公开(公告)号：US20120161322A1

公开(公告)日：2012-06-28

申请号：US13163989

申请日：2011-06-20

申请人： Shunichi Wakayanagi ,  Takayuki Saito ,  Takuya Seino ,  Akira Matsuo ,  Koji Yamazaki ,  Eitaro Morimoto ,  Yohsuke Shibuya ,  Yu Sato ,  Naomu Kitano

发明人： Shunichi Wakayanagi ,  Takayuki Saito ,  Takuya Seino ,  Akira Matsuo ,  Koji Yamazaki ,  Eitaro Morimoto ,  Yohsuke Shibuya ,  Yu Sato ,  Naomu Kitano

IPC分类号： H01L29/45 ,  H01L21/285 ,  C23C16/50

CPC分类号： H01L21/76843 ,  C23C14/0641 ,  H01L21/2855 ,  H01L21/76877 ,  H01L23/53223 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides an electronic component manufacturing method including a step of embedding a metal film. An embodiment of the present invention includes a first step of depositing a barrier layer containing titanium nitride on an object to be processed on which a concave part is formed and a second step of filling a low-melting-point metal directly on the barrier layer under a temperature condition allowing the low-melting-point metal to flow, by a PCM sputtering method while forming a magnetic field by a magnet unit including plural magnets which are arranged at grid points of a polygonal grid so as to have different polarities between the neighboring magnets.

摘要翻译： 本发明提供了一种电子部件制造方法，其包括嵌入金属膜的步骤。 本发明的一个实施方案包括在其上形成有凹部的待处理物体上沉积包含氮化钛的阻挡层的第一步骤和将低熔点金属直接填充在阻挡层下面的第二步骤 通过PCM溅射法，通过包括多个磁铁的磁体单元形成磁场，允许低熔点金属流动的温度条件，该多个磁体布置在多边形网格的网格点处，以便在相邻的 磁铁。

公开(公告)号：US08059278B2

公开(公告)日：2011-11-15

申请号：US12578997

申请日：2009-10-14

申请人： Zongtao Ge ,  Hideo Kanda ,  Takayuki Saito ,  Noboru Koizumi

发明人： Zongtao Ge ,  Hideo Kanda ,  Takayuki Saito ,  Noboru Koizumi

IPC分类号： G01B11/02

CPC分类号： G01M11/0271 ,  G01M11/025

摘要： The relative position of a test surface is sequentially changed from a reference position where a surface central axis is aligned with a measurement optical axis such that the measurement optical axis is sequentially moved to a plurality of annular regions obtained by dividing the test surface in a diametric direction. The test surface is rotated on a rotation axis whenever the relative position is changed. Measurement light composed of a plane wave is radiated to the rotating test surface, and a one-dimensional image sensor captures interference fringes at each of a plurality of rotational positions. The shape information of each annular region is calculated on the basis of the captured interference fringes at each rotational position, and the shape information is connected to calculate the shape information of the entire measurement region.

摘要翻译： 测试表面的相对位置从表面中心轴与测量光轴对准的参考位置顺序地改变，使得测量光轴顺序地移动到通过将测试表面分成直径而获得的多个环形区域 方向。 每当相对位置改变时，测试表面都会在旋转轴上旋转。 由平面波构成的测量光被照射到旋转测试表面，并且一维图像传感器在多个旋转位置中的每一个处捕获干涉条纹。 基于每个旋转位置处的捕获的干涉条纹来计算每个环形区域的形状信息，并且形状信息被连接以计算整个测量区域的形状信息。

公开(公告)号：US20100325913A1

公开(公告)日：2010-12-30

申请号：US12821456

申请日：2010-06-23

申请人： Xinming WANG ,  Kazuo Yamauchi ,  Akira Kodera ,  Tsukuru Suzuki ,  Yasushi Toma ,  Takayuki Saito ,  Hirokuni Hiyama

发明人： Xinming WANG ,  Kazuo Yamauchi ,  Akira Kodera ,  Tsukuru Suzuki ,  Yasushi Toma ,  Takayuki Saito ,  Hirokuni Hiyama

IPC分类号： F26B7/00

CPC分类号： F26B5/12 ,  F26B21/004 ,  H01L21/67028

摘要： A substrate processing method dose not use or only use the least possible amount of an organic solvent, and can quickly and completely remove a liquid from a wet substrate surface without allowing the liquid to remain on the substrate surface. The substrate processing method for drying a substrate surface which is wet with a liquid, includes: removing the liquid from the substrate surface and sucking the liquid together with its surrounding gas into a gas/liquid suction nozzle, disposed opposite the substrate surface, while relatively moving the gas/liquid suction nozzle and the substrate parallel to each other; and blowing a dry gas from a dry gas supply nozzle, disposed opposite the substrate surface, toward that area of the substrate surface from which the liquid has been removed while relatively moving the dry gas supply nozzle and the substrate parallel to each other.

摘要翻译： 不使用或仅使用尽可能少量有机溶剂的底物处理方法，并且可以快速且完全地从湿底物表面除去液体，而不会使液体残留在基材表面上。 用于干燥被液体湿润的基板表面的基板处理方法包括：从基板表面去除液体并将其周围的气体与其一起吸入与基板表面相对设置的气/液吸嘴中，同时相对 使气体/液体吸嘴和基板彼此平行移动; 并且将相对于基板表面设置的干燥气体供给喷嘴的干燥气体吹向基板表面的已被除去液体的区域，同时使干燥气体供给喷嘴和基板彼此平行地相对移动。

公开(公告)号：US07638030B2

公开(公告)日：2009-12-29

申请号：US10669468

申请日：2003-09-25

申请人： Osamu Nabeya ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Takeshi Iizumi ,  Nobuyuki Takada ,  Koichi Fukaya ,  Mitsuhiko Shirakashi ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita

发明人： Osamu Nabeya ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Takeshi Iizumi ,  Nobuyuki Takada ,  Koichi Fukaya ,  Mitsuhiko Shirakashi ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita

IPC分类号： C25F7/00 ,  B23H5/06

CPC分类号： C25F7/00

摘要： An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.

摘要翻译： 一种在完全消除CMP处理或者尽可能减少CMP处理负荷的电解处理装置可以处理和平坦化形成在基板表面上的导电材料，或者可以除去（清洁）附着的附着物 到工件（例如基板）的表面。 本发明包括一个电极部分，它包括平行设置的多个电极部件，每个电极部件包括一个电极和一个覆盖电极表面的离子交换器，一个用于保持工件的保持器，它能使工件靠近 或与电极部件的离子交换器接触，以及要连接到电极部分的每个电极部件的电极的电源。 电极构件的离子交换器包括具有优异表面平滑度的离子交换器和离子交换容量大的离子交换器。

公开(公告)号：US07538890B2

公开(公告)日：2009-05-26

申请号：US11144709

申请日：2005-06-06

申请人： Zongtao Ge ,  Takayuki Saito ,  Minoru Kurose

发明人： Zongtao Ge ,  Takayuki Saito ,  Minoru Kurose

IPC分类号： G01B11/02

CPC分类号： G01J9/02 ,  G01J1/4257 ,  G02B5/005

摘要： The light beam measurement apparatus comprises a beam splitter that divides a light beam emitted from a light source unit into two luminous fluxes, a semi-transmitting/reflecting surface that reflects part of one of the divided luminous fluxes back in the opposite direction to the direction of incidence as a sample luminous flux, and reflection-type reference light producing means that converts part of the luminous flux transmitted through the semi-transmitting/reflecting surface into a wavefront-shaped reference luminous flux and outputs this reference luminous flux; this light beam measurement apparatus can carry out both wavefront measurement and light beam spot characteristic measurement on a light beam simultaneously.

摘要翻译： 光束测量装置包括：分束器，其将从光源单元发射的光束分成两个光束;半透射/反射表面，其将一个分割光束的一部分反向与方向相反的方向 作为样品光通量的入射角，以及反射型参照光产生装置，其将通过半透射/反射表面透射的光束的一部分转换为波前参考光通量并输出该参考光通量; 该光束测量装置可以同时对光束进行波前测量和光束点特性测量。

公开(公告)号：US20080217164A1

公开(公告)日：2008-09-11

申请号：US10585739

申请日：2005-03-24

申请人： Yasushi Toma ,  Takayuki Saito ,  Kazuto Hirokawa

发明人： Yasushi Toma ,  Takayuki Saito ,  Kazuto Hirokawa

IPC分类号： C25D17/00

CPC分类号： C25F7/00 ,  B23H5/08 ,  H01L21/32125

摘要： An electrolytic processing apparatus (50) has feed electrodes (74) to feed a current to a substrate (W), an ion exchanger (76) brought into contact with the substrate (W), and process electrodes (72) to perform an electrolytic process on the substrate (W). The electrolytic processing apparatus (50) has an electrolytic processing liquid source to supply an electrolytic processing liquid between the substrate (W) and the ion exchanger (76), and a regeneration liquid supply source to supply a regeneration liquid to a regeneration liquid chambers (90a, 90b). The electrolytic processing apparatus (50) includes regeneration electrodes (84) spaced from the process electrodes (72). The feed electrode (74) has a potential higher than the process electrode (72) and the same polarity as the process electrode (72). The process electrode (72) has a potential higher than the regeneration electrode (84).

摘要翻译： 电解处理装置（50）具有将电流供给到基板（W）的馈电电极（74），与基板（W）接触的离子交换器（76），以及处理电极（72），以进行电解 在基板上的工艺（W）。 电解处理装置（50）具有电解处理液源，在基板（W）和离子交换器（76）之间供给电解处理液，再生液供给源向再生液室供给再生液 90 a，90 b）。 电解处理装置（50）包括与处理电极（72）间隔开的再生电极（84）。 馈电电极（74）的电位高于处理电极（72）并具有与处理电极（72）相同的极性。 处理电极（72）的电位高于再生电极（84）。

公开(公告)号：US20060234503A1

公开(公告)日：2006-10-19

申请号：US10564980

申请日：2004-07-28

申请人： Kaoru Yamada ,  Takayuki Saito ,  Sumio Yabe ,  Kenya Ito ,  Masayuki Kamezawa ,  Masaya Seki ,  Ichiro Katakabe ,  Yuki Inoue

发明人： Kaoru Yamada ,  Takayuki Saito ,  Sumio Yabe ,  Kenya Ito ,  Masayuki Kamezawa ,  Masaya Seki ,  Ichiro Katakabe ,  Yuki Inoue

IPC分类号： H01L21/44 ,  B65G47/91

CPC分类号： H01L21/02052 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0229 ,  B08B2203/0288 ,  C23C18/1628 ,  C25D17/001 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051

摘要： The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus (1) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder (11) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder (11). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism (303a) for moving the rollers (20).

摘要翻译： 本发明涉及在旋转诸如半导体晶片或液晶基板的基板的同时进行化学液体处理，清洁处理，干燥处理等的基板处理装置和基板处理方法。 本发明还涉及用于保持和旋转衬底的衬底保持装置。 另外，在向基板（W）供给流体的同时，对基板（W）进行处理的基板处理装置（1）具备用于保持和旋转基板（W）的基板支架（11），以及用于 从基板支架（11）吸入流体。 基板保持装置包括与基板（W）的边缘部分接触以便​​保持和旋转基板（W）的多个辊（20），以及至少一个移动机构（303a），用于 移动辊子（20）。

公开(公告)号：US20060088792A1

公开(公告)日：2006-04-27

申请号：US11255877

申请日：2005-10-24

申请人： Takeo Ishibashi ,  Takayuki Saito ,  Maya Itoh ,  Shuji Nakao

发明人： Takeo Ishibashi ,  Takayuki Saito ,  Maya Itoh ,  Shuji Nakao

IPC分类号： G03F7/00

CPC分类号： G03F7/70466 ,  G03F1/00

摘要： First, a first exposure process is performed using dipole illumination with only a grating-pattern forming region as a substantial object to be exposed. Next, a second exposure process is performed with only a standard-pattern forming region as a substantial object to be exposed. A development process is then performed to obtain a resist pattern. A mask for the first exposure process is such that a light blocking pattern is formed on the whole surface of a standard-pattern mask part corresponding to the standard-pattern forming region. A mask for the second exposure is such that a light blocking pattern is formed on the whole surface of a grating-pattern mask part corresponding to the grating-pattern forming region.

摘要翻译： 首先，使用仅具有光栅图案形成区域的偶极照明作为要暴露的实质对象来执行第一曝光处理。 接下来，仅以标准图案形成区域作为要曝光的实质物体进行第二曝光处理。 然后进行显影处理以获得抗蚀剂图案。 用于第一曝光处理的掩模使得在对应于标准图案形成区域的标准图案掩模部件的整个表面上形成遮光图案。 用于第二曝光的掩模使得在对应于光栅图案形成区域的光栅图案掩模部分的整个表面上形成遮光图案。

公开(公告)号：US20060088452A1

公开(公告)日：2006-04-27

申请号：US10541153

申请日：2004-01-29

申请人： Hajime Okura ,  Toshio Katsube ,  Takayuki Saito

发明人： Hajime Okura ,  Toshio Katsube ,  Takayuki Saito

IPC分类号： B01D50/00 ,  B01D53/50

CPC分类号： F23J15/06 ,  F23J15/02 ,  F23J15/08 ,  Y02E20/363

摘要： In an exhaust gas processing device wherein in order to efficiently outwardly discharge heat at high temperatures of about 90-150° C. released from a GGH reheater during the shutdown of a desulfurizer, to prevent damage to equipment and corrosion preventive lining material, and to ensure long-term stabilized use of the exhaust gas processing device, at least a GGH heat recovery unit, an absorption tower, a mist eliminator (M/E), and the GGH reheater are placed in a duct for exhaust gases discharged from a fire furnace, in the order named as seen from the upstream side of a flow of exhaust gases, an exhaust gas duct between the M/E and the reheater is provided with a heat radiation device or the like having a heat suppression function for suppressing dissipated heat from the reheater.

摘要翻译： 在废气处理装置中，为了在脱硫器关闭期间从GGH再热器释放的约90-150℃的高温有效地向外排出热量，以防止对设备和防腐蚀衬里材料的损坏，以及 确保废气处理装置的长期稳定使用，至少将GGH热回收单元，吸收塔，除雾器（M / E）和GGH再热器放置在用于从火中排出的废气的管道中 炉子以从废气流的上游侧看的顺序，M / E和再热器之间的排气管道设置有具有用于抑制散热的热抑制功能的散热装置等 从再热器。

公开(公告)号：US20050092351A1

公开(公告)日：2005-05-05

申请号：US10695826

申请日：2003-10-30

申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Kenya Ito ,  Masayuki Kamezawa ,  Kenji Yamaguchi

IPC分类号： B08B3/02 ,  H01L21/00

CPC分类号： H01L21/6708 ,  B08B3/02 ,  Y10S134/902

摘要： The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate W. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder 54 for holding a substrate W substantially horizontally and rotating the substrate W, and a cleaning liquid supply unit 53 having a cleaning liquid outlet 53a which is oriented from a center of the substrate W toward a peripheral portion of the substrate W with an elevation angle of not more than 45° from a surface of the substrate W. The cleaning liquid supply unit 53 supplies a cleaning liquid to the surface of the substrate W at a flow velocity of not less than 0.1 m/s.

摘要翻译： 本发明提供一种适用于腐蚀形成在基板的周边部分上的薄膜的蚀刻装置中的基板处理装置和基板处理方法。 本发明还提供一种适用于在已被蚀刻的基板上进行清洗处理的清洗装置的基板处理装置和基板处理方法。 用于蚀刻的基板处理装置包括基板保持器11，用于基本上水平地保持基板W并旋转基板W;以及处理液体供应单元15，用于将处理液体供应到正在旋转的基板W的周边部分 处理液体相对于基板W是静止的。用于清洗基板的基板处理装置包括：基板保持件54，用于基本上水平地保持基板W并旋转基板W;以及清洗液供给部 单元53具有从基板W的中心朝向基板W的周边部分取向的清洗液出口53a，其与基板W的表面具有不大于45°的仰角。清洗液供给单元 53以不小于0.1m / s的流速向基板W的表面供给清洗液。