部件传输到封装的上侧和印刷电路板，从而增强了传热，显着降低了热阻，从而能够封装具有大的热量的半导体芯片 发电率。