公开(公告)号：US6044981A

公开(公告)日：2000-04-04

申请号：US139883

申请日：1998-08-25

Applicant: Wen-Hwa Chu ,  Mauro Ferrari

Inventor： Wen-Hwa Chu ,  Mauro Ferrari

IPC: A61K9/00 ,  A61K9/22 ,  A61K9/50 ,  A61K9/52 ,  B01D39/16 ,  B01D39/20 ,  B01D67/00 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01J13/02 ,  B81B1/00 ,  B81C1/00 ,  C04B41/45 ,  C23C16/01 ,  G03F7/00 ,  B01D69/10 ,  B01D69/06 ,  C23F1/00

CPC classification number: G03F7/0015 ,  A61K9/0024 ,  A61K9/0097 ,  B01D39/1692 ,  B01D39/20 ,  B01D67/0058 ,  B01D67/0062 ,  B01D67/0072 ,  B01D67/0083 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01J13/02 ,  B81B3/007 ,  B81C1/00087 ,  B81C1/00246 ,  C04B41/4582 ,  C23C16/01 ,  G03F7/00 ,  B01D2323/08 ,  B01D2323/10 ,  B01D2325/02 ,  B01D2325/04 ,  B81B2201/10 ,  B81C2201/014 ,  B81C2201/032 ,  B81C2203/0728 ,  B81C2203/075

Abstract: Microfabricated filters utilizing a bulk substrate structure and a thin film structure and a method for constructing such filters. The pores of the filters are defined by spaces between the bulk substrate structure and the thin film structure and are of substantially uniform width, length and distribution. The width of the pores is defined by the thickness of a sacrificial layer and therefore may be smaller than the limit of resolution obtainable with photolithography. The filters provide enhanced mechanical strength, chemical inertness, biological compatibility, and throughput. The filters are constructed using relatively simple fabrication techniques. Also, microfabricated containment wells and capsules constructed with such filters for the immunological isolation of cell transplants and a method for constructing such containment wells and capsules. The pores of the wells and capsules are large enough to let a desired biologically-active molecular product through, while blocking the passage of all larger immunological molecules. The containment wells and capsules provide enhanced biological compatibility and useful life.

Abstract translation: 利用大块基板结构和薄膜结构的微型滤波器及其构造方法。 过滤器的孔由体基板结构和薄膜结构之间的空间限定，并且具有基本均匀的宽度，长度和分布。 孔的宽度由牺牲层的厚度限定，因此可以小于通过光刻可获得的分辨率的极限。 过滤器提供增强的机械强度，化学惰性，生物相容性和生产能力。 使用相对简单的制造技术构造滤波器。 而且，用这种用于免疫分离细胞移植的过滤器构造的微制造安全壳和胶囊以及用于构建这种安全壳和胶囊的方法。 孔和胶囊的孔隙足够大以使期望的生物活性分子产物通过阻止所有较大免疫分子的通过。 安全壳和胶囊提供增强的生物相容性和使用寿命。

公开(公告)号：US5893974A

公开(公告)日：1999-04-13

申请号：US254330

申请日：1994-06-06

Applicant: Christopher G. Keller ,  Mauro Ferrari

Inventor： Christopher G. Keller ,  Mauro Ferrari

IPC: A61F2/02 ,  A61K9/00 ,  A61K9/50 ,  A61K9/52 ,  B01D39/16 ,  B01D39/20 ,  B01D67/00 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01J13/02 ,  B81B1/00 ,  B81C1/00 ,  C04B41/45 ,  C23C16/01 ,  G03F7/00 ,  B01D69/10

CPC classification number: B01D39/1692 ,  A61K9/0024 ,  A61K9/0097 ,  B01D39/20 ,  B01D67/0058 ,  B01D67/0062 ,  B01D67/0072 ,  B01D67/0083 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01J13/02 ,  B81B1/002 ,  B81B1/004 ,  B81C1/00246 ,  B81C99/0085 ,  C04B41/4582 ,  C23C16/01 ,  G03F7/00 ,  G03F7/0015 ,  B01D2323/08 ,  B01D2325/04 ,  B81C2201/032 ,  B81C2203/0728 ,  Y10T428/249969

Abstract: The present invention provides a capsule made of a biologically compatible material with sufficient mechanical strength to form a very thin membrane shell having at least a region with approximately uniformly sized and spaced holes or pores that are large enough to let a desired biologically active molecular product through, while blocking the passage of all larger immunological molecules. The present invention thus provides an immunological isolation of cell transplants contained therein. The present invention also provides a free standing thin film structure that may be used as a component of such a capsule and method for the fabrication of such component and capsules.

Abstract translation: 本发明提供一种由具有足够的机械强度的生物相容性材料制成的胶囊，以形成非常薄的膜壳，其具有至少一个具有大致均匀尺寸和间隔开的孔或孔的区域，其足够大以使期望的生物活性分子产物通过 ，同时阻止所有较大免疫分子的通过。 因此，本发明提供对其中包含的细胞移植的免疫学分离。 本发明还提供可用作这种胶囊的组分的自立式薄膜结构和用于制造这种组分和胶囊的方法。

公开(公告)号：US09365941B2

公开(公告)日：2016-06-14

申请号：US13212636

申请日：2011-08-18

Applicant: Clément Saucy

Inventor： Clément Saucy

IPC: C25D1/00 ,  B81C99/00 ,  C25D1/20 ,  G03F7/00

CPC classification number: C25D1/003 ,  B81B2201/035 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  G03F7/00

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

公开(公告)号：US08815746B2

公开(公告)日：2014-08-26

申请号：US13599985

申请日：2012-08-30

Applicant: Josef Mathuni

Inventor： Josef Mathuni

IPC: G01L21/30 ,  G01R31/00 ,  H01L21/302 ,  H01L21/461 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC classification number: B81C99/0085 ,  B81C2201/032 ,  H01J37/32357

Abstract: An apparatus and the use of such an apparatus and method for producing microcomponents with component structures are presented which are generated in a process chamber on a substrate according to the LIGA method for example and are stripped from the enclosing photoresist with the help of a cooled remote plasma source.

Abstract translation: 本发明提供了一种用于制造具有部件结构的微型部件的这种装置和方法的使用方法，其在例如基于LIGA方法的基板上的处理室中产生，并且借助于冷却的远程 等离子体源

公开(公告)号：US20120228143A1

公开(公告)日：2012-09-13

申请号：US13441573

申请日：2012-04-06

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US07981269B2

公开(公告)日：2011-07-19

申请号：US11927369

申请日：2007-10-29

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US20090212018A1

公开(公告)日：2009-08-27

申请号：US12330028

申请日：2008-12-08

Applicant: Josef MATHUNI

Inventor： Josef MATHUNI

IPC: B44C1/22

CPC classification number: B81C99/0085 ,  B81C2201/032 ,  H01J37/32357

Abstract: An apparatus and the use of such an apparatus and method for producing microcomponents with component structures are presented which are generated in a process chamber on a substrate according to the LIGA method for example and are stripped from the enclosing photoresist with the help of a cooled remote plasma source.

Abstract translation: 本发明提供了一种用于制造具有部件结构的微型部件的这种装置和方法的使用方法，其在例如基于LIGA方法的基板上的处理室中产生，并且借助于冷却的远程 等离子体源

公开(公告)号：US20080220270A1

公开(公告)日：2008-09-11

申请号：US11680600

申请日：2007-02-28

Applicant: Gabriel Matus ,  Vlad Novotny

Inventor： Gabriel Matus ,  Vlad Novotny

IPC: G03C5/00 ,  B32B15/04

CPC classification number: G03F7/0035 ,  B81C1/00619 ,  B81C2201/032 ,  B81C2203/0109 ,  B81C2203/019

Abstract: A micro structure includes a seed electrode layer on a substrate and a plurality of conductive layers on the seed electrode layer. The combined thickness of the seed electrode layer and the plurality of conductive layers can be more than 0.1 mm and the lateral dimensions of the seed electrode layer and the plurality of conductive layers vary less than 20% along the direction normal to a surface of the substrate and the micro structure has striations on an outer surface.

Abstract translation: 微结构包括在基底上的种子电极层和种子电极层上的多个导电层。 种子电极层和多个导电层的组合厚度可以大于0.1mm，并且种子电极层和多个导电层的横向尺寸沿着垂直于衬底表面的方向变化小于20％ 并且微结构在外表面上具有条纹。

公开(公告)号：US20080179279A1

公开(公告)日：2008-07-31

申请号：US11927361

申请日：2007-10-29

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: B32B38/00 ,  C25F3/16

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US20080121618A1

公开(公告)日：2008-05-29

申请号：US11927369

申请日：2007-10-29

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C23F1/00 ,  B23H3/00

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.