Optically pumped semiconductor laser device
    41.
    发明授权
    Optically pumped semiconductor laser device 有权
    光泵浦半导体激光器件

    公开(公告)号:US06973113B2

    公开(公告)日:2005-12-06

    申请号:US10444800

    申请日:2003-05-23

    摘要: An optically pumped semiconductor laser device having a substrate (1) having a first main area (2) and a second main area (3), with at least one pump laser (11) being arranged on the first main area (2). The semiconductor laser device comprises a vertically emitting laser (4) having a resonator having a first mirror (9) being arranged on the side of the first main area (2) and a second mirror (20) being arranged on the side of the second main area (3) of the substrate (1).

    摘要翻译: 一种光泵浦半导体激光装置,其具有具有第一主区域(2)和第二主区域(3)的基板(1),其中至少一个泵浦激光器(11)布置在第一主区域(2)上。 半导体激光器件包括具有谐振器的垂直发射激光器(4),该谐振器具有布置在第一主区域(2)侧面上的第一反射镜(9)和布置在第二主体侧面上的第二反射镜(20) 基板(1)的主区域(3)。

    Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip
    43.
    发明申请
    Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip 有权
    辐射发射和接收半导体芯片及其制造方法

    公开(公告)号:US20050110026A1

    公开(公告)日:2005-05-26

    申请号:US10951525

    申请日:2004-09-28

    CPC分类号: H01L27/15 H01L31/173

    摘要: A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction (1) for emitting radiation and a second semiconductor layer construction (2) for receiving radiation, which are arranged in a manner spaced apart from one another on a common substrate (3) and have at least one first contact layer (4). The first semiconductor layer construction (1) has an electromagnetic-radiation-generating region (5) arranged between p-conducting semiconductor layers (6) and n-conducting semiconductor layers (7) of the first semiconductor layer construction (1). A second contact layer (8) is at least partially arranged on that surface of the first semiconductor layer construction (1) which is remote from the substrate (3) and that of the second semiconductor layer construction (2). The second semiconductor layer construction (2) has an electromagnetic-radiation-absorbing region (9), the composition of the radiation-generating region (5) being different from that of the radiation-absorbing region (9).

    摘要翻译: 辐射发射和接收半导体部件至少具有用于发射辐射的第一半导体层结构(1)和用于接收辐射的第二半导体层结构(2),所述第二半导体层结构(2)以彼此间隔开的方式布置 公共衬底(3)并且具有至少一个第一接触层(4)。 第一半导体层结构(1)具有布置在第一半导体层结构(1)的p导电半导体层(6)和n导电半导体层(7)之间的电磁辐射产生区域(5)。 第二接触层(8)至少部分地布置在远离基板(3)的第一半导体层结构(1)的表面和第二半导体层结构(2)的表面上。 第二半导体层结构(2)具有电磁辐射吸收区域(9),辐射产生区域(5)的组成与辐射吸收区域(9)的组成不同。

    Semiconductor diode and method for producing a semiconductor diode
    44.
    发明授权
    Semiconductor diode and method for producing a semiconductor diode 有权
    半导体二极管及半导体二极管的制造方法

    公开(公告)号:US08772911B2

    公开(公告)日:2014-07-08

    申请号:US13580646

    申请日:2011-02-10

    IPC分类号: H01L29/06

    摘要: A semiconductor diode has a first semiconductor layer (102) of a first conductivity type and a second semiconductor layer of a second conductivity type having a doping. The second semiconductor layer has a vertical electrical via region (106) which is connected to the first semiconductor layer and in which the doping is modified in such a way that the electrical via region (106) has the first conductivity type. A method for producing such a semiconductor diode is described.

    摘要翻译: 半导体二极管具有第一导电类型的第一半导体层(102)和具有掺杂的第二导电类型的第二半导体层。 第二半导体层具有连接到第一半导体层的垂直电通孔区域(106),并且其中掺杂被修改为使得电通孔区域(106)具有第一导电类型。 描述了制造这种半导体二极管的方法。

    Radiation-Emitting Semiconductor Chip
    45.
    发明申请
    Radiation-Emitting Semiconductor Chip 有权
    辐射发射半导体芯片

    公开(公告)号:US20110272728A1

    公开(公告)日:2011-11-10

    申请号:US12991864

    申请日:2009-04-17

    IPC分类号: H01L33/36

    摘要: A radiation-emitting semiconductor chip (1) is provided, which comprises a carrier (5), a semiconductor body (2) with a semiconductor layer sequence, a first contact (35) and a second contact (36). The semiconductor layer sequence comprises an active region (20) provided for generating radiation, which is arranged between a first semiconductor layer (21) and a second semiconductor layer (22). The carrier (5) comprises a major surface (51) facing the semiconductor body (2). The first semiconductor layer (21) is arranged on the side of the active region (20) facing the major surface (51) of the carrier (5) and is electrically contactable by means of the first contact (35). The second semiconductor layer (22) is electrically contactable by means of the second contact (36). A protection diode (4) is formed in a current path extending between the first contact (35) and the second contact (36) through the carrier (5).

    摘要翻译: 提供了一种辐射发射半导体芯片(1),其包括载体(5),具有半导体层序列的半导体本体(2),第一触点(35)和第二触点(36)。 半导体层序列包括设置在第一半导体层(21)和第二半导体层(22)之间的用于产生辐射的有源区(20)。 载体(5)包括面向半导体本体(2)的主表面(51)。 第一半导体层(21)布置在与载体(5)的主表面(51)相对的有源区域(20)的侧面上,并且可通过第一触点(35)电接触。 第二半导体层(22)可通过第二接触件(36)电接触。 保护二极管(4)形成在通过载体(5)在第一接触件(35)和第二接触件(36)之间延伸的电流通路中。

    Optoelectronic Semiconductor Chip Comprising a Reflective Layer
    46.
    发明申请
    Optoelectronic Semiconductor Chip Comprising a Reflective Layer 有权
    包含反射层的光电半导体芯片

    公开(公告)号:US20110079810A1

    公开(公告)日:2011-04-07

    申请号:US12922577

    申请日:2009-04-24

    IPC分类号: H01L33/60

    摘要: An optoelectronic semiconductor chip is specified, comprising a first contact location (1) and a second contact location (2), and a reflective layer (3), which is directly electrically conductively connected to the second contact location. The reflective layer contains a metal that tends toward migration, and the reflective layer is arranged in such a way that a migration path (4) for the metal can form between the second and the first contact location. A means (6) which, during operation of the semiconductor chip, forms an electric field that counteracts the migration of the metal is provided at the semiconductor chip.

    摘要翻译: 指定了包括第一接触位置(1)和第二接触位置(2)的光电半导体芯片,以及直接导电地连接到第二接触位置的反射层(3)。 反射层含有倾向于迁移的金属,并且反射层以这样的方式布置,使得金属的迁移路径(4)可以形成在第二和第一接触位置之间。 在半导体芯片的半导体芯片工作期间形成抵消金属迁移的电场的装置(6)。

    Light-emitting semiconductor component comprising a protective diode
    47.
    发明授权
    Light-emitting semiconductor component comprising a protective diode 有权
    包含保护二极管的发光半导体元件

    公开(公告)号:US07693201B2

    公开(公告)日:2010-04-06

    申请号:US10580969

    申请日:2004-10-26

    IPC分类号: H01S5/183 H01S5/125

    摘要: A light-emitting semiconductor component which contains a sequence of semiconductor layers (2) with an area of p-doped semiconductor layers (4) and n-doped semiconductor layers (3) between which a first pn junction (5a, 5b) is formed. The pn junction (5a, 5b) is subdivided into a light-emitting section (7) and a protective-diode section (8) in a lateral direction by means of an insulating section (6). An n-doped layer (9), which forms a second pn junction (10) which acts as a protective diode along with the p-doped area (4), is applied to the p-doped area (4) in the area of the protective-diode section (8), the first pn junction (5b) in the protective-diode section (8) having a larger area than the first pn junction (5a) in the light-emitting section (7). The protective-diode section (8) protects the light-emitting semiconductor component from voltage pulses due to electrostatic discharges (ESD).

    摘要翻译: 一种发光半导体元件,其包含具有p掺杂半导体层(4)的面积的半导体层(2)和n掺杂半导体层(3)的序列,在其间形成有第一pn结(5a,5b) 。 通过绝缘部分(6)将pn结(5a,5b)沿横向细分成发光部分(7)和保护二极管部分(8)。 形成与p掺杂区域(4)一起用作保护二极管的第二pn结(10)的n掺杂层(9)在p掺杂区域(4)的区域中被施加到p掺杂区域 保护二极管部分(8)中,保护二极管部分(8)中的第一pn结(5b)的面积大于发光部分(7)中的第一pn结(5a)的面积。 保护二极管部分(8)保护发光半导体部件免受静电放电(ESD)的电压脉冲的影响。

    Optically pumped surface emitting semiconductor laser device
    48.
    发明授权
    Optically pumped surface emitting semiconductor laser device 有权
    光学泵浦表面发射半导体激光器件

    公开(公告)号:US07633982B2

    公开(公告)日:2009-12-15

    申请号:US11140862

    申请日:2005-05-31

    IPC分类号: H01S5/00

    摘要: A surface emitting semiconductor laser device, having at least one monolithically integrated pump radiation source (20), in which the pump radiation source (20) has at least one edge emitting semiconductor structure (9) that is suitable for emission of electromagnetic radiation whose intensity profile transversely with respect to the emission direction (z) of the semiconductor structure follows a predeterminable curve. Such a surface emitting semiconductor laser device emits electromagnetic radiation having a particularly good beam quality.

    摘要翻译: 一种表面发射半导体激光器件,具有至少一个单片集成泵浦辐射源(20),其中所述泵浦辐射源(20)具有至少一个边缘发射半导体结构(9),所述边缘发射半导体结构(9)适于发射电磁辐射,所述电磁辐射的强度 相对于半导体结构的发射方向(z)横向的剖面遵循可预定的曲线。 这种表面发射半导体激光器件发射具有特别好的光束质量的电磁辐射。

    OPTOELECTRONIC SEMICONDUCTOR ELEMENT
    49.
    发明申请
    OPTOELECTRONIC SEMICONDUCTOR ELEMENT 有权
    光电子半导体元件

    公开(公告)号:US20090304039A1

    公开(公告)日:2009-12-10

    申请号:US12293057

    申请日:2007-03-15

    IPC分类号: H01S5/00 H01L33/00

    摘要: An optoelectronic semiconductor component has a semiconductor body (1) comprising a surface emitting vertical emitter region (2) comprising a vertical emitter layer (3), at least one pump source (4) provided for optically pumping the vertical emitter layer (3), and a radiation passage area (26) through which electromagnetic radiation (31) generated in the vertical emitter layer leaves the semiconductor body (1), wherein the pump source (4) and the vertical emitter layer (3) are at a distance from one another in a vertical direction.

    摘要翻译: 光电子半导体部件具有包括发射垂直发射极区域(2)的表面的半导体本体(1),所述表面发射垂直发射极区域包括垂直发射极层(3),设置用于光学泵浦垂直发射极层(3)的至少一个泵浦源(4) 和在垂直发射极层中产生的电磁辐射(31)离开半导体本体(1)的辐射通道区域(26),其中泵浦源(4)和垂直发射极层(3)距离一个距离 另一个在垂直方向。

    Method for producing a radiation-emitting-and-receiving semiconductor chip
    50.
    发明授权
    Method for producing a radiation-emitting-and-receiving semiconductor chip 有权
    辐射发射和接收半导体芯片的制造方法

    公开(公告)号:US07524687B2

    公开(公告)日:2009-04-28

    申请号:US12072365

    申请日:2008-02-26

    IPC分类号: H01L33/00

    CPC分类号: H01L27/15 H01L31/173

    摘要: A method for producing an integrated semiconductor component comprising a first semiconductor layer construction for emitting radiation and a second semiconductor layer construction for receiving radiation, wherein a substrate is first provided and a first semiconductor layer sequence containing a radiation-generating region is deposited epitaxially on the substrate. A second semiconductor layer sequence containing a radiation-absorbing region is subsequently deposited epitaxially on the first semiconductor layer sequence. The second semiconductor layer sequence is then patterned in order to uncover a first location and a second location. A first semiconductor layer construction is electrically insulated from a second semiconductor layer construction. Finally, a first contact layer is applied to a free surface of the substrate and a second contact layer is applied at least to the first and second locations for contact-connection.

    摘要翻译: 一种用于制造集成半导体部件的方法,包括用于发射辐射的第一半导体层结构和用于接收辐射的第二半导体层结构,其中首先提供衬底,并且包含辐射产生区的第一半导体层序列外延地沉积在 基质。 随后在第一半导体层序列上外延沉积包含辐射吸收区的第二半导体层序列。 然后将第二半导体层序列图案化以便露出第一位置和第二位置。 第一半导体层结构与第二半导体层结构电绝缘。 最后,将第一接触层施加到衬底的自由表面,并且至少将第二接触层施加到第一和第二位置用于接触连接。