公开(公告)号：US07234999B2

公开(公告)日：2007-06-26

申请号：US11599351

申请日：2006-11-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00 ,  G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

公开(公告)号：US20070061036A1

公开(公告)日：2007-03-15

申请号：US11599351

申请日：2006-11-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。

公开(公告)号：US07169235B2

公开(公告)日：2007-01-30

申请号：US10844317

申请日：2004-05-13

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Norio Kimura

IPC分类号： C23G1/02

CPC分类号： B24B37/345 ,  B08B3/08 ,  B24B53/017 ,  H01L21/67051 ,  Y10S134/902

摘要： A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

摘要翻译： 一种方法适用于清洗需要高度清洁度的基板，如半导体晶片，玻璃基板或液晶显示器。 该方法包括使用含磨料颗粒的磨料液研磨衬底，以及通过向研磨液中提供与磨料液体或类似pH具有基本上相同pH值的清洗液体来清洗衬底的抛光表面，使磨料的pH值 附着于基板抛光面的液体不会迅速变化。

公开(公告)号：US06672945B1

公开(公告)日：2004-01-06

申请号：US09641347

申请日：2000-08-18

申请人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

发明人： Hisanori Matsuo ,  Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B49/14 ,  B24B53/001 ,  B24B53/12 ,  B24B55/02

摘要： A abstract polishing apparatus has a substrate carrier a substrate and an abrasive member having a polishing surface. The surface is slidingly engaged with the substrate in order to effect polishing. The dressing device includes a light source when generating light rays for irradiating the polishing surface of the abrasive member, whereby dressing the polishing surface. A temperature control system control the temperature of the polishing surface of the abrasive member by sensing the temperature of the polishing surface with the temperature sensor. Mechanical dressing of the polishing surface, in addition to dressing by radiation of the polishing surface, may also be employed in order to flatten the entire polishing surface. The abrasive member preferably includes an abrasive particles, a binder and a photophilic for promoting the dressing of the polishing surface by light rays.

摘要翻译： 抽象抛光装置具有基板载体，基底和具有抛光表面的磨料构件。 该表面与衬底滑动接合以便进行抛光。 修整装置在产生用于照射研磨部件的研磨面的光线时包括光源，由此修整研磨面。 温度控制系统通过用温度传感器感测研磨表面的温度来控制研磨部件的抛光表面的温度。 抛光表面的机械修整除了通过抛光表面的辐射进行修整之外，还可以采用平整整个抛光表面。 磨料构件优选地包括研磨颗粒，粘合剂和亲水性用于通过光线促进抛光表面的修整。

公开(公告)号：US06390901B1

公开(公告)日：2002-05-21

申请号：US09397916

申请日：1999-09-17

申请人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

发明人： Hirokuni Hiyama ,  Yutaka Wada ,  Kazuto Hirokawa ,  Hisanori Matsuo ,  Tetsuji Togawa ,  Satoshi Wakabayashi

IPC分类号： B24B2900

CPC分类号： B24B37/11 ,  B24D9/085

摘要： An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.

摘要翻译： 本发明的目的是提供一种具有研磨板的抛光装置，其可以容易且可靠地安装在转台上和从转盘上拆下。 抛光装置具有固定安装在转盘上的研磨板工具，其包括研磨板，以及用于保持要抛光的工件的顶环，并将工件抵靠研磨板与其滑动接触，以抛光其中的表面 工件平整，镜面光洁。 夹持机构安装在转盘中，用于将研磨板工具的外周凸缘固定到转台上。

公开(公告)号：US06336850B1

公开(公告)日：2002-01-08

申请号：US09173002

申请日：1998-10-15

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B722

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A polisher includes a turntable with a polishing surface provided on the top surface of the turntable, an article carrier for holding an article to be polished in such a manner that the article is brought into contact with the polishing surface to polish the article, and a slurry dispenser for receiving and dispensing slurry to the polishing surface. The dispenser includes a slurry dispensing member for dispensing slurry to the polishing surface. The slurry dispensing member includes a contact surface facing and substantially contacting the polishing surface, and a slurry dispensing opening including at least one hole provided in the contact surface to dispense the slurry to the polishing surface therethrough. The opening is sized in such a manner that the opening covers substantially an area of the polishing surface which is to be brought into engagement with the article by relative movement between the article and the polishing surface.

摘要翻译： 抛光机包括具有设置在转盘顶表面上的抛光表面的转台，用于保持待抛光物品的物品载体，使物品与抛光表面接触以对物品进行抛光，以及 用于将浆料接收和分配到抛光表面的浆料分配器。 分配器包括用于将浆料分配到抛光表面的浆料分配构件。 浆料分配构件包括面向并基本上接触抛光表面的接触表面，以及浆料分配开口，其包括设置在接触表面中的至少一个孔，以将浆料分配到通过其中的抛光表面。 开口的尺寸设计成使得开口基本上覆盖了通过制品和抛光表面之间的相对运动而与制品接合的抛光表面的一个区域。

公开(公告)号：US06190243B1

公开(公告)日：2001-02-20

申请号：US09306985

申请日：1999-05-07

申请人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

发明人： Yutaka Wada ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Hisanori Matsuo

IPC分类号： B24B2118

CPC分类号： B24B53/017

摘要： A polishing apparatus comprises a table having a smooth surface, a polishing pad provided on the smooth surface and a carrier for carrying an article to be polished The carrier brings the article into engagement with the pad under a pressure. The carrier and the table with the polishing pad are repeatedly moved relative to each other in a predetermined direction to thereby polish the article. A pressing device is positioned at a position spaced from the carrier is and adapted to be engaged with the polishing surface of the polishing pad. The pressing device includes a plurality of pressing elements which are arranged across an area of the polishing surface which area is to be brought into engagement with the article carried by the carrier and are adapted to individually press successive corresponding portions in the area to arrange the configuration of the surface of the area under corresponding various pressures.

摘要翻译： 抛光装置包括具有光滑表面的台面，设置在光滑表面上的抛光垫和用于承载待抛光物品的托架。承载件使得物品在压力下与垫接合。 载体和具有抛光垫的工作台在预定方向上相对于彼此重复地移动，从而抛光物品。 按压装置位于与载体间隔开的位置，并且适于与抛光垫的抛光表面接合。 按压装置包括多个按压元​​件，其横跨抛光表面的区域布置，该区域将与由承载件承载的物品接合，并且适于单独地按压该区域中的连续的对应部分以将构造 的面积在相应的各种压力下。

公开(公告)号：US6102786A

公开(公告)日：2000-08-15

申请号：US234633

申请日：1999-01-21

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/005 ,  B24D13/14 ,  H01L21/304 ,  B24B29/02

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定突出区域的位置。

公开(公告)号：US6015337A

公开(公告)日：2000-01-18

申请号：US891993

申请日：1997-07-14

申请人： Hirokuni Hiyama ,  Yutaka Wada

发明人： Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/12 ,  B24B41/047 ,  B24B49/16 ,  B24D13/14 ,  H01L21/304 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B37/12 ,  B24B49/16

摘要： A polishing apparatus for polishing for example a semiconductor wafer to a high degree of flatness includes a turntable to the upper surface of which is affixed a polishing cloth and a top ring. A surface of the workpiece interposed between the polishing cloth on the turntable and the top ring is polished by pressing the workpiece against the polishing cloth with a predetermined pressure and moving the turntable and the top ring relative to each other. The turntable includes a set of annular small tables each of which is smaller than the diameter of the workpiece and determined on the basis of an area of effect on the workpiece.

摘要翻译： 用于将半导体晶片抛光到高平坦度的抛光装置包括一个转盘，其上表面上贴有一个抛光布和一个顶环。 通过以预定的压力将工件压靠在抛光布上而将转盘上的研磨布和顶环之间的工件表面抛光，并相对于彼此移动转台和顶环。 转盘包括一组环形小桌子，每个小桌子都小于工件的直径，并根据对工件的作用面积确定。

公开(公告)号：US5857898A

公开(公告)日：1999-01-12

申请号：US974598

申请日：1997-11-19

申请人： Hirokuni Hiyama ,  Norio Kimura ,  Tomoyuki Yahiro

发明人： Hirokuni Hiyama ,  Norio Kimura ,  Tomoyuki Yahiro

IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24B53/095 ,  B24B57/02 ,  H01L21/304 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B53/017

摘要： A polishing cloth is dressed between polishing processes each for polishing a workpiece such as a semiconductor wafer. The polishing cloth is dressed while supplying a dressing liquid such as water during a dressing process, and an abrasive liquid for polishing a workpiece is supplied to the polishing cloth for a predetermined period of time prior to a polishing process. The predetermined period of time may be present within the dressing process and immediately precedes the polishing process, and the dressing process may be carried out while supplying the abrasive liquid to the polishing cloth. Alternatively, the predetermined period of time may be present between the dressing process and the polishing process.

摘要翻译： 在抛光工艺之间穿着抛光布，用于抛光诸如半导体晶片的工件。 在修整过程中，在提供诸如水的修整液的同时，对抛光布进行修整，并且在抛光处理之前将抛光工件的研磨液供给到抛光布预定的时间。 预定的时间段可以存在于修整过程中并且紧接在抛光过程之前，并且可以在将磨料液体供应到抛光布的同时进行修整过程。 或者，在修整处理和抛光处理之间可以存在预定时间段。