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    Apparatus and foam electroplating process
    41.
    发明申请
    Apparatus and foam electroplating process 失效
    仪器和泡沫电镀工艺

    公开(公告)号：US20070278105A1

    公开(公告)日：2007-12-06

    申请号：US11407655

    申请日：2006-06-05

    申请人： Victor Alexander Ettel

    发明人： Victor Alexander Ettel

    IPC分类号： C25D3/12 ,  C25C7/02

    CPC分类号： C25D7/0614 ,  C25D1/08 ,  C25D5/04 ,  C25D5/08 ,  C25D7/04 ,  C25D7/0642 ,  C25D17/008 ,  C25D17/10

    摘要： An improved apparatus and method of producing metal foam is provided which involves optimizing the natural convection of electrolyte through a foam being electroplated by inclining the foam during plating. A diagonal flow of electrolyte though the foam enhances electrolyte turnover within the foam while increasing electroplating efficiency. Further increases in plating efficiency are provided by shifting current density from higher plating zones to lower plating zones.

    摘要翻译： 提供了一种改进的制造金属泡沫的装置和方法，其涉及通过在电镀期间使泡沫倾斜而电镀的泡沫来优化电解质的自然对流。 通过泡沫的电解质对角线流动可提高泡沫内的电解质周转率，同时提高电镀效率。 电镀效率的进一步提高是通过将电流密度从较高的镀层转移到较低的镀层区域来提供的。

    Aperture plate and methods for its construction and use
    44.
    发明申请
    Aperture plate and methods for its construction and use 有权
    孔板及其构造和使用方法

    公开(公告)号：US20070023547A1

    公开(公告)日：2007-02-01

    申请号：US11471282

    申请日：2006-06-19

    申请人： Scott Borland ,  Gary Baker

    发明人： Scott Borland ,  Gary Baker

    IPC分类号： A01G25/09 ,  B05B1/34 ,  B05B1/00

    CPC分类号： C25D1/08 ,  B05B17/0638 ,  B05B17/0646 ,  B41J2/1433 ,  B41J2/162 ,  B41J2/1625 ,  B41J2/1631 ,  B41J2/1643 ,  C25D1/10 ,  Y10T428/12361

    摘要： A method for performing an aperture plate comprises providing a mandrel that is constructed of a mandrel body having a conductive surface and a plurality of non-conductive islands disposed on the conductive surface. The mandrel is placed within a solution containing a material that is to be deposited onto the mandrel. Electrical current is applied to the mandrel to form an aperture plate on the mandrel, with the apertures having an exit angle that is in the range from about 30° to about 60°.

    摘要翻译： 用于执行孔板的方法包括提供由具有导电表面的心轴本体和设置在导电表面上的多个非导电岛构成的心轴。 将心轴放置在含有要沉积在心轴上的材料的溶液中。 将电流施加到心轴上以在心轴上形成孔板，孔的出射角在约30°至约60°的范围内。

    Metal mask and manufacturing method thereof
    45.
    发明申请
    Metal mask and manufacturing method thereof 审中-公开
    金属掩模及其制造方法

    公开(公告)号：US20060204904A1

    公开(公告)日：2006-09-14

    申请号：US11292760

    申请日：2005-12-01

    申请人： Kiyoshi Ogawa

    发明人： Kiyoshi Ogawa

    IPC分类号： G03C5/04 ,  C23C16/00

    CPC分类号： C25D1/08

    摘要： A method for manufacturing a metal mask that facilitates easy dimensional control in the manufacturing process and can manufacture multiple metal masks having high and consistent precision. A Cr film 2 having a mask pattern 2a is formed on the surface of a glass plate 1, a dry film 4 is formed on the Cr film 2, the dry film 4 is exposed from the glass plate 1 side with the Cr film 2 as a mask, a mask pattern 4a having the same shape as that of the mask pattern 2a is formed on the dry film 4, and a metal plating layer 6 is formed on the Cr film 2. The metal plating layer 6 is separated to form a metal mask 7.

    摘要翻译： 一种制造金属掩模的方法，其在制造过程中容易进行尺寸控制并且可以制造具有高且一致精度的多个金属掩模。 在玻璃板1的表面上形成具有掩模图案2a的Cr膜2，在Cr膜2上形成干膜4，将干膜4从玻璃板1侧暴露于Cr膜2 作为掩模，在干膜4上形成具有与掩模图案2a相同形状的掩模图案4A，并在Cr膜2上形成金属镀层6.金属镀层6分离 以形成金属掩模7。

    Stencil manufacture
    46.
    发明申请
    Stencil manufacture 审中-公开
    模板制造

    公开(公告)号：US20060185535A1

    公开(公告)日：2006-08-24

    申请号：US10543963

    申请日：2004-01-27

    申请人： Marc Desmulliez ,  Robert Kay

    发明人： Marc Desmulliez ,  Robert Kay

    IPC分类号： B41C1/14

    CPC分类号： C25D5/18 ,  C25D1/08 ,  C25D5/022 ,  H05K3/1225

    摘要： A method of forming a screen-printing stencil comprising electroforming the stencil using a bi-polar electrical signal. The bi-polar signal comprises a cathodic pulse (22) and an anodic pulse (24). When the cathodic pulse (22) is applied during the electroforming process, metal is deposited. When the anodic pulse (24) is applied, metal is removed. The cathodic pulse (22) has a longer duration than the anodic pulse (24). The ratio of the magnitude of the anodic pulse (24) to the magnitude of the cathodic pulse (22) is greater than one.

    摘要翻译： 一种形成丝网印刷模版的方法，包括使用双极电信号对模板进行电铸。 双极性信号包括阴极脉冲（22）和阳极脉冲（24）。 当在电铸过程中施加阴极脉冲（22）时，沉积金属。 当施加阳极脉冲（24）时，去除金属。 阴极脉冲（22）具有比阳极脉冲（24）更长的持续时间。 阳极脉冲（24）的大小与阴极脉冲（22）的大小之比大于1。

    Mandrel with controlled release layer for multi-layer electroformed ink-jet orifice plates
    48.
    发明申请
    Mandrel with controlled release layer for multi-layer electroformed ink-jet orifice plates 有权
    与多层电铸喷墨孔板的控释层心轴

    公开(公告)号：US20060127814A1

    公开(公告)日：2006-06-15

    申请号：US11344425

    申请日：2006-01-31

    申请人： Richard Sexton

    发明人： Richard Sexton

    IPC分类号： G03C5/00

    CPC分类号： C25D1/08 ,  B41J2/162 ,  B41J2/1625 ,  C25D1/10 ,  C25D1/22 ,  Y10T428/1476

    摘要： A system and method are provided for fabricating an orifice plate for use in an ink jet printing system. Initially, a substrate base is provided, and a controlled-release layer is applied to a surface of the substrate base. A conductive metal layer is adherently coated on the controlled-release layer. At least one dielectric peg is created on a portion of the conductive metal layer, and a nozzle layer is applied on the conductive metal layer to partially cover the dielectric peg. Photolithography is used to define a trench that covers the nozzles prior to formation of a second reinforcing layer. The controlled-release layer is removed to separate the orifice plate from the substrate base. The conductive metal layer is selectively etched from the nozzle layer to produce a completed multi-layer orifice plate.

    摘要翻译： 提供了一种用于制造用于喷墨打印系统的孔板的系统和方法。 首先，设置基板基板，并且将控释层施加到基板基板的表面。 导电金属层附着在控释层上。 在导电金属层的一部分上形成至少一个电介质钉，并且在导电金属层上施加喷嘴层以部分覆盖电介质钉。 光刻用于限定在形成第二增强层之前覆盖喷嘴的沟槽。 去除控释层以将孔板与基底分离。 从喷嘴层选择性地蚀刻导电金属层以产生完整的多层孔板。

    Nanomachined and micromachined electrodes for electrochemical devices
    50.
    发明授权
    Nanomachined and micromachined electrodes for electrochemical devices 失效
    用于电化学装置的纳米加工和微加工电极

    公开(公告)号：US06986838B2

    公开(公告)日：2006-01-17

    申请号：US10918250

    申请日：2004-08-13

    申请人： Davorin Babic ,  John M. Baxley ,  Paul D. Browne

    发明人： Davorin Babic ,  John M. Baxley ,  Paul D. Browne

    IPC分类号： C25D5/34

    CPC分类号： C25F1/00 ,  C25D1/08 ,  C25D11/045 ,  C25D11/18

    摘要： A nanomachined and micromachined electrode (10) is disclosed that is produced by providing a layer of aluminum (11) positioned upon a conductive substrate (12), anodizing the layer of aluminum to produce a layer of aluminum oxide (13) having an array of pores (14), depositing a sacrificial metal (17) within the pores of the aluminum oxide layer, etching the aluminum oxide layer so as to leave an array of sacrificial metal rods (18), depositing a layer of electrode material (19) between the array of sacrificial metal rods, and etching the sacrificial metal rods so that a layer of copper remains having an array of pores (20) where the sacrificial metal rods had existed. The layer of copper is the electrode (10).

    摘要翻译： 公开了一种纳米加工和微机械加工的电极（10），其通过提供位于导电基底（12）上的铝层（11）制成，阳极氧化该铝层以产生一层氧化铝（13），该层具有 孔（14），在氧化铝层的孔内沉积牺牲金属（17），蚀刻氧化铝层以留下牺牲金属棒（18）的阵列，将电极材料层（19）沉积在 牺牲金属棒的阵列，并且蚀刻牺牲金属棒，使得铜层保留具有存在牺牲金属棒的孔阵列（20）。 铜层是电极（10）。