公开(公告)号：US07838993B2

公开(公告)日：2010-11-23

申请号：US11919635

申请日：2006-05-26

申请人： Tomoyuki Aoki ,  Koji Dairiki ,  Yuugo Goto

发明人： Tomoyuki Aoki ,  Koji Dairiki ,  Yuugo Goto

IPC分类号： H01L23/52

CPC分类号： H01L27/13 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/576 ,  H01L23/585 ,  H01L27/105 ,  H01L27/11509 ,  H01L27/11526 ,  H01L27/11546 ,  H01L27/1203 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/78618 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01L2924/00

摘要： It is an object of the invention to provide semiconductor devices which can protect privacy of consumers or holders of commercial products and control the communication range according to use, even when the semiconductor device which can exchange data without contact is mounted on the commercial products. A semiconductor device of the invention includes an element group including a plurality of transistors over a substrate; a first conductive film functioning as an antenna over the element group; a second conductive film surrounding the first conductive film; an insulating film covering the first and second end portions; and a third conductive film over the insulating film. The first conductive film is provided in the shape of a coil, and each end portion of the first conductive film is connected to the element group. First and second end portions of the second conductive film are not connected to each other.

摘要翻译： 本发明的目的是提供可以保护消费者或商业产品持有人的隐私的半导体器件，并且即使当可以将交换数据而不接触的半导体器件安装在商业产品上时，也可以根据用途来控制通信范围。 本发明的半导体器件包括在衬底上包括多个晶体管的元件组; 用作元件组上的天线的第一导电膜; 围绕所述第一导电膜的第二导电膜; 覆盖所述第一和第二端部的绝缘膜; 和绝缘膜上的第三导电膜。 第一导电膜设置为线圈形状，并且第一导电膜的每个端部连接到元件组。 第二导电膜的第一端部和第二端部彼此不连接。

公开(公告)号：US07449372B2

公开(公告)日：2008-11-11

申请号：US11295471

申请日：2005-12-07

申请人： Gen Fujii ,  Masafumi Morisue ,  Hironobu Shoji ,  Junya Maruyama ,  Kouji Dairiki ,  Tomoyuki Aoki

发明人： Gen Fujii ,  Masafumi Morisue ,  Hironobu Shoji ,  Junya Maruyama ,  Kouji Dairiki ,  Tomoyuki Aoki

IPC分类号： H01L21/84

CPC分类号： H01L27/12 ,  H01L23/48 ,  H01L23/5227 ,  H01L24/11 ,  H01L27/0629 ,  H01L27/1266 ,  H01L27/1292 ,  H01L27/13 ,  H01L28/10 ,  H01L29/78621 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer; forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.

摘要翻译： 具有导电层的基板的制造方法具有以下步骤：在基板上形成无机绝缘层; 在无机绝缘层上形成具有所需形状的有机树脂层; 在无机绝缘层的第一暴露部分上相对于含有导电颗粒的组合物形成低润湿性层; 去除有机树脂层; 并用含有导电颗粒的组合物涂覆无机绝缘层的第二暴露部分并进行烘烤，由此形成导电层。

公开(公告)号：US20070128833A1

公开(公告)日：2007-06-07

申请号：US11600070

申请日：2006-11-16

申请人： Tomoyuki Aoki ,  Tomoko Tamura ,  Takuya Tsurume ,  Koji Dairiki

发明人： Tomoyuki Aoki ,  Tomoko Tamura ,  Takuya Tsurume ,  Koji Dairiki

IPC分类号： H01L21/00

CPC分类号： H01L27/1266 ,  H01L21/78 ,  H01L27/1214

摘要： It is an object to provide a manufacturing method of a semiconductor device with high reliability. A plurality of first semiconductor integrated circuits, a plurality of second semiconductor integrated circuits each of which is arranged to be adjacent to one of the first semiconductor integrated circuits, a plurality of third semiconductor integrated circuits each of which is arranged to be adjacent to one of the first semiconductor integrated circuits and one of the second semiconductor integrated circuits, and a plurality of fourth semiconductor integrated circuits each of which is arranged to be adjacent to one of the first semiconductor integrated circuits, one of the second semiconductor integrated circuits, and one of the third semiconductor integrated circuits are formed over a first substrate. The first semiconductor integrated circuits are transferred to a second substrate. A first protective layer is formed to cover the first semiconductor integrated circuits and a surface of the second substrate in the periphery of the first semiconductor integrated circuits. The second substrate and the first protective layer are divided so that the plurality of the first semiconductor integrated circuits is divided into individual pieces and part of the second substrate remains in the periphery of the first semiconductor integrated circuits. Accordingly, a semiconductor device having the first semiconductor integrated circuit is manufactured.

摘要翻译： 本发明的目的是提供一种具有高可靠性的半导体器件的制造方法。 多个第一半导体集成电路，多个第二半导体集成电路，每个第二半导体集成电路被布置为与第一半导体集成电路中的一个相邻，多个第三半导体集成电路被布置为与 第一半导体集成电路和第二半导体集成电路之一，以及多个第四半导体集成电路，每个第四半导体集成电路被布置为与第一半导体集成电路之一相邻，第二半导体集成电路之一和第二半导体集成电路之一 第三半导体集成电路形成在第一基板上。 第一半导体集成电路被转移到第二衬底。 形成第一保护层以覆盖第一半导体集成电路和第一半导体集成电路的周边中的第二基板的表面。 第二基板和第一保护层被分割成使得多个第一半导体集成电路被分成单独的部分，并且第二基板的一部分保留在第一半导体集成电路的周围。 因此，制造具有第一半导体集成电路的半导体器件。

公开(公告)号：US20060134918A1

公开(公告)日：2006-06-22

申请号：US11295471

申请日：2005-12-07

申请人： Gen Fujii ,  Masafumi Morisue ,  Hironobu Shoji ,  Junya Maruyama ,  Kouji Dairiki ,  Tomoyuki Aoki

发明人： Gen Fujii ,  Masafumi Morisue ,  Hironobu Shoji ,  Junya Maruyama ,  Kouji Dairiki ,  Tomoyuki Aoki

IPC分类号： H01L21/311 ,  H01L21/302

CPC分类号： H01L27/12 ,  H01L23/48 ,  H01L23/5227 ,  H01L24/11 ,  H01L27/0629 ,  H01L27/1266 ,  H01L27/1292 ,  H01L27/13 ,  H01L28/10 ,  H01L29/78621 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer, forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.

摘要翻译： 具有导电层的基板的制造方法具有以下步骤：在基板上形成无机绝缘层; 在所述无机绝缘层上形成具有所需形状的有机树脂层，在所述无机绝缘层的第一暴露部分上相对于含有导电颗粒的组合物形成低润湿性层; 去除有机树脂层; 并用含有导电颗粒的组合物涂覆无机绝缘层的第二暴露部分并进行烘烤，由此形成导电层。

公开(公告)号：US20050166078A1

公开(公告)日：2005-07-28

申请号：US11028072

申请日：2005-01-04

申请人： Hisashi Taniguchi ,  Tetsuya Esaki ,  Tomoyuki Aoki

发明人： Hisashi Taniguchi ,  Tetsuya Esaki ,  Tomoyuki Aoki

IPC分类号： G06F1/32 ,  G06F1/30 ,  G06F3/06

CPC分类号： G06F1/3256 ,  G06F1/3203 ,  G06F1/3287 ,  Y02D10/1542 ,  Y02D10/171

摘要： An information processing apparatus which comprises a recording section for recording information in a removable recording medium, a switch, a computer, a power supply section for supplying power to the recording section and the computer, and an operating system which is software for controlling the computer. In which, the power supply section controls power supply to the recording section and the computer individually, only the power supply to the recording section is controlled ON/OFF corresponding to a state of the switch. The operating system conducts a processing based on a presumption that the recording section is not connected to. Under the above-described configuration, when there is no access made to the recording section, the power supply is disconnected not only to the recording section but also to a constituent part used for making access to the recording section. Thus the advantage of low-power operation is further enhanced.

摘要翻译： 一种信息处理设备，包括用于在可移动记录介质中记录信息的记录部分，开关，计算机，用于向记录部分和计算机供电的电源部分，以及作为控制计算机的软件的操作系统 。 其中，电源部分分别控制对记录部分和计算机的电源，只有与记录部分的电源相对应地被控制为ON / OFF。 操作系统基于假设记录部分未连接进行处理。 在上述配置下，当不存在对记录部分的访问时，电源不仅与记录部分断开，而且与用于访问记录部分的组成部分断开。 因此，进一步提高了低功率运行的优点。

公开(公告)号：US5520959A

公开(公告)日：1996-05-28

申请号：US910081

申请日：1992-07-10

申请人： Shigeo Tanaka ,  Tomoyuki Aoki ,  Masayuki Yoshida

发明人： Shigeo Tanaka ,  Tomoyuki Aoki ,  Masayuki Yoshida

IPC分类号： C23C22/08 ,  C23C22/23 ,  B05D3/02

CPC分类号： C23C22/08 ,  C23C22/23

摘要： A surface which has excellent adhesivity to paint, good corrosion resistance, and low friction may be obtained on drawn and iron tin plated cans by spraying the can surface for a time between 5 and 60 seconds at a temperature between 40.degree. and 60.degree. C. with an aqueous treating liquid having a pH between 4 and 6 and comprising (i) orthophosphoric acid and/or condensed phosphoric acids and (ii) a concentration of at least 0.1 w/o of a water soluble oligomer according to the general formula: ##STR1## wherein n is a number with a value between 10 and 30 and each of X and Y independently represents hydrogen or a group Z, wherein Z has a chemical composition conforming to the general formula: ##STR2## wherein each of R.sub.1 and R.sub.2 is an alkyl or hydroxyalkyl group having from 1 to 5 carbon atoms, except that at least 25% of the total of all the X and Y groups in the oligomer are Z rather than hydrogen; and drying the surface thus sprayed, optionally after having first rinsed the sprayed surface with water.

摘要翻译： PCT No.PCT / US91 / 00202 Sec。 371日期：1992年7月10日 102（e）日期1992年7月10日PCT 1991年1月1日PCT PCT。 公开号WO91 / 10756 日期：1991年7月25日。通过在5和60秒之间的温度下，在拉伸和镀锡的罐上获得具有优异的涂料粘附性，良好的耐腐蚀性和低摩擦力的表面， 40℃和60℃，pH为4至6，并包含（i）正磷酸和/或缩合磷酸的水性处理液，和（ii）至少0.1w / o的水溶性低聚物的浓度 根据通式：其中n是数值在10和30之间，X和Y各自独立地表示氢或基团Z，其中Z具有符合以下通式的化学组成： 其中R 1和R 2各自为具有1至5个碳原子的烷基或羟烷基，除了低聚物中所有X和Y基团的总和中的至少25％为Z而不是氢; 并且任选地在首先用水冲洗喷射表面之后干燥所喷射的表面。

公开(公告)号：US5498300A

公开(公告)日：1996-03-12

申请号：US454205

申请日：1995-06-09

申请人： Tomoyuki Aoki ,  Masayuki Yoshida

发明人： Tomoyuki Aoki ,  Masayuki Yoshida

IPC分类号： C23C22/08 ,  C23C22/23 ,  C23C22/47 ,  C23C22/10

CPC分类号： C23C22/23 ,  C23C22/08 ,  C23C22/47

摘要： To impart an excellent corrosion resistance and adherence to the surface of tinplate while avoiding the production of sludge in the treatment bath during continuous treatment, a bath is used that contains phosphate ions, from 0.1 to 5.0 g/L of chelating agent, and tin ions; has a pH from 2.0 to 4.5; is essentially free of oxidizing agent and ferric ion; and has an oxidation-reduction potential of .ltoreq.450 mV more oxidizing than a silver-saturated silver chloride reference electrode.

摘要翻译： PCT No.PCT / US93 / 11435 Sec。 371日期：1995年6月9日 102（e）1995年6月9日PCT 1993年12月1日PCT PCT。 公开号WO94 / 13855 日期：1994年6月23日。为了赋予马口铁表面优异的耐腐蚀性和粘附性，同时避免在连续处理期间在处理槽中产生污泥，使用含有0.1至5.0g / L的磷酸根离子的浴 的螯合剂和锡离子; pH为2.0〜4.5; 基本上不含氧化剂和铁离子; 并且具有比银饱和氯化银参比电极更氧化的氧化还原电位

公开(公告)号：US5382295A

公开(公告)日：1995-01-17

申请号：US64082

申请日：1993-05-20

申请人： Tomoyuki Aoki ,  Yoji Ono

发明人： Tomoyuki Aoki ,  Yoji Ono

IPC分类号： F28F13/18 ,  C23G1/22 ,  F28F19/02 ,  C11D7/06 ,  C23G1/14

CPC分类号： C23G1/22

摘要： An aqueous alkaline cleaner for aluminum has a pH in the range from 10.0-12.0 and contains:(A) from 0.5 to 10.0 g/L of an alkali builder component;(B) from 0.5 to 10.0 g/L of aminoalkyl- and/or hydroxyalkyldi-phosphonic acids and/or their water soluble salts;(C) from 0.1 to 3.0 g/L of an aluminum ion sequestering agent component; and(D) from 0.5 to 5.0 g/L of a surfactant component.Cleaning aluminum and aluminum alloy with such a cleaner generates an excellent surface condition with respect to de-smutting performance, water wettability, avoidance of black smut production, blackening, and paint adherence at least as good as that achieved with conventional acid cleaners, without requiring any acid wash.

摘要翻译： PCT No.PCT / US91 / 08250 Sec。 371日期：1993年5月20日 102（e）日期1993年5月20日PCT 1991年11月12日PCT。用于铝的碱性水性碱性清洁剂的pH为10.0-12.0，含有：（A）0.5至10.0g / L的碱助洗剂 零件; （B）0.5至10.0g / L氨基烷基 - 和/或羟烷基二膦酸和/或其水溶性盐; （C）为0.1〜3.0g / L的铝离子螯合剂成分; 和（D）0.5-5.0g / L表面活性剂组分。 使用这种清洁剂清洁铝和铝合金，在去除斑点性能，水润湿性，避免黑色黑点生成，黑化和涂料粘附性方面产生极好的表面状况，至少与常规酸性清洁剂相同，不需要 任何酸洗。

公开(公告)号：US5370909A

公开(公告)日：1994-12-06

申请号：US949258

申请日：1992-12-18

申请人： Shigeo Tanaka ,  Tomoyuki Aoki ,  Masayuki Yoshida ,  Yasuo Iino ,  Shinichiro Asai

发明人： Shigeo Tanaka ,  Tomoyuki Aoki ,  Masayuki Yoshida ,  Yasuo Iino ,  Shinichiro Asai

IPC分类号： C23C22/23 ,  C23C22/68 ,  B05D1/02 ,  C23F11/00

CPC分类号： C23C22/23 ,  C23C22/68

摘要： A corrosion resistant film with a low coefficient of friction that facilitates automatic conveying can be formed on the surface of tin-plated steel or of aluminum, particularly DI cans of one of these types of metal, by contacting the aluminum or the tin plated steel with an aqueous liquid composition having a pH in the range from 2.0 to 6.5 and containing:(A) from 1 to 30 g/L of phosphate ions,(B) from 0.1 to 10 g/L of condensed phosphate ions, and(C) from 0.1 to 20 g/L as solids of water-soluble polymers of N-vinylphenol substituted on the phenolic rings with dialkylaminomethyl groups.

摘要翻译： PCT No.PCT / US91 / 04250 Sec。 371日期1992年12月18日 102（e）日期1992年12月18日PCT 1991年6月13日PCT。可以在镀锡钢或铝，特别是DI罐的表面上形成便于自动输送的具有低摩擦系数的耐腐蚀膜 的这些金属之一，通过使铝或镀锡钢与pH为2.0-6.5的含水液体组合物接触，并含有：（A）1至30g / L的磷酸根离子（ B）0.1〜10g / L的缩合磷酸根离子，（C）0.1〜20g / L作为在具有二烷基氨基甲基的酚醛环上取代的N-乙烯基苯酚的水溶性聚合物的固体。

公开(公告)号：US4980076A

公开(公告)日：1990-12-25

申请号：US403625

申请日：1989-09-06

申请人： Shigeo Tanaka ,  Tomoyuki Aoki ,  Yasuo Iino ,  Yoji Ono

发明人： Shigeo Tanaka ,  Tomoyuki Aoki ,  Yasuo Iino ,  Yoji Ono

IPC分类号： C23G1/12

CPC分类号： C23G1/125

摘要： Problems with previously known aqueous acidic rinsing solutions for aluminum after shaping while using surface lubricants are avoided by use of a solution which contains water and (A) orthophosphoric acid in an amount to give a stoichiometric equivalent of 3.0 to 50 g/L as PO.sub.4.sup.-3, (B) an aluminum ion sequestrant component in an amount of 0.01 to 10.0 g/L; and (C) 20 to 170 ppm of ferric ion. The ferric ions act to inhibit corrosion of the stainless steel process equipment. Preferably the solution also contains 0.1 to 1.0 g/L of H.sub.2 O.sub.2, NO.sub.2.sup.-1 ions, or a mixture thereof to reoxidize ferrous ions formed by reduction of ferric ions during use of the solution and thus maintain the concentration of ferric ions above 20 ppm at all times. The solution may also contain surfactant and up to 10 g/L of dissolved aluminum ions.

摘要翻译： 使用含有水的溶液和（A）正磷酸的量，通过使用表面润滑剂成型后的铝的先前已知的水性酸性漂洗溶液的问题可以避免，其量为化学计量当量为3.0〜50g / L，PO4- 3，（B）0.01〜10.0g / L的铝离子螯合剂成分; 和（C）20〜170ppm的铁离子。 铁离子用于抑制不锈钢工艺设备的腐蚀。 优选地，溶液还含有0.1至1.0g / L的H 2 O 2，NO 2 -1离子或其混合物，以在溶液的使用期间再氧化由铁离子还原形成的亚铁离子，并且因此将铁离子的浓度保持在20ppm以上 一直。 该溶液还可以含有表面活性剂和高达10g / L的溶解的铝离子。