公开(公告)号：US09673189B2

公开(公告)日：2017-06-06

申请号：US14924975

申请日：2015-10-28

Applicant: United Microelectronics Corp.

Inventor： Chung-Yu Huang ,  Kuan-Cheng Su ,  Tien-Hao Tang ,  Ping-Jui Chen ,  Po-Ya Lai

IPC: H01L27/02

CPC classification number: H01L27/0262 ,  H01L29/0649 ,  H01L29/0692 ,  H01L29/7436 ,  H01L29/861

Abstract: An electrostatic discharge (ESD) unit is described, including a first device, and a second device coupled to the first device in parallel. In an ESD event, the first device is turned on before the second device is turned on. The second device may be turned on by the turned-on first device to form an ESD path in the ESD event.

公开(公告)号：US09368500B2

公开(公告)日：2016-06-14

申请号：US14071670

申请日：2013-11-05

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chang-Tzu Wang ,  Yu-Chun Chen ,  Tien-Hao Tang ,  Kuan-Cheng Su

IPC: H01L27/092 ,  H01L29/78 ,  H01L27/06 ,  H01L27/02 ,  H01L21/8238

CPC classification number: H01L27/0925 ,  H01L21/823892 ,  H01L27/0274 ,  H01L27/0629 ,  H01L27/092 ,  H01L27/0924 ,  H01L29/785

Abstract: A CMOS device includes a substrate, a pMOS transistor and an nMOS transistor formed on the substrate, and a gated diode. The gated diode includes a floating gate formed on the substrate in between the pMOS transistor and the nMOS transistor and a pair of a p-doped region and an n-doped region formed in the substrate and between the pMOS transistor and the nMOS transistor. The n-doped region is formed between the floating gate and the nMOS transistor, and the p-doped region is formed between the floating gate and the pMOS transistor.

Abstract translation: CMOS器件包括衬底，pMOS晶体管和形成在衬底上的nMOS晶体管，以及门控二极管。 门控二极管包括形成在pMOS晶体管和nMOS晶体管之间的衬底上的浮置栅极和形成在衬底中以及在pMOS晶体管和nMOS晶体管之间的一对p掺杂区域和n掺杂区域。 在浮置栅极和nMOS晶体管之间形成n掺杂区域，并且在浮置栅极和pMOS晶体管之间形成p掺杂区域。

公开(公告)号：US20160043216A1

公开(公告)日：2016-02-11

申请号：US14454739

申请日：2014-08-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yi-Ning He ,  Jhih-Ming Wang ,  Lu-An Chen ,  Tien-Hao Tang ,  Kuan-Cheng Su

IPC: H01L29/78 ,  H01L29/10

CPC classification number: H01L29/7816 ,  H01L27/0248 ,  H01L27/0262 ,  H01L27/027 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/0873 ,  H01L29/0878 ,  H01L29/0882 ,  H01L29/0886 ,  H01L29/1083

Abstract: A semiconductor device is includes a substrate, a gate positioned on the substrate, and a drain region and a source region formed at two respective sides of the gate in the substrate. The drain region includes a first doped region having a first conductivity type, a second doped region having a second conductivity type, and a third doped region. The first conductivity type and the second conductivity type are complementary to each other. The semiconductor device further includes a first well region formed under the first doped region, a second well region formed under the second doped region, and a third well region formed under the third doped region. The first well region, the second well region, and the third well region all include the first conductivity type. A concentration of the second well region is different from a concentration of the third well region.

Abstract translation: 半导体器件包括衬底，位于衬底上的栅极和形成在衬底中的栅极的两个相应侧的漏极区域和源极区域。 漏区包括具有第一导电类型的第一掺杂区，具有第二导电类型的第二掺杂区和第三掺杂区。 第一导电类型和第二导电类型彼此互补。 半导体器件还包括形成在第一掺杂区下的第一阱区，形成在第二掺杂区下的第二阱区，以及形成在第三掺杂区下的第三阱区。 第一阱区域，第二阱区域和第三阱区域都包括第一导电类型。 第二阱区域的浓度不同于第三阱区域的浓度。

公开(公告)号：US09093565B2

公开(公告)日：2015-07-28

申请号：US13941555

申请日：2013-07-15

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chang-Tzu Wang ,  Ping-Chen Chang ,  Tien-Hao Tang ,  Kuan-Cheng Su

IPC: H01L21/70 ,  H01L29/861 ,  H01L21/76 ,  H01L27/02

CPC classification number: H01L27/0255 ,  H01L21/22 ,  H01L21/265 ,  H01L21/30604 ,  H01L21/76 ,  H01L21/76224 ,  H01L27/0629 ,  H01L29/0642 ,  H01L29/0649 ,  H01L29/0657 ,  H01L29/0692 ,  H01L29/1606 ,  H01L29/2003 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/785 ,  H01L29/861

Abstract: A fin diode structure and method of manufacturing the same is provided in present invention, which the structure includes a substrate, a doped well formed in the substrate, a plurality of fins of first conductivity type and a plurality of fins of second conductivity type protruding from the doped well, and a doped region of first conductivity type formed globally in the substrate between the fins of first conductivity type, the fins of second conductivity type, the shallow trench isolation and the doped well and connecting with the fins of first doped type and the fins of second doped type.

Abstract translation: 在本发明中提供了一种鳍式二极管结构及其制造方法，其结构包括：衬底，在衬底中形成的掺杂阱，多个第一导电类型的鳍和多个第二导电类型的鳍从 掺杂阱以及在第一导电类型的散热片，第二导电类型的散热片，浅沟槽隔离和掺杂阱之间的基板中全局形成的第一导电类型的掺杂区域，并与第一掺杂型的鳍片连接，以及 第二掺杂型散热片。

公开(公告)号：US20150014809A1

公开(公告)日：2015-01-15

申请号：US13941555

申请日：2013-07-15

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chang-Tzu Wang ,  Ping-Chen Chang ,  Tien-Hao Tang ,  Kuan-Cheng Su

IPC: H01L29/861 ,  H01L21/76

CPC classification number: H01L27/0255 ,  H01L21/22 ,  H01L21/265 ,  H01L21/30604 ,  H01L21/76 ,  H01L21/76224 ,  H01L27/0629 ,  H01L29/0642 ,  H01L29/0649 ,  H01L29/0657 ,  H01L29/0692 ,  H01L29/1606 ,  H01L29/2003 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/785 ,  H01L29/861

Abstract: A fin diode structure and method of manufacturing the same is provided in present invention, which the structure includes a substrate, a doped well formed in the substrate, a plurality of fins of first conductivity type and a plurality of fins of second conductivity type protruding from the doped well, and a doped region of first conductivity type formed globally in the substrate between the fins of first conductivity type, the fins of second conductivity type, the shallow trench isolation and the doped well and connecting with the fins of first doped type and the fins of second doped type.

Abstract translation: 在本发明中提供了一种鳍式二极管结构及其制造方法，其结构包括：衬底，在衬底中形成的掺杂阱，多个第一导电类型的鳍和多个第二导电类型的鳍从 掺杂阱以及在第一导电类型的散热片，第二导电类型的散热片，浅沟槽隔离和掺杂阱之间的基板中全局形成的第一导电类型的掺杂区域，并与第一掺杂型的鳍片连接，以及 第二掺杂型散热片。

公开(公告)号：US20250120185A1

公开(公告)日：2025-04-10

申请号：US18981624

申请日：2024-12-15

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Hou-Jen Chiu ,  Mei-Ling Chao ,  Tien-Hao Tang ,  Kuan-Cheng Su

IPC: H01L27/02

Abstract: An electrostatic discharge protection structure includes a semiconductor substrate, a gate structure disposed on the semiconductor substrate, a first well region of a first conductivity type disposed in the semiconductor substrate, a first doped region of the first conductivity type, a second doped region of a second conductivity type, a third doped region of the first conductivity type, and a fourth doped region of the second conductivity type. The first and second doped regions are disposed in the first well region and connected with each other. The second doped region is an emitter of a first bipolar junction transistor. The third and fourth doped regions are disposed in the semiconductor substrate and connected with each other. The third and second doped regions are located at two opposite sides of the gate structure in a first horizontal direction. The third doped region is an emitter of a second bipolar junction transistor.

公开(公告)号：US20250031458A1

公开(公告)日：2025-01-23

申请号：US18242502

申请日：2023-09-05

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ming-Te Lin ,  Wen-Chun Chang ,  Sung-Nien Kuo ,  Tzu-Chun Chen ,  Kuan-Cheng Su

IPC: H01L27/02 ,  H01L23/522

Abstract: A semiconductor structure is provided in the present invention, including a substrate, a deep N-well formed in the substrate, a first well formed in the deep N-well, a first gate formed on the first well, a first source and a first drain formed respectively at two sides of the first gate in the first well, a first doped region formed in the first well, and a metal interconnect electrically connected with the first source and the first doped region, wherein an area of the deep N-well multiplied by a first parameter is a first factor, an area of the first gate multiplied by a second parameter is a second factor, and an area of the metal interconnect divided by a sum of the first factor and the second factor is less than a specification value.

公开(公告)号：US20240162218A1

公开(公告)日：2024-05-16

申请号：US18164622

申请日：2023-02-06

Applicant: United Microelectronics Corp.

Inventor： Chih Hsiang Chang ,  Mei-Ling Chao ,  Yin-Chia Tsai ,  Tien-Hao Tang ,  Kuan-Cheng Su

IPC: H01L27/02 ,  H01L21/84

CPC classification number: H01L27/0255 ,  H01L21/84 ,  H01L27/0259 ,  H01L27/0266 ,  H01L27/0292 ,  H01L27/0296

Abstract: An electrostatic discharge device including a gate structure, a plurality of first doped regions, and a plurality of second doped regions. The gate structure is disposed on a substrate. The gate structure includes a body part and a plurality of extension parts. The extension parts are connected with the body part, and an extension direction of the body part is different from an extension direction of the extension parts. The first doped regions are located in the substrate between the extension parts. The second doped regions are located in the substrate at two outer sides of the extension parts. The first doped regions and the second doped regions have different conductivity types.

公开(公告)号：US20230326919A1

公开(公告)日：2023-10-12

申请号：US17742392

申请日：2022-05-11

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Hou-Jen Chiu ,  Mei-Ling Chao ,  Tien-Hao Tang ,  Kuan-Cheng Su

IPC: H01L27/02

CPC classification number: H01L27/0259

Abstract: An electrostatic discharge protection structure includes a semiconductor substrate, a gate structure disposed on the semiconductor substrate, a first well region of a first conductivity type disposed in the semiconductor substrate, a first doped region of the first conductivity type, a second doped region of a second conductivity type, a third doped region of the first conductivity type, and a fourth doped region of the second conductivity type. The first and second doped regions are disposed in the first well region and connected with each other. The second doped region is an emitter of a first bipolar junction transistor. The third and fourth doped regions are disposed in the semiconductor substrate and connected with each other. The third and second doped regions are located at two opposite sides of the gate structure in a first horizontal direction. The third doped region is an emitter of a second bipolar junction transistor.

公开(公告)号：US20200235088A1

公开(公告)日：2020-07-23

申请号：US16844986

申请日：2020-04-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chung-Yu Huang ,  Kuan-Cheng Su ,  Tien-Hao Tang ,  Ping-Jui Chen ,  Po-Ya Lai

IPC: H01L27/02 ,  H01L27/088 ,  H01L29/78 ,  H01L29/06 ,  H01L29/08 ,  H01L29/423

Abstract: An ESD protection semiconductor device includes a substrate. A gate set disposed on the substrate. A plurality of source fins and a plurality of drain fins having a first conductivity type are disposed in the substrate respectively at two sides of the gate set. A first doped fin is disposed in the substrate and positioned in between the source fins and spaced apart from the source fins. The first doped fin comprises a second conductivity type that is complementary to the first conductivity type. A second doped fin is formed in one of the drain fins and isolated from the one of the drain fins by an isolation structure. The second doped fin is electrically connected to the first doped fin.