摘要:
A thermal insulating support device for piping comprises a base frame constituted by a bottom plate, a pair of side plates and a pair of end plates integrally formed with each other; a support frame of a plate shape and formed with a support hole, the support frame being fixed at a bottom of the piping; and a support shaft made of resin or ceramic material extending through the support hole of the support frame and fixedly supported by the pair of side plates on the base frame, the support shaft having thermal insulation properties and mechanical strength sufficient for supporting the piping.
摘要:
A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.
摘要:
A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.
摘要:
A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.
摘要:
A circuit member includes a lead frame material having a die pad, a lead part to be electrically connected with a semiconductor chip, and an outer frame configured to support the die pad and the lead part. The lead frame material includes a resin sealing region. Roughened faces 10A to 10C and 11A to 11C, each having an average roughness Ra of 0.3 μm or greater, are formed on a surface in the resin sealing region of the lead frame material. The surface of the lead frame material except for the resin sealing region is a flat and smooth face. A two-layer plated layer formed by laminating a Ni plated layer and a Pd plated layer in this order or a three-layer plated layer formed by laminating the Ni plated layer, the Pd plated layer and an Au plated layer in this order is formed on the whole surface of the lead frame material.
摘要:
The present invention is directed to vehicle communication equipment capable of transferring information using light without adding new light emitting means, and further, between a stationary apparatus and a vehicle or between vehicles. A light emitted from a signal lamp (11) of a stationarily installed traffic signal (10) or a head lamp (35) or a tail lamp (36) of a vehicle (20) is superimposed with a signal by a modulator (13), the modulated light is received by a light receiving unit (21) of the vehicle (20) side, and the received modulated light is demodulated by a decoder (22) to be displayed on a display panel (24).
摘要:
The present invention provides an insecticidal oil-based formulation, which comprises a petroleum hydrocarbon oil, a nonionic surfactant suitable for emulsifying the petroleum hydrocarbon oil, a desiccating agent and an insecticidal filamentous fungus; and a method for controlling insect pests, which comprises applying said formulation to an insect pests, a habitat of the insect pest or a plant vulnerable to the insect pest; and the like.
摘要:
There are provided a polynucleotide sequence coding for an amino acid sequence capable of preferentially producing (S)-4-bromo-3-hydroxy-butanoate by asymmetrically reducing 4-bromo-3-oxobutanoate, A DNA construct having a promoter in operative linkage with the polynucleotide sequence, a recombinant vector containing the polynucleotide sequence, a transformant, a recombinant vector and the like.
摘要:
A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.
摘要:
A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed.