公开(公告)号：USD647485S1

公开(公告)日：2011-10-25

申请号：US29370407

申请日：2010-07-13

申请人： Yuichi Goto ,  Kenji Okamura

设计人： Yuichi Goto ,  Kenji Okamura

公开(公告)号：US20110089612A1

公开(公告)日：2011-04-21

申请号：US12978837

申请日：2010-12-27

申请人： YOSHIAKI IKUTA ,  Yasutomi Iwahashi ,  Kenji Okamura

发明人： YOSHIAKI IKUTA ,  Yasutomi Iwahashi ,  Kenji Okamura

IPC分类号： B29C35/08 ,  B29C59/02

CPC分类号： B29C33/38 ,  B82Y10/00 ,  B82Y40/00 ,  C03C3/06 ,  C03C2201/12 ,  C03C2201/42 ,  G03F7/0002

摘要： An object of the present invention is to provide a TiO2-containing quartz glass substrate which, when used as a mold base for nanoimprint lithography, can form a concavity and convexity pattern having a dimensional variation falling within ±10%. The invention relates to a TiO2-containing quartz glass substrate: in which a coefficient of thermal expansion in the range of from 15 to 35° C. is within ±200 ppb/° C.; a TiO2 concentration is from 4 to 9 wt %; and a TiO2 concentration distribution, in a substrate surface on the side where a transfer pattern is to be formed, is within ±1 wt %.

摘要翻译： 本发明的目的是提供一种含TiO 2的石英玻璃基板，其用作纳米压印光刻用的模具基底时，可以形成尺寸变化在±10％以内的凹凸图案。 本发明涉及一种含TiO 2的石英玻璃基板，其中15至35℃范围内的热膨胀系数在±200ppb /℃以内。 TiO 2浓度为4〜9重量％。 并且在要形成转印图案的一侧的基板表面中的TiO 2浓度分布在±1重量％以内。

公开(公告)号：US20110003518A1

公开(公告)日：2011-01-06

申请号：US12867987

申请日：2009-06-10

申请人： Junichi Ono ,  Hiroki Hirai ,  Tetsuji Tanaka ,  Hiroki Shimoda ,  Takuji Otsuka ,  Kenji Okamura ,  Masaaki Tabata

发明人： Junichi Ono ,  Hiroki Hirai ,  Tetsuji Tanaka ,  Hiroki Shimoda ,  Takuji Otsuka ,  Kenji Okamura ,  Masaaki Tabata

IPC分类号： H01R4/18

CPC分类号： H01R4/203 ,  H01R4/185 ,  H01R4/62 ,  H01R13/11

摘要： Rims of an opening of each recess form a parallelogram, and comprise two first opening rims that that are parallel to a first direction and two second opening rims that are parallel to a second direction. The first opening rims of each of the recesses that are aligned along the first direction are arranged on a straight line along the first direction. The second opening rims of each of the recesses that are aligned along the second direction are arranged on a straight line along the second direction. The recesses are formed by pressing a wire barrel with a die where a plurality of protruding parts are formed so as to correspond to recesses.

摘要翻译： 每个凹部的开口的边缘形成平行四边形，并且包括平行于第一方向的两个第一开口边缘和平行于第二方向的两个第二开口边缘。 沿着第一方向排列的每个凹部的第一开口边缘沿着第一方向布置在直线上。 沿着第二方向排列的每个凹部的第二开口边缘沿着第二方向布置在直线上。 通过用形成有多个突出部分的模具按压线筒来对应于凹部来形成凹部。

公开(公告)号：US20100193478A1

公开(公告)日：2010-08-05

申请号：US12308088

申请日：2007-06-06

申请人： Shingo Mukae ,  Kenji Okamura ,  Shuichi Teramoto ,  Jun Kurobe ,  Hiroshi Asada ,  Shouji Inoue ,  Shigeo Matsubara

发明人： Shingo Mukae ,  Kenji Okamura ,  Shuichi Teramoto ,  Jun Kurobe ,  Hiroshi Asada ,  Shouji Inoue ,  Shigeo Matsubara

IPC分类号： B23K11/11

CPC分类号： B23K11/3009 ,  B23K35/0266 ,  B23K35/32 ,  C22F1/18

摘要： Provided is an electrode (1) which has a double structure including Cu or a Cu alloy as an electrode body (2) and a core material (3) made of W, Mo, a W-based alloy, or a Mo-based alloy embedded in a surface of the electrode body (2) which is abutted against a material to be welded, the core material (3) being formed by using W, Mo, the W-based alloy, or the Mo-based alloy which is in the form of a fibrous structure extended by sintering, swaging, and annealing in an electrode axis direction, the fibrous structure having a horizontal cross-sectional average particle diameter of 50 μm or more and an aspect ratio of 1.5 or more. The electrode (1) can be used as an inexpensive electrode obtained by suppressing particle dropping/attrition and defects in electrodes for spot welding, in which heat and pressure are applied repeatedly, stably enhancing durability.

摘要翻译： 提供一种具有包括Cu或Cu合金作为电极体（2）的双重结构的电极（1）和由W，Mo，W基合金或Mo基合金制成的芯材（3） 嵌入与被焊接材料抵接的电极体（2）的表面，芯材（3）通过使用W，Mo，W基合金或Mo基合金 通过在电极轴线方向进行烧结，型锻和退火而延伸的纤维结构体的形状，所述纤维结构体的水平截面平均粒径为50μm以上，纵横比为1.5以上。 电极（1）可以用作通过抑制重复施加热和压力并且稳定地提高耐久性的点焊的电极中的颗粒滴下/磨损和缺陷而获得的便宜的电极。

公开(公告)号：US20090233192A1

公开(公告)日：2009-09-17

申请号：US12475878

申请日：2009-06-01

申请人： Koji Otsuka ,  Kenji Okamura

发明人： Koji Otsuka ,  Kenji Okamura

IPC分类号： G03F1/00 ,  C23C14/00

CPC分类号： G01B9/02065 ,  C03C15/02 ,  C03C19/00 ,  C03C23/006 ,  C03C2204/08 ,  G01B9/02057 ,  G01B9/0209 ,  G01B11/30 ,  G03F1/60 ,  H01J2237/0812 ,  Y10T428/24355

摘要： The invention is to provide a method in which waviness generated on a glass substrate surface during pre-polishing is removed, thereby finishing the glass substrate so as to have a surface excellent in flatness. The invention relates to a method for finishing a pre-polished glass substrate surface using any one of processing methods selected from the group consisting of ion beam etching, gas cluster ion beam etching and plasma etching, the glass substrate being made of quartz glass that contains a dopant and comprises SiO2 as a main component, and the method for finishing a pre-polished glass substrate surface including: a step of measuring flatness of the glass substrate surface using a shape measurement unit that comprises: a low-coherent light source whose outgoing light flux has a coherence length shorter than twice an optical distance between front and back surfaces of the glass substrate; a path match route part that divides the outgoing light flux from the low-coherent light source into two light fluxes, causes one of the two light fluxes to make a detour by a given optical path length relative to the other light flux, and then recombines the light fluxes into a single light flux and outputs it; and an interference optical system that acquires an interference fringe which carries wave surface information of the glass substrate surface by radiating an outgoing light flux from the low-coherent light source onto a reference surface and the glass substrate surface held on a measurement optical axis and making lights returning from the reference surface and the glass substrate surface interfere with each other; and a step of measuring a concentration distribution of the dopant contained in the glass substrate, wherein processing conditions of the glass substrate surface are set up for each site of the glass substrate based on the results obtained from the step of measuring flatness of the glass substrate and the step of measuring a concentration distribution of the dopant contained in the glass substrate, and the finishing is carried out while keeping an angle formed by a normal line of the glass substrate and an incident beam onto the glass substrate surface at from 30 to 89°.

公开(公告)号：US20050221666A1

公开(公告)日：2005-10-06

申请号：US11073228

申请日：2005-03-04

申请人： Hiroshi Nakano ,  Kenji Okamura

发明人： Hiroshi Nakano ,  Kenji Okamura

IPC分类号： H01R13/73

CPC分类号： H01R12/707 ,  H01R12/57

摘要： Fixing members (30) fixable to a circuit board (K) by soldering are mounted in a housing (10). Each fixing member (30) is comprised of a main panel (31) and a solder leg (32) projecting sideways from the bottom end of the main portion (31). The solder leg (32) has solder entering holes (37) that open at a side of the solder leg (32) toward the circuit board K and at a side opposite therefrom. Each solder entering hole (37) has a cross-section that gradually increases toward both upper and lower open ends (37a, 37b). A locking portion (38) is formed on each solder entering hole (37) and bulges more inward than both open ends (37a, 37b). The locking portion (38) locks solder (H) that enters the solder entering hole (37).

摘要翻译： 通过焊接固定到电路板（K）的固定构件（30）安装在壳体（10）中。 每个固定构件（30）包括主板（31）和从主体部分（31）的底端侧向突出的焊接脚（32）。 焊料支脚（32）具有焊料进入孔（37），该焊料进入孔（37）在焊料支脚（32）的一侧朝向电路板K和与其相反的一侧开口。 每个焊料进入孔（37）具有朝着上开口端和下开口端（37a，37b）逐渐增加的横截面。 在每个焊料进入孔（37）上形成锁定部分（38），并且比两个开口端（37a，37b）更向内凸出。 锁定部分（38）锁定进入焊料进入孔（37）的焊料（H）。

公开(公告)号：US20050004290A1

公开(公告)日：2005-01-06

申请号：US10490493

申请日：2002-09-30

申请人： Yasunao Kai ,  Masahiro Yamauchi ,  Kenji Okamura

发明人： Yasunao Kai ,  Masahiro Yamauchi ,  Kenji Okamura

IPC分类号： C08K3/00 ,  C08K3/08 ,  F42B12/74 ,  C08L1/00

CPC分类号： F42B12/745 ,  C08K3/013 ,  C08K3/08 ,  C08L9/06 ,  C08L23/00 ,  C08L21/00 ,  C08L2666/52

摘要： A composite material which comprises an elastomer or vulcanized rubber and particles of a high-density material, such as tungsten, evenly dispersed therein, wherein the contents of the elastomer or vulcanized rubber and the high-density particles are 35 to 50 vol. % and 50 to 65 vol. %, respectively, based on the whole composite material, and the high-density particles have a particle composition comprising 60 to 80 vol. % coarse particles having a particle diameter of 10 to 100 μm, 10 to 20 vol. % medium particles having a particle diameter of 3 to 6 μm, and 10 to 20 vol. % fine particles having a particle diameter of 1 to 2 μm, the spaces among the coarse particles being filled with the medium particles and fine particles. The composite material is excellent in flexibility and processability and is suitable for use as a radiation-shielding sheet material, weight member, vibration-damping material, balancing member, radiating material, and shot material.

摘要翻译： 包含弹性体或硫化橡胶的复合材料以及均匀分散在其中的诸如钨的高密度材料的颗粒，其中弹性体或硫化橡胶和高密度颗粒的含量为35〜50体积％。 ％和50至65体积％ ％，基于整个复合材料，高密度颗粒具有60至80体积％的颗粒组成。 粒径为10〜100μm的粗粒子，10〜20体积％ 粒径为3〜6μm的中等粒径的微粒，10〜20体积％ 粒径为1〜2μm的微细粒子，粗粒子之间的空隙填充有中等粒子和微粒。 复合材料的柔软性和加工性优异，适合用作辐射屏蔽片材，重量件，减震材料，平衡构件，辐射材料和射出材料。

公开(公告)号：US06733325B2

公开(公告)日：2004-05-11

申请号：US10040386

申请日：2002-01-09

申请人： Yoshito Sakai ,  Hiroki Hirai ,  Kenji Okamura ,  Tomoyuki Sakata

发明人： Yoshito Sakai ,  Hiroki Hirai ,  Kenji Okamura ,  Tomoyuki Sakata

IPC分类号： H01R507

CPC分类号： H01R12/592 ,  H01R12/57 ,  H01R12/62 ,  H01R12/774 ,  H01R12/78 ,  H01R12/79

摘要： A connector assembly is provided with a connector (first connector) to be mounted on a circuit board and a connector (second connector) for holding a flat cable flat wire member). When the two connectors are connected with each other, an end portion of the cable is inserted into the connector to bring conductors of the cable into contact with mating terminals. The connector is provided with a plate-shaped holder, and the cable is supported on this holder in such a state as to be displaceable in widthwise direction. On the other hand, the connector is provided with a pair of locking pieces as a positioning portion. When the two connectors are connected with each other, the respective locking pieces directly come into contact with the cable being inserted into the connector from widthwise outer sides, thereby positioning the cable with respect to the connector in widthwise direction. The respective conductors of the flat wire member can be more precisely and securely brought into contact with the mating terminals.

摘要翻译： 连接器组件设置有要安装在电路板上的连接器（第一连接器）和用于保持扁平电缆扁线部件的连接器（第二连接器））。 当两个连接器彼此连接时，电缆的端部插入到连接器中，以使电缆的导体与配合端子接触。 连接器设置有板状保持器，并且电缆以能够在宽度方向上移位的状态支撑在该保持器上。 另一方面，连接器设置有作为定位部的一对锁定片。 当两个连接器彼此连接时，相应的锁定件直接与从宽度方向外侧插入到连接器中的电缆接触，从而使电缆相对于连接器沿宽度方向定位。 扁线部件的各导体能够更准确，牢固地与配合端子接触。

公开(公告)号：US06187623B1

公开(公告)日：2001-02-13

申请号：US09187488

申请日：1998-11-06

申请人： Toshiyuki Hirota ,  Kenji Okamura ,  Fumihide Sato

发明人： Toshiyuki Hirota ,  Kenji Okamura ,  Fumihide Sato

IPC分类号： H01L218242

CPC分类号： H01L28/92 ,  H01L28/84

摘要： In a method of manufacturing a semiconductor device in which a capacitor having a storage electrode is formed on a semiconductor substrate, silicon films are formed on the semiconductor substrate and at the same time first and second endpoint marker layers for dividing the silicon films into three parts in the direction of thickness are formed by using a material different from the material of the silicon films. The silicon films including the first and second endpoint marker layers are etched. The etching depth of the silicon films is controlled based on the type of etched material, thereby forming the storage electrode.

摘要翻译： 在制造半导体器件的方法中，其中在半导体衬底上形成具有存储电极的电容器，在半导体衬底上形成硅膜，同时在第一和第二端点标记层上形成硅膜，以将硅膜分成三部分 通过使用与硅膜的材料不同的材料形成厚度方向。 蚀刻包括第一和第二端点标记层的硅膜。 基于蚀刻材料的类型来控制硅膜的蚀刻深度，从而形成存储电极。

公开(公告)号：US5951336A

公开(公告)日：1999-09-14

申请号：US898309

申请日：1997-07-22

申请人： Satomi Seko ,  Masamitsu Chishima ,  Kenji Okamura ,  Yoshimasa Wada ,  Hiroyuki Oka

发明人： Satomi Seko ,  Masamitsu Chishima ,  Kenji Okamura ,  Yoshimasa Wada ,  Hiroyuki Oka

IPC分类号： H01R13/11 ,  H01R13/18 ,  H01R13/428 ,  H01R13/432 ,  H01R13/434

CPC分类号： H01R13/432 ,  H01R13/11 ,  H01R13/18

摘要： A protecting cover B is provided for a miniature terminal, the upper face having a lance 41 formed by shearing. This lance 41 has a pair of protecting members 42 located in the posterior side thereof, the posterior edges of the protecting members 42 being cut so as to form diagonal edges with respect to the direction of extension of the lance 41. In this way, a portion of the bending space formed under the lance 41 is surrounded by the protecting member 42, thereby preventing entry of foreign matter. As a result, bending and entanglement can be prevented. The cover may have a protruding wall 43 to provide additional protection against external forces.

摘要翻译： 为微型端子提供保护盖B，上表面具有通过剪切形成的喷枪41。 该喷枪41具有位于其后侧的一对保护构件42，保护构件42的后边缘被切割成相对于喷枪41的延伸方向形成对角边缘。以这种方式， 形成在喷枪41下面的弯曲空间的一部分被保护构件42包围，从而防止异物进入。 结果，可以防止弯曲和缠结。 盖可以具有突出壁43，以提供抵抗外力的附加保护。