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公开(公告)号：US07048609B2
公开(公告)日：2006-05-23
申请号：US11169796
申请日：2005-06-30
申请人： Tetsuji Togawa
发明人： Tetsuji Togawa
IPC分类号： B24B49/00
摘要： A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers for supplying a pressurized fluid to a plurality of pressure-controlled sections, a master pressure controller for supplying a pressurized fluid having a reference pressure, a plurality of calibration chambers corresponding to the pressure controllers. The pressure control system further includes differential-pressure detecting devices provided in the calibration chambers to detect a differential pressure between the pressurized fluid supplied from the master pressure controller and the pressurized fluid supplied from the pressure controller, and an arithmetic device configured to receive a signal from the differential-pressure detecting device and adjust an output of the pressure controller so that the above differential pressure becomes zero or approximately zero.
摘要翻译： 压力控制系统用于消除用于控制多个压力控制部分的压力的多个压力控制器的个体差异。 压力控制系统包括用于向多个压力控制部分供应加压流体的多个压力控制器，用于供应具有参考压力的加压流体的主压力控制器，对应于压力控制器的多个校准室。 压力控制系统还包括设置在校准室中的差压检测装置，用于检测从主压力控制器供给的加压流体与从压力控制器供给的加压流体之间的压力差;以及运算装置，被配置为接收信号 并且调节压力控制器的输出，使得上述压差变为零或大约为零。
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公开(公告)号：US06997782B2
公开(公告)日：2006-02-14
申请号：US10255793
申请日：2002-09-27
申请人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
发明人： Toyomi Nishi , Tetsuji Togawa , Harumitsu Saito , Manabu Tsujimura , Hiromi Yajima , Kazuaki Himukai , Shoichi Kodama , Yukio Imoto , Riichiro Aoki , Masako Watase , Atsushi Shigeta , Shiro Mishima , Gisuke Kouno
IPC分类号： B24B1/00
CPC分类号： B24B37/345 , B08B1/04 , B08B15/02 , B24B27/0023 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67017 , H01L21/67028 , H01L21/67057 , H01L21/67219
摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
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公开(公告)号：US20050107015A1
公开(公告)日：2005-05-19
申请号：US10497151
申请日：2002-12-06
申请人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
发明人： Tetsuji Togawa , Osamu Nabeya , Makoto Fukushima , Kunihiko Sakurai , Hiroshi Yoshida , Teruhiko Ichimura
CPC分类号： B24B37/30 , B24B41/061 , B24B49/105
摘要： The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus according to the present invention comprises a top ring body (2) having a receiving space therein, and a vertically movable member (206) which is vertically movable within the receiving space in the top ring body. An abutment member (209) having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane (291) of the abutment member comprises an abutment portion (291b), having a flange (291a) projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion (291c) extending upwardly from a base portion (291d) of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than the abutment portion.
摘要翻译： 本发明涉及一种用于将基板（W）例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体（2）和可在顶环体中的容纳空间内垂直移动的可垂直移动构件（206）。 具有弹性膜的抵接构件（209）附接到可升降构件的下表面。 邻接构件的弹性膜（291）包括邻接部分（291b），其具有向外突出的与基底直接或间接接触的凸缘（291a），以及从基底向上延伸的连接部分（291c） 邻接部分的凸缘的基部（291d）并且连接到可垂直移动的构件。 连接部分由具有高于邻接部分的柔性的材料制成。
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公开(公告)号：US20050054266A1
公开(公告)日：2005-03-10
申请号：US10935302
申请日：2004-09-08
申请人： Tetsuji Togawa
发明人： Tetsuji Togawa
IPC分类号： B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , B24B49/16 , F15B11/06 , G05D16/20 , H01L21/304 , B24B49/00
摘要： A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers for supplying a pressurized fluid to a plurality of pressure-controlled sections, a master pressure controller for supplying a pressurized fluid having a reference pressure, a plurality of calibration chambers corresponding to the pressure controllers. The pressure control system further includes differential-pressure detecting devices provided in the calibration chambers to detect a differential pressure between the pressurized fluid supplied from the master pressure controller and the pressurized fluid supplied from the pressure controller, and an arithmetic device configured to receive a signal from the differential-pressure detecting device and adjust an output of the pressure controller so that the above differential pressure becomes zero or approximately zero.
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公开(公告)号：US20050028931A1
公开(公告)日：2005-02-10
申请号：US10874317
申请日：2004-06-24
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304 , H01L21/306 , C23F1/00
CPC分类号： B24B37/30 , H01L21/30625
摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.
摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平坦光洁度的基板保持装置。 基板保持装置包括用于保持基板的可垂直移动的顶环体和用于限定顶环体中的压力室的弹性膜。 将涂层施加到与基底接触的弹性膜的表面上。
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公开(公告)号：US06682408B2
公开(公告)日：2004-01-27
申请号：US10026763
申请日：2001-12-27
申请人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
发明人： Kunihiko Sakurai , Tetsuji Togawa , Nobuyuki Takada , Satoshi Wakabayashi , Kenichiro Saito , Masahiko Sekimoto , Takuji Hayama , Daisuke Koga
IPC分类号： B24B100
CPC分类号： B24B37/345 , B24B37/042 , H01L21/30625
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.
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公开(公告)号：US06609962B1
公开(公告)日：2003-08-26
申请号：US09572629
申请日：2000-05-17
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B53/12
摘要： A dressing apparatus is used for dressing a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer. The dressing apparatus for dressing apparatus comprises a dresser having a dressing surface for dressing the polishing surface, and the dressing surface has an area which covers an entire area of the polishing surface.
摘要翻译： 修整装置用于修整用于抛光诸如半导体晶片的工件的抛光台的抛光表面。 修整装置的敷料装置包括具有用于修整抛光表面的修整表面的修整器，并且修整表面具有覆盖抛光表面的整个区域的区域。
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公开(公告)号：US06578891B1
公开(公告)日：2003-06-17
申请号：US09612212
申请日：2000-07-07
IPC分类号： B25J1500
CPC分类号： H01L21/67259 , B25J13/086 , B25J15/00 , B25J19/021 , H01L21/67766 , H01L21/68707 , Y10S294/907 , Y10S414/141
摘要： The present invention provides a substrate holder for holding and transferring a thin substrate, comprising a substrate support member having a recessed area for placing a thin substrate therein and substrate mount portions formed in the recessed area in the vicinity of a circumferential edge thereof. The substrate mount portions is adapted to be engaged with an outer circumferential portion of a backside of the substrate placed in the recessed area. The substrate holder further comprises a substrate detector for detecting presence or absence of the substrate in the recessed area.
摘要翻译： 本发明提供了一种用于保持和转印薄基板的基板保持器，包括：具有用于放置薄基板的凹陷区域的基板支撑构件和形成在其周缘附近的凹陷区域中的基板安装部分。 基板安装部分适于与放置在凹陷区域中的基板的背面的外周部分接合。 衬底保持器还包括用于检测凹陷区域中的衬底的存在或不存在的衬底检测器。
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公开(公告)号：US06413154B1
公开(公告)日：2002-07-02
申请号：US09582845
申请日：2000-09-11
IPC分类号： B24B2900
摘要： A polishing apparatus can produce a uniform quality of polished products by supplying a polishing solution consistently without being affected by any disturbances in the solution supply source. The polishing apparatus comprises: a polishing section for polishing a workpiece by pressing the same against a polishing tool; a solution piping assembly to be connected to an external solution supply device for transferring a polishing solution therefrom to the polishing section; and a solution suction device provided in the solution piping assembly for introducing the polishing solution from the solution supply device to the polishing section at a desired flow rate.
摘要翻译： 抛光装置可以通过一致地提供抛光溶液而不受溶液供应源中的任何干扰的影响而产生均匀的抛光产品质量。 抛光装置包括：抛光部分，用于通过将工件压在抛光工具上来抛光工件; 要连接到外部溶液供应装置的溶液管道组件，用于将抛光溶液从其上转移到抛光部分; 以及设置在所述溶液管道组件中的溶液抽吸装置，用于以期望的流速将所述抛光溶液从所述溶液供应装置引入所述抛光部分。
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公开(公告)号：US06379229B1
公开(公告)日：2002-04-30
申请号：US09572278
申请日：2000-05-17
IPC分类号： B24B704
CPC分类号： B24B53/017
摘要： A polishing apparatus has a polishing table having a polishing surface, a carrier for carrying a plate-like member and bringing the plate-like member into contact with the polishing surface, and a dresser including a dressing tool adapted to be brought into contact with the polishing surface to dress or normalize the polishing surface. The carrier is movable along a first path between a work position for bringing into contact the plate-like member with the polishing surface and a rest position. The dresser is movable along a second path between a work position for bringing the dressing tool into contact with the polishing surface and a rest position. The first and second paths have a common overlapping area. A contact prevention device is provided to prevent the carrier and the dresser from coming into contact with each other. An actuator is provided to bring the plate-like member into a condition that a predetermined area of the surface of the plate-like member extends beyond a peripheral edge of the polishing surface.
摘要翻译： 抛光装置具有：具有研磨面的研磨台，承载板状构件的载体，使该板状构件与研磨面接触;以及修整器，其包括修整工具，其适于与 抛光表面以使抛光表面穿着或标准化。 托架可沿着用于使板状构件与抛光表面接触的工作位置与静止位置之间的第一路径移动。 修整器可沿用于使修整工具与抛光表面接触的工作位置和静止位置之间的第二路径移动。 第一和第二路径具有共同的重叠区域。 提供接触防止装置以防止载体和修整器彼此接触。 提供致动器以使板状构件成为板状构件的表面的预定区域延伸超过抛光表面的周边边缘的状态。
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