公开(公告)号：US20190124452A1

公开(公告)日：2019-04-25

申请号：US16223124

申请日：2018-12-18

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai

IPC: H04R19/04 ,  H04R31/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: H04R19/04 ,  B81B3/001 ,  B81B3/007 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C1/00984 ,  H04R31/003 ,  H04R2201/003

Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.

公开(公告)号：US09126827B2

公开(公告)日：2015-09-08

申请号：US14603371

申请日：2015-01-23

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Jhyy-Cheng Liou

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/00158 ,  B81B3/00 ,  B81B3/0013 ,  B81B7/00 ,  B81B2201/0257 ,  B81C1/00 ,  B81C1/00952 ,  H04R19/005 ,  H04R2201/003

Abstract: A method for fabricating MEMS device includes providing a silicon substrate. A structural dielectric layer is formed over a first side of the silicon substrate. Structure elements are embedded in the structural dielectric layer. The structure elements include a conductive backplate disposed over the silicon substrate, having venting holes and protrusion structures on top of the conductive backplate; and diaphragm located above the conductive backplate by a distance. A chamber is formed between the diaphragm and the conductive backplate. A cavity is formed in the silicon substrate at a second side. The cavity corresponds to the structure elements. An isotropic etching is performed on a dielectric material of the structural dielectric layer to release the structure elements. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate. A second side of the diaphragm is exposed to an environment space.

Abstract translation: 制造MEMS器件的方法包括提供硅衬底。 在硅衬底的第一侧上形成结构介电层。 结构元件嵌入在结构介电层中。 结构元件包括设置在硅衬底上的导电背板，在导电背板的顶部上具有通气孔和突出结构; 和隔膜位于导电背板上方一段距离。 在隔膜和导电背板之间形成一个室。 在第二侧的硅衬底中形成腔体。 空腔对应于结构元件。 对结构介电层的电介质材料进行各向同性蚀刻以释放结构元件。 隔膜的第一侧被室暴露，并面向导电背板的突出结构。 隔膜的第二面暴露于环境空间。

公开(公告)号：US08823388B2

公开(公告)日：2014-09-02

申请号：US13152284

申请日：2011-06-03

Applicant: Yu-Wei Lin

Inventor： Yu-Wei Lin

IPC: G01R35/00 ,  G01R23/175 ,  H03H7/32 ,  G01R31/317 ,  H03H11/26 ,  H03H7/01

CPC classification number: H03H7/32 ,  G01R31/31725 ,  G01R35/00 ,  H03H7/0153 ,  H03H11/265 ,  H03H2210/043

Abstract: A calibration circuit and a calibration method are provided. The calibration circuit has a delay circuit, a phase detector, and a controller. The delay circuit delays an input signal to output an output signal, wherein a delay time between the input signal and the output signal is related to an equivalent capacitance and an equivalent resistance of the delay circuit. The phase detector coupled to the delay circuit compares the phases of the input signal and the output signal. The controller coupled to the delay circuit and the phase detector generates a control signal according to the comparison result of the phase detector to adjust the equivalent resistance of the delay circuit.

Abstract translation: 提供校准电路和校准方法。 校准电路具有延迟电路，相位检测器和控制器。 延迟电路延迟输入信号以输出输出信号，其中输入信号和输出信号之间的延迟时间与等效电容和延迟电路的等效电阻相关。 耦合到延迟电路的相位检测器比较输入信号和输出信号的相位。 耦合到延迟电路的控制器和相位检测器根据相位检测器的比较结果生成控制信号，以调整延迟电路的等效电阻。

公开(公告)号：US08673732B2

公开(公告)日：2014-03-18

申请号：US13906340

申请日：2013-05-31

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Jhyy-Cheng Liou

IPC: H01L21/76

CPC classification number: B81C1/00698 ,  B81C1/00682 ,  H01G5/18 ,  H04R19/005 ,  H04R19/04

Abstract: Method is to fabricate a MEMS device with a substrate. The substrate has through holes in the substrate within a diaphragm region and optionally an indent space from the second surface at the diaphragm region. A first dielectric structural layer is then disposed over the substrate from the first surface, wherein the first dielectric structural layer has a plurality of openings corresponding to the through holes, wherein each of the through holes remains exposed by the first dielectric structural layer. A second dielectric structural layer with a chamber is disposed over the first dielectric structural layer, wherein the chamber exposes the openings of the first dielectric structural layer and the through holes of the substrate to connect to the indent space. A MEMS diaphragm is embedded in the second dielectric structural layer above the chamber, wherein an air gap is formed between the substrate and the MEMS diaphragm.

Abstract translation: 方法是制造具有衬底的MEMS器件。 衬底在膜片区域内的衬底中具有通孔，并且可选地在隔膜区域处具有与第二表面相邻的凹陷空间。 然后，第一介电结构层从第一表面设置在衬底上，其中第一介电结构层具有对应于通孔的多个开口，其中每个通孔保持被第一介电结构层暴露。 具有腔室的第二电介质结构层设置在第一介电结构层上，其中腔室暴露第一介电结构层的开口和衬底的通孔以连接到凹陷空间。 MEMS隔膜嵌入在腔室上方的第二电介质结构层中，其中在衬底和MEMS隔膜之间形成气隙。

公开(公告)号：US20120306557A1

公开(公告)日：2012-12-06

申请号：US13152284

申请日：2011-06-03

Applicant: Yu-Wei Lin

Inventor： Yu-Wei Lin

IPC: H03H11/26

CPC classification number: H03H7/32 ,  G01R31/31725 ,  G01R35/00 ,  H03H7/0153 ,  H03H11/265 ,  H03H2210/043

Abstract: A calibration circuit and a calibration method are provided. The calibration circuit has a delay circuit, a phase detector, and a controller. The delay circuit delays an input signal to output an output signal, wherein a delay time between the input signal and the output signal is related to an equivalent capacitance and an equivalent resistance of the delay circuit. The phase detector coupled to the delay circuit compares the phases of the input signal and the output signal. The controller coupled to the delay circuit and the phase detector generates a control signal according to the comparison result of the phase detector to adjust the equivalent resistance of the delay circuit.

Abstract translation: 提供校准电路和校准方法。 校准电路具有延迟电路，相位检测器和控制器。 延迟电路延迟输入信号以输出输出信号，其中输入信号和输出信号之间的延迟时间与等效电容和延迟电路的等效电阻相关。 耦合到延迟电路的相位检测器比较输入信号和输出信号的相位。 耦合到延迟电路的控制器和相位检测器根据相位检测器的比较结果生成控制信号，以调整延迟电路的等效电阻。

公开(公告)号：US08193596B2

公开(公告)日：2012-06-05

申请号：US12203151

申请日：2008-09-03

Applicant: Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Chih-Hsiang Lin

Inventor： Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Chih-Hsiang Lin

IPC: H01L29/84

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2207/095 ,  B81B2207/096 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A micro-electro-mechanical systems (MEMS) package includes a MEMS microphone device. The MEMS microphone device has a first substrate and at least a sensing element on the first substrate wherein a first chamber in the MEMS microphone device is connected to the sensing element. A second substrate is disposed over the MEMS microphone device to provide a second chamber in the second substrate over the sensing element opposite to the first chamber.

Abstract translation: 微电子机械系统（MEMS）封装包括MEMS麦克风装置。 MEMS麦克风装置具有第一基板和第一基板上的至少一个感测元件，其中MEMS麦克风装置中的第一腔室连接到感测元件。 第二基板设置在MEMS麦克风装置上方，以在与第一室相对的感测元件上的第二基板中提供第二室。

公开(公告)号：US08094839B2

公开(公告)日：2012-01-10

申请号：US12432758

申请日：2009-04-30

Applicant: Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Shao-Yi Wu

Inventor： Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Shao-Yi Wu

IPC: H03F99/00 ,  H04R1/00 ,  H02B1/00 ,  H03G3/00

CPC classification number: G01H11/06 ,  H04R1/04 ,  H04R19/005

Abstract: A microelectromechanical system (MEMS) device includes a diaphragm capacitor, connected between a capacitor biasing voltage source and a ground. A source follower circuit is coupled to the diaphragm capacitor. An amplifier is coupled to the source follower circuit to amplify the voltage signal as an output voltage signal. A programmable trimming circuit is implemented with the amplifier to trim a gain or implemented with the capacitor biasing voltage source to trim voltage applied on the diaphragm capacitor. Whereby, the output voltage signal has a target sensitivity.

Abstract translation: 微机电系统（MEMS）装置包括连接在电容器偏置电压源和地之间的隔膜电容器。 源极跟随器电路耦合到隔膜电容器。 放大器耦合到源极跟随器电路，以将电压信号放大为输出电压信号。 利用放大器实现可编程微调电路，以减小增益或用电容器偏置电压源来实现，以调节施加在隔膜电容器上的电压。 由此，输出电压信号具有目标灵敏度。

公开(公告)号：US08043897B2

公开(公告)日：2011-10-25

申请号：US13052124

申请日：2011-03-21

Applicant: Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Chih-Hsiang Lin

Inventor： Chien-Hsing Lee ,  Tsung-Min Hsieh ,  Chih-Hsiang Lin

IPC: H01L21/00

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2207/095 ,  B81B2207/096 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for forming a micro-electro-mechanical systems (MEMS) package includes following steps. A plurality of MEMS units are formed on a substrate, and each of the MEMS units includes at least a MEMS sensing element and a first chamber over the MEMS sensing element. The MEMS units include electric connection pads. A plurality of covering units are formed correspondingly over the MEMS units. Each of the covering units provides a second chamber over the MEMS sensing element opposite to the first chamber. The covering units are adhered to the MEMS units by an adhesive material. The MEMS units are diced into singulated units.

Abstract translation: 微机电系统（MEMS）封装的方法包括以下步骤。 在基板上形成多个MEMS单元，并且每个MEMS单元至少包括MEMS感测元件和MEMS感测元件上的第一室。 MEMS单元包括电连接垫。 在MEMS单元上相应地形成多个覆盖单元。 每个覆盖单元在MEMS感测元件之上提供与第一室相对的第二室。 覆盖单元通过粘合剂材料粘附到MEMS单元。 MEMS单元切成单个单元。

公开(公告)号：US07795063B2

公开(公告)日：2010-09-14

申请号：US11967261

申请日：2007-12-31

Applicant: Tsung-Min Hsieh ,  Chien-Hsing Lee

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee

IPC: H01L21/00 ,  H01L29/78 ,  H04R25/00 ,  H04R11/02

CPC classification number: B81C1/00182 ,  B81C1/00246 ,  B81C2201/014 ,  B81C2203/0714 ,  B81C2203/0735

Abstract: A micro-electro-mechanical systems (MEMS) device includes a back-plate substrate, having an intended region formed with a plurality of perforating holes. A first structural dielectric layer, disposed on the back-plate substrate, wherein the dielectric layer having an opening above the intended region. An etching stop layer, disposed over the first structural dielectric layer. A second structural dielectric layer, formed over the back-plate substrate. The etching stop layer and the second structural dielectric layer form at least a part of a micro-machine diaphragm, and cover over the opening of the first structural dielectric layer to form a chamber between the micro-machine diaphragm and the back-plate substrate.

Abstract translation: 微电子机械系统（MEMS）装置包括背板基板，其具有形成有多个穿孔的预期区域。 布置在所述背板基板上的第一结构介电层，其中所述电介质层具有在所述预定区域上方的开口。 设置在第一结构介电层上的蚀刻停止层。 形成在背板基板上的第二结构介电层。 蚀刻停止层和第二结构介电层形成微机隔膜的至少一部分，并且覆盖在第一结构介电层的开口上，以在微机隔膜和背板基板之间形成室。

公开(公告)号：US20080225830A1

公开(公告)日：2008-09-18

申请号：US11684643

申请日：2007-03-12

Applicant: Rong-Hwa Ding

Inventor： Rong-Hwa Ding

IPC: H04L12/66

CPC classification number: H04L65/1059 ,  H04M1/2535

Abstract: An internet phone system is implemented in a computer system, including an internet-phone software unit, for storing a software used by the computer system to operate as an internet phone. An audio-file storage software unit is for storing a plurality of audio files. A USB (Universal Serial Bus) audio interface software unit is coupled with the internet-phone software unit and the audio-file storage unit. A USB audio apparatus is coupled to the audio interface unit, and comprising at least a microphone and a speaker. Wherein, the USB audio interface unit stores a software for selecting one of the audio files to serve as the phone-call ring, and for driving the speaker in the USB audio apparatus by the computer system for generating ringing sound for an incoming call.

Abstract translation: 互联网电话系统在包括互联网电话软件单元的计算机系统中实现，用于存储计算机系统使用的软件作为互联网电话来操作。 音频文件存储软件单元用于存储多个音频文件。 USB（通用串行总线）音频接口软件单元与互联网电话软件单元和音频文件存储单元耦合。 USB音频设备耦合到音频接口单元，并且至少包括麦克风和扬声器。 其中，所述USB音频接口单元存储用于选择所述音频文件之一以用作所述电话呼叫环的软件，以及用于通过所述计算机系统驱动所述USB音频设备中的扬声器，以产生用于呼入的振铃声。