PROCESS FOR MANUFACTURING A MEMBRANE OF SEMICONDUCTOR MATERIAL INTEGRATED IN, AND ELECTRICALLY INSULATED FROM, A SUBSTRATE
    47.
    发明申请
    PROCESS FOR MANUFACTURING A MEMBRANE OF SEMICONDUCTOR MATERIAL INTEGRATED IN, AND ELECTRICALLY INSULATED FROM, A SUBSTRATE 有权
    一种制造半导体材料膜的方法,集成在一个基板上并电绝缘

    公开(公告)号:US20080224242A1

    公开(公告)日:2008-09-18

    申请号:US12047830

    申请日:2008-03-13

    IPC分类号: H01L29/96 H01L21/02

    CPC分类号: B81C1/00158

    摘要: A process for manufacturing an integrated membrane made of semiconductor material includes the step of forming, in a monolithic body of semiconductor material having a front face, a buried cavity, extending at a distance from the front face and delimiting with the front face a surface region of the monolithic body, the surface region forming a membrane that is suspended above the buried cavity. The process further envisages the step of forming an insulation structure in a surface portion of the monolithic body to electrically insulate the membrane from the monolithic body; and the further and distinct step of setting the insulation structure at a distance from the membrane so that it will be positioned outside the membrane at a non-zero distance of separation.

    摘要翻译: 制造由半导体材料制成的集成膜的方法包括以下步骤:在具有前表面的半导体材料的整体中形成一个与前表面相距一定距离的掩埋腔, 的单体,表面区域形成悬浮在掩埋腔上方的膜。 该方法进一步设想在整体式主体的表面部分形成绝缘结构以将膜与整体式电绝缘的步骤; 以及将绝缘结构设置在离膜一定距离处的进一步和不同的步骤,使得其将以非零分离距离定位在膜的外部。

    Process for manufacturing thick suspended structures of semiconductor material
    49.
    发明申请
    Process for manufacturing thick suspended structures of semiconductor material 有权
    用于制造半导体材料的厚悬浮结构的方法

    公开(公告)号:US20070126071A1

    公开(公告)日:2007-06-07

    申请号:US11541376

    申请日:2006-09-27

    IPC分类号: H01L29/84 H01L21/00

    摘要: A process for manufacturing a suspended structure of semiconductor material envisages the steps of: providing a monolithic body of semiconductor material having a front face; forming a buried cavity within the monolithic body, extending at a distance from the front face and delimiting, with the front face, a surface region of the monolithic body, said surface region having a first thickness; carrying out a thickening thermal treatment such as to cause a migration of semiconductor material of the monolithic body towards the surface region and thus form a suspended structure above the buried cavity, the suspended structure having a second thickness greater than the first thickness. The thickening thermal treatment is an annealing treatment.

    摘要翻译: 制造半导体材料的悬浮结构的方法设想的步骤:提供具有正面的半导体材料的整体; 在所述整体式主体内形成掩埋空腔,所述掩埋腔在所述前表面的一定距离处延伸并且与所述前表面一起界定所述整体式主体的表面区域,所述表面区域具有第一厚度; 进行增稠热处理,使得整体式体的半导体材料朝向表面区域移动,从而在掩埋空腔之上形成悬浮结构,该悬浮结构的第二厚度大于第一厚度。 增稠热处理是退火处理。

    Integrated differential pressure sensor and manufacturing process thereof
    50.
    发明申请
    Integrated differential pressure sensor and manufacturing process thereof 有权
    集成差压传感器及其制造工艺

    公开(公告)号:US20060260408A1

    公开(公告)日:2006-11-23

    申请号:US11417683

    申请日:2006-05-04

    IPC分类号: B05D5/12 G01L7/08

    CPC分类号: G01L9/0045 G01L13/025

    摘要: A process for manufacturing an integrated differential pressure sensor includes forming, in a monolithic body of semiconductor material having a first face and a second face, a cavity extending at a distance from the first face and delimiting therewith a flexible membrane, forming an access passage in fluid communication with the cavity, and forming, in the flexible membrane, at least one transduction element configured so as to convert a deformation of the flexible membrane into electrical signals. The cavity is formed in a position set at a distance from the second face and delimits, together with the second face, a portion of the monolithic body. In order to form the access passage, the monolithic body is etched so as to form an access trench extending through it.

    摘要翻译: 一种用于制造集成差压传感器的方法,包括在具有第一面和第二面的半导体材料的整体中形成一个与第一面相距一定距离的空腔,并将其限定在柔性膜上,形成入口通道 与空腔流体连通,以及在柔性膜中形成至少一个换能元件,其构造成将柔性膜的变形转换为电信号。 空腔形成在距第二面一定距离处的位置,并与第二面一起界定整体式的一部分。 为了形成进入通道,对整体式主体进行蚀刻以便形成延伸通过其的通道沟槽。