公开(公告)号：US20050041164A1

公开(公告)日：2005-02-24

申请号：US10901559

申请日：2004-07-29

申请人： Takeshi Sato

发明人： Takeshi Sato

IPC分类号： G03B21/00 ,  B60R11/00 ,  B60R11/02 ,  F21S2/00 ,  F21S10/00 ,  F21V14/00 ,  G09F9/00 ,  G09G3/20 ,  H04N5/74 ,  H05B37/02 ,  H04N5/58

CPC分类号： H04N5/74 ,  B60R11/02 ,  B60R11/0211 ,  B60R2011/0028 ,  B60R2011/0085

摘要： A video output device includes a signal converter for generating a video signal corresponding to displayed video; a projector and a main screen for displaying the video based on the video signal output from the signal converter; left and right lighting units, a left screen, and a right screen disposed in the vicinity of the main screen; and a feature extractor, a left-lighting setting unit, and a right-lighting setting unit for controlling lighting modes of the left and right lighting units based on the content of the displayed video in synchronization with the display timing of the video.

摘要翻译： 视频输出装置包括用于产生对应于所显示的视频的视频信号的信号转换器; 投影仪和主屏幕，用于基于从信号转换器输出的视频信号显示视频; 左右照明单元，左屏幕和右屏幕，设置在主屏幕附近; 特征提取器，左照明设置单元和右照明设置单元，用于基于与视频的显示定时同步地显示的视频的内容来控制左和右照明单元的照明模式。

公开(公告)号：US06817786B2

公开(公告)日：2004-11-16

申请号：US10216362

申请日：2002-08-12

申请人： Hiroshi Sato ,  Hiroshi Sugawara ,  Sachie Morita ,  Takeshi Sato

发明人： Hiroshi Sato ,  Hiroshi Sugawara ,  Sachie Morita ,  Takeshi Sato

IPC分类号： G02B6255

CPC分类号： G02B6/2551

摘要： In a fusion splicing method and device for optical fibers, bare fibers (f) of ribbon optical fibers “F” to be spliced together are arranged, in opposite direction to each other, on a fiber setup stage (30). An interval of a pair of the discharge electrode rods (10,20) is optionally changed according to the fiber number of the bare fibers “f” of the ribbon optical fiber “F” so that all of the bare fibers “f” are set into a uniform temperature area in a discharge area, and an optimum fusion splicing process is performed according to the fiber number of the bare fibers “f”.

摘要翻译： 在一种用于光纤的熔接方法和装置中，在光纤设置台（30）上将要拼接在一起的带状光纤“F”的裸光纤（f）彼此相反地布置。 一对放电电极棒（10,20）的间隔根据带状光纤“F”的裸光纤“f”的光纤数量可选地改变，使得所有裸光纤“f”被设定 在放电区域中形成均匀的温度区域，并且根据裸光纤“f”的光纤数量进行最佳熔接处理。

公开(公告)号：US06742553B2

公开(公告)日：2004-06-01

申请号：US10677531

申请日：2003-10-03

申请人： Takeshi Sato ,  Ryouichi Sekiguchi ,  Toshiya Chiku

发明人： Takeshi Sato ,  Ryouichi Sekiguchi ,  Toshiya Chiku

IPC分类号： B65B104

CPC分类号： G07F13/10

摘要： In a cup-type beverage vending machine, during conveyance of a beverage-filled cup to a product taking-out position and when the cup does not reach the product taking-out position, a pivot arm is supported by a support roller and a cup on a cup stage is held by a holder. When the cup reaches the product taking-out position, a lower edge of the pivot arm is released from the support roller and the pivot arm and the holder are pivoted downward. Consequently, the holder is spaced downward apart from a front surface of the cup, which allows a customer to easily take out the cup.

摘要翻译： 在杯式饮料自动售货机中，在将饮料填充的杯子输送到产品取出位置期间以及当杯子未到达产品取出位置时，枢转臂由支撑辊和杯子 在杯台上由持有者持有。 当杯子到达产品取出位置时，枢转臂的下边缘从支撑辊释放，并且枢转臂和保持器向下枢转。 因此，保持器与杯的前表面向下分开，这允许顾客容易地取出杯子。

公开(公告)号：US06713143B2

公开(公告)日：2004-03-30

申请号：US10029991

申请日：2001-12-31

申请人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

发明人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

IPC分类号： B32B1504

CPC分类号： H05K1/0346 ,  B32B15/14 ,  B32B27/04 ,  C08G73/106 ,  C08K5/13 ,  C08K5/3445 ,  C08K5/34924 ,  C08K5/5455 ,  C08L79/08 ,  H05K3/4626 ,  Y10T428/12431 ,  Y10T428/14 ,  Y10T428/31663 ,  Y10T428/31721

摘要： A thermosetting low-dielectric resin composition which has a low dielectric constant and a low dielectric tangent for use in a printed circuit board and which has excellent adhesion to a metal and scatters almost no resin when used for forming a prepreg by punching or cutting, the composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups. wherein R is a hydrogen atom or methyl group.

摘要翻译： 一种热固性低电介质树脂组合物，其具有低介电常数和低介电切线，用于印刷电路板，并且当用于通过冲压或切割形成预浸料时，其对金属具有优异的粘合性并且几乎不散射树脂， 组分（a）：硅氧烷改性的聚酰亚胺，组分（b）：含有2个甲基烯丙基并具有下式（1）的化合物或含有3个烯丙基或3个甲基烯丙基并具有下式（1A ）和组分（c）：含有至少2个马来酰亚胺基团的化合物，其中R是氢原子或甲基。

公开(公告)号：US06492030B1

公开(公告)日：2002-12-10

申请号：US09647217

申请日：2000-09-28

申请人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

发明人： Takeshi Hashimoto ,  Masaharu Kobayashi ,  Takeshi Sato ,  Daisuke Orino

IPC分类号： B32B904

CPC分类号： H05K1/0346 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/12 ,  C08G73/125 ,  H01B3/306 ,  H01B3/465 ,  Y10T428/31663 ,  Y10T428/31721

摘要： The present invention relates to a thermosetting low dielectric resin composition, a laminate for use in printed wiring, a laminate for a circuit, and the like. The present invention's thermosetting low dielectric resin composition contains a specific siloxane denatured polyimide, a compound having two or more allyl or methylallyl groups, and a compound having two or more maleimide groups. This resin composition adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and demonstrates very little scattering of the resin during operational processes like punching or cutting. By using laminates or laminates for circuits that employ this resin composition, electrical signals can be propagated more quickly, enabling signals to be processed at faster speeds. In addition, the present invention can be applied to the formation of miniaturized circuit wiring, and is suitably employed in electronic devices employed in the high frequency region, and, in particular, in electronic devices that must be made smaller and lighter in weight.

摘要翻译： 本发明涉及一种热固性低电介质树脂组合物，用于印刷布线的叠层体，电路用层压体等。 本发明的热固性低介电性树脂组合物含有特定的硅氧烷改性聚酰亚胺，具有2个以上烯丙基或甲基烯丙基的化合物和具有2个以上马来酰亚胺基的化合物。 该树脂组合物非常好地粘附在具有低介电常数和低介电损耗因子的金属上，并且在诸如冲压或切割的操作过程中表现出非常小的树脂散射。 通过对采用这种树脂组合物的电路使用层压板或层压板，可以更迅速地传播电信号，从而能够以更快的速度处理信号。 此外，本发明可以应用于形成小型化的电路布线，并且适用于在高频区域中使用的电子设备中，特别是在必须制造得更小更轻的电子设备中。

公开(公告)号：US06333211B1

公开(公告)日：2001-12-25

申请号：US09383577

申请日：1999-08-25

申请人： Takeshi Sato ,  Hiromi Tokunaga ,  Kenichi Sakaguchi

发明人： Takeshi Sato ,  Hiromi Tokunaga ,  Kenichi Sakaguchi

IPC分类号： H01L2144

CPC分类号： H01L23/055 ,  H01L21/565 ,  H01L23/057 ,  H01L23/49816 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.

摘要翻译： 预成型半导体封装包括并排布置的多个引线，具有上和下公共表面，与引线一体成型的模制树脂，用于将它们从上表面和下表面固定。 模具树脂在引线的第一表面上的上侧限定了芯片安装凹部，从而将半导体芯片安装在凹部中。 引线的上表面部分地露出在凹部中，以便限定半导体芯片要被电连接到的内部连接端子。 模具树脂设置有多个孔，引线的下表面部分地露出以限定外部连接端子。

公开(公告)号：US06246646B1

公开(公告)日：2001-06-12

申请号：US09114880

申请日：1998-07-14

申请人： Hiroyuki Abe ,  Shinichi Naohara ,  Takeshi Sato ,  Alex Bradshaw ,  Kazushige Kawana ,  Hideaki Watarihana ,  Norio Matsuda ,  Kenichi Takahashi

发明人： Hiroyuki Abe ,  Shinichi Naohara ,  Takeshi Sato ,  Alex Bradshaw ,  Kazushige Kawana ,  Hideaki Watarihana ,  Norio Matsuda ,  Kenichi Takahashi

IPC分类号： G11B709

CPC分类号： G11B7/08511 ,  G11B7/0948 ,  G11B2007/0013

摘要： A focus control apparatus for a multilayer optical recording medium performs an adequate focus jump on a multilayer optical recording medium. Threshold values are set according to the amount of a level change in a focus error signal of a loaded multilayer optical recording medium, and focus jump control is conducted based on the result of comparison between the level of the focus error signal and the set threshold values. Positive and negative threshold values to be compared with the level of the focus error signal to detect a zero-crossing point of the focus error signal are set in accordance with the amount of a level change in the focus error signal, after which an acceleration operation of the focus actuator is started in response to a focus jump instruction to shift the focus position of read light for a focus jump, the acceleration operation is stopped in accordance with zero-crossing detection, a deceleration operation of the focus actuator is started thereafter and is stopped in accordance with zero-crossing detection, so that the operation returns to the focus servo operation.

摘要翻译： 用于多层光学记录介质的聚焦控制装置在多层光学记录介质上执行适当的聚焦跳跃。 根据加载的多层光学记录介质的聚焦误差信号中的电平变化量设定阈值，并且基于聚焦误差信号的电平与设定的阈值之间的比较结果进行聚焦跳跃控制 。 根据聚焦误差信号的电平变化量，设定要与聚焦误差信号的电平进行比较以检测聚焦误差信号的过零点的正和负阈值，然后加速操作 响应于聚焦跳转指令开始移动聚焦跳跃的读取光的焦点位置，根据过零检测停止加速操作，此后开始聚焦致动器的减速操作，并且 根据过零检测停止，使得操作返回到聚焦伺服操作。

公开(公告)号：US6097101A

公开(公告)日：2000-08-01

申请号：US240652

申请日：1999-01-29

申请人： Takeshi Sato ,  Kenichi Sakaguchi ,  Hiromi Tokunaga

发明人： Takeshi Sato ,  Kenichi Sakaguchi ,  Hiromi Tokunaga

IPC分类号： H01L23/055 ,  H04L3/28

CPC分类号： H01L23/055 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195

摘要： The object of the present invention is to provide a premolded-type package for a semiconductor device which can be produced easily and exhibits a good airtightness, and to provide a method for effectively producing the same. A package for a semiconductor device has a wiring substrate 32 having a resin substrate 35 which is provided on its one surface with a wiring pattern 37, a chip-mounting portion 36 and a frame-like pattern 38 of a metal surrounding the wiring pattern 37 and the chip-mounting portion 36, and on the other surface with a plurality of terminals 41 electrically connected to the wiring pattern, and a frame-like molded portion 45 of thermosetting resin, molded on the frame-like pattern 38 on the wiring substrate 32.

摘要翻译： 本发明的目的是提供一种用于半导体器件的预成型封装，其可以容易地制造并且表现出良好的气密性，并提供一种有效地制造该半导体器件的方法。 用于半导体器件的封装具有布线基板32，该布线基板32具有树脂基板35，该树脂基板35在其一个表面上设置有布线图案37，金属芯片安装部36和围绕布线图案37的金属的框状图案38 和芯片安装部36，在与布线图形电连接的多个端子41的另一面上形成有在布线基板上的框状图案38上成型的热固性树脂的框状的成型部45 32。

公开(公告)号：US5665485A

公开(公告)日：1997-09-09

申请号：US459830

申请日：1995-06-02

申请人： Tatsuo Kuwayama ,  Isamu Sekine ,  Tatsuya Okawa ,  Takeshi Sato ,  Ryuichi Takahashi

发明人： Tatsuo Kuwayama ,  Isamu Sekine ,  Tatsuya Okawa ,  Takeshi Sato ,  Ryuichi Takahashi

IPC分类号： H01M2/10

CPC分类号： H01M2/1055

摘要： A splashproof construction for a portable electronic device, comprising an electronic device main unit, and a battery pack to be mounted on the electronic device main unit, whereby one of either the electronic device main unit or the battery pack has a boundary surface formed along a combined surface and a peripheral edge and with a graded step with respect to the combined surface, and a guide rail provided adjacent to the boundary surface, and the other of either the electronic device main unit or the battery pack has a peripheral wall aligned with the boundary surface and a guide groove to be slidably engaged with the guide rail, or a bottom wall of the peripheral wall has a notch abutting on a lower surface of the graded step on the boundary surface, or a water-repellent sheet is provided at the bottom of the guide groove, or a seal plate made of a highly elastic material is provided either on an end surface of the battery pack abutted on the electronic device main unit at an end point of sliding when the battery pack is slid and mounted or on an abutment surface of the electronic device main unit in contact with the end surface.

摘要翻译： 一种用于便携式电子设备的防溅结构，包括电子设备主单元和要安装在电子设备主单元上的电池组，其中电子设备主单元或电池组中的一个具有沿着 组合表面和外围边缘，并且相对于组合表面具有渐变台阶，以及邻近边界表面设置的导轨，并且电子设备主单元或电池组中的另一个具有与 边界面和与导轨可滑动地接合的引导槽，或者周壁的底壁具有邻接在分界面的分级台阶的下表面上的切口，或者在该边界面处设置防水片 引导槽的底部或由高弹性材料制成的密封板设置在电池组件的与电子设备主单元抵接的端部的端面上 当电池组滑动并安装在电子装置主体的与端面接触的邻接表面上时滑动。

公开(公告)号：US5485822A

公开(公告)日：1996-01-23

申请号：US109765

申请日：1993-08-20

申请人： Katsuhiko Hirose ,  Takao Tate ,  Norihiko Nakamura ,  Takeshi Sato ,  Kazuhiro Iwahashi ,  Shinji Kamoshita ,  Akihiro Yamanaka

发明人： Katsuhiko Hirose ,  Takao Tate ,  Norihiko Nakamura ,  Takeshi Sato ,  Kazuhiro Iwahashi ,  Shinji Kamoshita ,  Akihiro Yamanaka

IPC分类号： F02B3/06 ,  F02D35/00 ,  F02D41/00 ,  F02D41/40 ,  F02M37/04

CPC分类号： F02D41/008 ,  F02D35/0007 ,  F02D41/408 ,  F02B2275/14 ,  F02B3/06 ,  F02D2041/0022 ,  F02D2200/0406 ,  F02D2200/0602 ,  F02D2200/0606 ,  F02D2200/063 ,  F02D2250/32 ,  F02D41/0047 ,  Y02T10/123 ,  Y02T10/44

摘要： A diesel engine has a fuel injection nozzle to which pressurized fuel is supplied from a pump. The nozzle has a pressure sensor detecting the fuel pressure and a lift sensor sensing a lift magnitude of a needle valve. An electronic control unit (ECU) computes a variation ratio of the fuel pressure value which is measured by the pressure sensor. The ECU computes a non-increasing point in an increasing part of variation ratio and judge the point to be a timing for starting the fuel injection of the nozzle. The EPU also computes the actual fuel injection amount in accordance with the fuel injection timing as well as the fuel pressure and the lift amount of the needle valve both at the various points. The EPU control the actual injection amount to be identical to a target fuel injection amount.

摘要翻译： 柴油发动机具有燃料喷射喷嘴，从泵供给加压燃料。 喷嘴具有检测燃料压力的压力传感器和检测针阀升程幅度的升降传感器。 电子控制单元（ECU）计算由压力传感器测量的燃料压力值的变化率。 ECU以增加的变化比部分计算不增加点，并将该点判断为启动喷嘴的燃料喷射的定时。 EPU还根据燃料喷射正时以及在各个点处的针阀的燃料压力和提升量来计算实际燃料喷射量。 EPU将实际喷射量控制为与目标燃料喷射量相同。