公开(公告)号：US20070189986A1

公开(公告)日：2007-08-16

申请号：US10591588

申请日：2005-03-01

申请人： Xing Wang ,  Akira Okada

发明人： Xing Wang ,  Akira Okada

IPC分类号： A61K8/26 ,  C01F7/00 ,  C07F5/06 ,  C09B63/00

CPC分类号： B01J20/08 ,  C01P2004/61 ,  C07C59/01 ,  C07C59/08 ,  C07C59/255 ,  C07C59/265 ,  C07C65/03 ,  C08K5/098 ,  C09B67/0097 ,  C09B67/0098 ,  C09C1/40

摘要： There are provided organic acid anion containing aluminum salt hydroxide particles represented by the following general formula (I): Ma[Al1−xM′x]bAzBy(OH)n.mH2O  (I) (wherein M is at least one cation selected from the group consisting of Na+, K+, NH4+ and H3O+, M′ is at least one metal cation selected from the group consisting of Cu2+, Zn2+, Ni2+, Sn4+, Zr4+, Fe2+, Fe3+ and Ti4+, A is at least one organic acid anion, B is at least one inorganic acid anion, and a, b, m, n, x, y and z satisfy 0.7≦a≦1.35, 2.7≦b≦3.3, 0≦m≦5, 4≦n≦7, 0≦x≦0.6, 1.7≦y≦2.4, and 0.001≦z≦0.5, respectively.) The particles are in the shape of grains, pairs, rectangular parallelepiped, disks (go stones), hexagonal plates, rice grains or cylinders and have a uniform particle diameter.

摘要翻译： 提供由以下通式（I）表示的含有铝盐氢氧化物颗粒的有机酸阴离子：<？in-line-formula description =“In-line formula”end =“lead”？> [A1] 1-x M'x B B （OH）N 2 O（I）<βin-line-formula description =“In-line formula”end =“tail”？>（其中 M是至少一种阳离子，选自Na +，H +，SO 4 +和H 3+， M'是至少一种选自Cu 2+，Zn 2+，Ni 2+的金属阳离子， SUP> 2 +，Sn 4+，Zr 4 +，Fe 2+，Fe 3+， SUP>和Ti 4+，A是至少一种有机酸阴离子，B是至少一种无机酸阴离子，a，b，m，n，x，y和z满足0.7 < a <= 1.35,2.7 <= b <= 3.3,0 <= m <= 5,4 <= n <= 7,0 <= x <= 0.6,1.7 <= y <= 2.4和0.001 <= z <= 0.5。）颗粒呈颗粒状，成对 s，长方体，圆盘（石头），六角形板，米粒或圆筒，粒径均匀。

公开(公告)号：US07049539B2

公开(公告)日：2006-05-23

申请号：US10400602

申请日：2003-03-27

申请人： Yoshiyuki Uno ,  Akira Okada ,  Kensuke Uemura ,  Raharjo Purwadi

发明人： Yoshiyuki Uno ,  Akira Okada ,  Kensuke Uemura ,  Raharjo Purwadi

IPC分类号： B23P9/00

CPC分类号： G21K5/04

摘要： Method for surface treating a die made of metal in which a low energy, pulsed electron beam, which does not scatter, performs a treatment over a wide area due to presence of anode plasma in a chamber in which the electron beam is formed to smooth and gloss a surface of the die and increase a surface hardness and corrosion resistance of the die. The irradiation may be performed with an energy density not less than 1 J/cm2 per pulse, at least 5 pulse irradiations and a pulse duration of at least 1 μs. A die subjected to the surface treatment method exhibits improved surface smoothness and glossiness, as well as high corrosion resistance.

摘要翻译： 用于表面处理由金属制成的管芯的方法，其中不散射的低能量的脉冲电子束由于在其中形成电子束平滑的室中存在阳极等离子体而在广泛的区域上进行处理， 光泽模具的表面并增加模具的表面硬度和耐腐蚀性。 照射可以以每脉冲1J / cm 2以上的能量密度进行，至少5次脉冲照射和至少1μs的脉冲持续时间。 经受表面处理方法的模具表现​​出改善的表面光滑度和光泽度以及高耐腐蚀性。

公开(公告)号：US07015579B2

公开(公告)日：2006-03-21

申请号：US10765999

申请日：2004-01-29

申请人： Akira Okada ,  Mitsuru Sato

发明人： Akira Okada ,  Mitsuru Sato

IPC分类号： H01L23/48

CPC分类号： G06K9/0002 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

公开(公告)号：US06883157B2

公开(公告)日：2005-04-19

申请号：US10299334

申请日：2002-11-19

申请人： Hideaki Matsumoto ,  Yasuhiro Teshima ,  Akira Okada

发明人： Hideaki Matsumoto ,  Yasuhiro Teshima ,  Akira Okada

IPC分类号： G06F17/50 ,  H05K1/02 ,  H05K3/00

CPC分类号： G06F17/5077 ,  H05K1/0237 ,  H05K3/0005

摘要： The present invention relates to a BWB wiring design system, and provides a BWB transmission wiring design system capable of guaranteeing the super high-speed operation of a system composed of a BWB and a plurality of printed circuit boards mounted on the BWB. The BWB transmission wiring design system consists mainly of a manager system that manages the wiring in the entire BWB system composed of the plurality of printed circuit boards, and a designer system that designs the wiring on each of the plurality of printed circuit boards while communicating with the manager system. The manager system presents the designer system predetermined design target values relevant to the entire BWB system. Moreover, the manager system presents the designer system the result of judgment made from design information, which is sequentially distributed from the designer system, on whether the design target values can be attained. The designer system finishes a wiring design while referencing the presented design target values and the presented result of judgment.

摘要翻译： 本发明涉及一种BWB布线设计系统，并且提供一种BWB传输布线设计系统，其能够保证由BWB和安装在BWB上的多个印刷电路板构成的系统的超高速运行。 BWB传输接线设计系统主要由管理系统，管理由多个印刷电路板组成的整个BWB系统中的布线，以及设计者系统，其设计在多个印刷电路板中的每一个上的布线，同时与 经理制度。 管理系统呈现设计者系统与整个BWB系统相关的预定设计目标值。 此外，管理系统向设计者系统呈现设计信息的判断结果，该设计信息从设计者系统顺序分配，是否可以实现设计目标值。 设计者系统完成接线设计，同时参考所提出的设计目标值和所提出的判断结果。

公开(公告)号：US06808421B2

公开(公告)日：2004-10-26

申请号：US10404080

申请日：2003-04-02

申请人： Akira Okada ,  Satoshi Moriyama ,  Manabu Shimizu ,  Hideo Miyazawa

发明人： Akira Okada ,  Satoshi Moriyama ,  Manabu Shimizu ,  Hideo Miyazawa

IPC分类号： H01R13648

CPC分类号： H01R13/518 ,  H01R12/724 ,  H01R12/73 ,  H01R13/405 ,  H01R13/6585

摘要： A first connector includes a first connector body; first contacts provided in an end face of the first connector body in a matrix-like manner, each of the first contacts having a first contact point; and first shield plates provided between adjacent first contact points of the first contacts in a row direction, the first shield plates extending in a column direction of the first contact points, and shielding at least the adjacent first contact points in each row. A second connector includes a second connector body; second contacts provided in an end face of the second connector body in a matrix-like manner, each of the second contacts having a second contact point, the second contact points making contact with and being electrically connected to the first contact points; and second shield plates provided between adjacent second contact points of the second contacts in a column direction, the second shield plates extending in a row direction of the second contact points and shielding at least the adjacent second contact points in each column. At least one of the first and second shield plates are formed with slits receiving ends of the other one of the first and second shield plates. The first and second shield plates are configured and arranged to be engaged in a grid pattern by connecting the first and second connectors so that a contact part including the first and second contact points is arranged within one element defined by the grid pattern.

摘要翻译： 第一连接器包括第一连接器主体; 第一接触件以矩阵状的方式设置在第一连接器主体的端面中，每个第一接触件具有第一接触点; 以及在行方向上设置在所述第一触头的相邻的第一接触点之间的第一屏蔽板，所述第一屏蔽板在所述第一接触点的列方向上延伸，并且屏蔽至少每行中的相邻的第一接触点。 第二连接器包括第二连接器主体; 第二触点以矩阵状的方式设置在第二连接器主体的端面中，每个第二触点具有第二接触点，第二接触点与第一接触点接触并电连接; 以及第二屏蔽板，其沿着列方向设置在所述第二触点的相邻的第二接触点之间，所述第二屏蔽板沿所述第二接触点的行方向延伸并且屏蔽至少每个列中的相邻的第二接触点。 第一和第二屏蔽板中的至少一个形成有狭缝，其接收第一和第二屏蔽板中另一个的端部。 第一和第二屏蔽板被构造和布置成通过连接第一和第二连接器而接合在栅格图案中，使得包括第一和第二接触点的接触部分布置在由网格图案限定的一个元件内。

公开(公告)号：US06580173B2

公开(公告)日：2003-06-17

申请号：US09727760

申请日：2000-12-04

申请人： Akira Okada ,  Tetsuya Hiraoka ,  Kazuyuki Aiba

发明人： Akira Okada ,  Tetsuya Hiraoka ,  Kazuyuki Aiba

IPC分类号： H01L2348

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/13 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A substrate of a semiconductor device has a first surface on which a semiconductor element is fixed and a second surface opposite to the first surface. An adhesive is provided between the semiconductor element and the first surface of the substrate. At least one though hole is formed which extends between the first surface and the second surface of the substrate. A pattern member is formed on the first surface of the substrate so as to cover a part of an opening of the through hole.

摘要翻译： 半导体器件的衬底具有固定有半导体元件的第一表面和与第一表面相对的第二表面。 在半导体元件和基板的第一表面之间提供粘合剂。 形成至少一个通孔，其在衬底的第一表面和第二表面之间延伸。 在基板的第一表面上形成图形部件，以覆盖通孔的开口的一部分。

公开(公告)号：US06555611B2

公开(公告)日：2003-04-29

申请号：US09959697

申请日：2001-11-05

申请人： Tomoko Tachifuji ,  Akira Okada

发明人： Tomoko Tachifuji ,  Akira Okada

IPC分类号： C08J300

CPC分类号： B01D15/00 ,  B01J20/08 ,  C02F1/281 ,  C08G64/06 ,  C08K3/22 ,  C08K9/04 ,  C09D7/62 ,  C09D169/00

摘要： An adsorbent to an aromatic hydroxy compound, which comprises composite metal oxide solid solution particles of the following formula (1) or hydrotalcite-like composite metal hydroxide particles of the following formula (2), and a method of removing an aromatic hydroxy compound in a solvent by using the adsorbent. (Mgy1M2+y2)1−xAlxO1+0.5x  (1) (Mgy1M2+y2)1−zAlz(OH)2+a(An−)b.mH2O  (2) Provided according to the present invention is an adsorbent capable of efficiently removing an aromatic hydroxy compound from an aqueous solvent or an organic solvent containing an aromatic hydroxy compound.

摘要翻译： 芳族羟基化合物的吸附剂，其包含下式（1）的复合金属氧化物固溶体颗粒或下式（2）的水滑石状复合金属氢氧化物颗粒，以及除去下述式 通过使用吸附剂来提供溶剂。根据本发明提供了一种能够从水性溶剂或含有芳族羟基化合物的有机溶剂中有效除去芳族羟基化合物的吸附剂。

公开(公告)号：US06418661B1

公开(公告)日：2002-07-16

申请号：US09601362

申请日：2000-08-01

申请人： Hideo Takahashi ,  Akira Okada

发明人： Hideo Takahashi ,  Akira Okada

IPC分类号： C01B3326

CPC分类号： B32B27/20 ,  A01G9/1438 ,  C01F7/005 ,  C01P2002/22 ,  C01P2002/82 ,  C01P2002/84 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/12 ,  C09C1/40 ,  Y02A40/252

摘要： A hydrotalcite compound which has the excellent ability to absorb infrared rays and has excellent light transmission when contained in an agricultural film; a process for producing the compound; and an infrared absorber and an agricultural film both containing the compound. The hydrotalcite compound is characterized by retaining as the interlayer anions at least one kind of anions selected among ions of silicon-, phosphorus-, and boron-containing polymeric oxyacids and another kind of anions.

摘要翻译： 一种水滑石化合物，其具有优异的吸收红外线的能力，并且当包含在农用膜中时具有优异的透光性; 一种制备该化合物的方法; 以及含有该化合物的红外线吸收剂和农膜。 水滑石化合物的特征在于保留作为中间阴离子的至少一种阴离子选自含硅，磷和硼的聚合酸和另一种阴离子的离子。

公开(公告)号：US06287532B1

公开(公告)日：2001-09-11

申请号：US09398428

申请日：1999-09-17

申请人： Akira Okada ,  Satoko Yamashita ,  Koji Shimizu

发明人： Akira Okada ,  Satoko Yamashita ,  Koji Shimizu

IPC分类号： G01B3130

CPC分类号： H01L23/293 ,  C01F7/005 ,  C01G9/006 ,  C01P2002/22 ,  C01P2002/72 ,  C01P2002/77 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/12 ,  C01P2006/44 ,  C01P2006/80 ,  C01P2006/88 ,  H01L2924/0002 ,  H01L2924/00

摘要： Hydrotalcite compounds useful as additives to synthetic resins such as epoxy resins which are used as, in particular, sealant for semiconductor devices such as transister, IC, LSI and the like, which are characterized by having a composition represented by the formula (1) below: M1−X2+AlX3+(OH)2A2−X/2·mH2O  (1) in which M2+ is at least one of Mg2+ and Zn2+, x is a positive number in the range of 0.2≦x≦0.5, A2− is at least one of CO32− and SO42−, and m is a number in the range of 0-2, and having a uranium (U) content of not more than 10 ppb, an average secondary particle size of not more than about 3 &mgr;m and a BET specific surface area of not more than 30 m2/g.

摘要翻译： 用作合成树脂的添加剂的水滑石化合物，例如环氧树脂，其特别是用于具有由下式（1）表示的组成的特征，所述环氧树脂特别用作诸如转运器，IC，LSI等半导体器件的密封剂。 ：其中M2 +为Mg2 +和Zn2 +中的至少一种，x为0.2 <= x <= 0.5的范围内的正数，A2-为CO32-和SO42-中的至少一个，m为范围内的数 为0-2，铀（U）含量为10ppb以下，平均二次粒径为3μm以下，BET比表面积为30m 2 / g以下。

公开(公告)号：US5749548A

公开(公告)日：1998-05-12

申请号：US724273

申请日：1996-09-19

申请人： Kouji Tamura ,  Mamoru Morohashi ,  Akira Okada ,  Kenji Matsumura ,  Satoshi Hama

发明人： Kouji Tamura ,  Mamoru Morohashi ,  Akira Okada ,  Kenji Matsumura ,  Satoshi Hama

IPC分类号： F16L3/00 ,  F16L3/18 ,  F16L59/12 ,  F16L59/16 ,  F16B7/00 ,  F16M13/00

CPC分类号： F16L59/16 ,  F16L3/18 ,  F16L59/12 ,  F16L59/135

摘要： A thermal insulating support device for piping comprises a base frame constituted by a bottom plate, a pair of side plates and a pair of end plates integrally formed with each other; a support frame of a plate shape and formed with a support hole, the support frame being fixed at a bottom of the piping; and a support shaft made of resin or ceramic material extending through the support hole of the support frame and fixedly supported by the pair of side plates on the base frame, the support shaft having thermal insulation properties and mechanical strength sufficient for supporting the piping.

摘要翻译： 用于管道的绝热支撑装置包括由底板，一对侧板和一体地形成的一对端板构成的基座; 板状的支撑框架，形成有支撑孔，支撑框架固定在管道的底部; 以及由树脂或陶瓷材料制成的支撑轴，其通过支撑框架的支撑孔延伸并由基架上的一对侧板固定地支撑，支撑轴具有足以支撑管道的绝热性能和机械强度。