-
公开(公告)号：US11903240B2
公开(公告)日：2024-02-13
申请号：US17851914
申请日：2022-06-28
Applicant: Wuhan Tianma Microelectronics Co., Ltd. , Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch
Inventor： Xingchen Qian
IPC: H10K50/844 , B32B3/04 , B32B5/18 , B32B7/14 , B32B37/12 , B32B37/18 , B32B38/00 , G02F1/1333 , H10K71/00 , H10K50/84 , H10K50/842 , H10K59/131 , H10K59/12 , H10K77/10 , H10K102/00
CPC classification number: H10K50/844 , B32B3/04 , B32B5/18 , B32B7/14 , B32B37/12 , B32B37/18 , B32B38/0012 , G02F1/133305 , H10K71/00 , B32B2305/022 , B32B2457/206 , G02F2201/07 , G02F2201/50 , G02F2202/28 , H10K50/841 , H10K50/8426 , H10K59/1201 , H10K59/131 , H10K77/111 , H10K2102/311
Abstract: Provided are a display device and a preparation method thereof. The display device includes a first substrate, where the first substrate includes a display portion and a bending portion located on at least one side of the display portion; and a second substrate, where the second substrate and the first substrate are disposed opposite to each other, the second substrate includes a first region portion corresponding to the bending portion, and the bending portion is bent towards one side facing away from the second substrate. A protective layer is provided between the bending portion of the first substrate and the first region portion of the second substrate and the bending portion of the first substrate is bent towards one side of the second substrate.
-
公开(公告)号：US11901618B2
公开(公告)日：2024-02-13
申请号：US17929907
申请日：2022-09-06
Applicant: InnoLux Corporation
Inventor： Chia-Ping Tseng , Ker-Yih Kao , Chia-Chi Ho , Ming-Yen Weng , Hung-I Tseng , Shu-Ling Wu , Huei-Ying Chen
IPC: H01Q1/38 , H01Q3/44 , H01Q9/04 , H01L27/12 , H01L21/04 , H01Q3/34 , G02F1/1343 , G02F1/1333
CPC classification number: H01Q1/38 , G02F1/13439 , H01L21/045 , H01L27/1237 , H01Q3/34 , H01Q3/44 , H01Q9/0407 , G02F1/133345 , G02F2201/07
Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.
-
公开(公告)号：US11835751B2
公开(公告)日：2023-12-05
申请号：US17264027
申请日：2020-05-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xiandong Meng , Jifeng Tan , Shuilang Dong , Wei Wang , Wenqu Liu , Wenqing Zhao , Qiuyu Ling , Xianqin Meng , Yishan Tian , Zhao Kang
IPC: G02F1/1335 , F21V8/00 , G02F1/1362 , G02F1/13357 , G02F1/1333
CPC classification number: G02B6/0093 , G02B6/0065 , G02F1/133357 , G02F1/133368 , G02F1/133512 , G02F1/133524 , G02F1/133615 , G02F1/136209 , G02F2201/07 , G02F2201/30 , G02F2201/50
Abstract: A display panel and a manufacturing method thereof, and a display device. The display panel includes a light guide plate, an array substrate, a liquid crystal layer between the light guide plate and the array substrate, a plurality of light-extracting gratings located on one side of a light exit surface of the light guide plate, and a transparent protection layer between a film layer where the light-extracting gratings are located and the light guide plate. The light guide plate includes a plurality of light-extracting port areas, and transparent areas besides the light-extracting port areas; each light-extracting port area is provided with one light-extracting grating; the protection layer is at least provided on the transparent areas, and the protection layer is configured to prevent the light guide plate in the transparent areas from being excessively etched to form a plurality of depressions.
-
公开(公告)号：US20230367155A1
公开(公告)日：2023-11-16
申请号：US18314135
申请日：2023-05-09
Applicant: Japan Display Inc.
Inventor： Yuta WAKABAYASHI , Yasuyuki HANAZAWA , Michikazu NOGUCHI , Hiromichi TANAKA
IPC: G02F1/1335 , G02F1/1333 , G02F1/1334 , G02F1/13357
CPC classification number: G02F1/133628 , G02F1/133331 , G02F1/133385 , G02F1/1334 , G02F1/133615 , G02F2201/07 , G02F1/133322 , G02F2203/01
Abstract: The following structure mitigates problems caused by heat generated by the LED and the driver IC. A liquid crystal display device including a liquid crystal display panel in which liquid crystal is sandwiched between a TFT substrate, having a pixel, and a counter substrate including: a display area being formed in an area in which the TFT substrate and the counter substrate overlap each other, a terminal area being formed on the TFT substrate, in which the counter substrate does not overlap, the terminal area being formed along a first side of the counter substrate which extends in a first direction, a second cover glass being disposed on the counter substrate, and a first cover glass being disposed under the TFT substrate, in which a width of the first cover glass in the first direction is larger than a width of the second cover glass in the first direction.
-
公开(公告)号：US11796847B2
公开(公告)日：2023-10-24
申请号：US17600321
申请日：2021-08-19
IPC: G02F1/1333 , G02F1/1362 , G02F1/1343 , H01L27/12 , H01L29/786 , H01L29/66
CPC classification number: G02F1/133345 , G02F1/133357 , G02F1/134309 , G02F1/136204 , H01L27/1222 , H01L27/1274 , H01L29/66757 , H01L29/78675 , G02F2201/07
Abstract: An array substrate, includes: a substrate, a first metal layer, a first buffer layer, and an active layer, a gate insulating layer, a second metal layer, a first insulating layer, a third metal layer and a first planarization layer. The first metal layer is electrically connected with the first doped area of the active layer through the bridge layer of the second metal layer. The third metal layer is electrically connected with the second doped area of the active layer. The array substrate of the present disclosure reduces a size of a thin film transistor by stacking the first metal layer, the second metal layer, and the third metal layer, thereby increasing pixel density. A display panel is also provided.
-
Patent Agency Ranking
公开(公告)号：US20230266623A1
公开(公告)日：2023-08-24
申请号：US18098605
申请日：2023-01-18
Inventor： Xiujun CAI , Cuie WANG , Sa LI , Wenli LAN , Dong WANG , Dawei WANG
IPC: G02F1/13357 , F21V8/00 , H04M1/02
CPC classification number: G02F1/133608 , G02B6/0088 , G02B6/0053 , G02B6/0051 , G02B6/0055 , H04M1/0264 , H04M1/0266 , G02F2201/07
Abstract: The embodiments of the application provide a backlight module and a displaying device, relating to the technical field of display. The backlight module comprises a first support structure, an optical film material and a buffer structure; the first support structure is arranged on a side away from a light-outgoing side of the optical film material, and the first support structure and the optical film material have a through-hole; the buffer structure comprises a first buffer portion arranged in the through-hole, and a rigidity of the first buffer portion is less than a rigidity of the first support structure. The backlight module is internally provided with the buffer structure, and the first buffer portion in the buffer structure is arranged in the through-hole that penetrates through the first support structure and the optical film material.
-
公开(公告)号：US11693291B2
公开(公告)日：2023-07-04
申请号：US17169983
申请日：2021-02-08
Applicant: Fujitsu Optical Components Limited
Inventor： Shuntaro Makino , Yoshinobu Kubota , Yasuhiro Ohmori , Masaharu Doi , Shintaro Takeuchi
CPC classification number: G02F1/225 , G02B6/0065 , G02F1/0316 , G02F2201/07
Abstract: An optical waveguide device has a substrate, an intermediate layer, a thin-film LN layer containing an X-cut lithium niobate, and a buffer layer stacked on the substrate, and an optical waveguide having a ridge shape formed in the thin-film LN layer. The optical waveguide device includes a plurality of electrodes provided, respectively, at a first side and a second side of the optical waveguide. The electrodes are disposed so that respective bottom surfaces thereof are at positions lower than a position of a surface of the buffer layer.
-
公开(公告)号：US10061428B2
公开(公告)日：2018-08-28
申请号：US15199307
申请日：2016-06-30
Applicant: SYNAPTICS INCORPORATED
Inventor： Petr Shepelev , Byunghwee Park
IPC: G06F3/041 , G06F3/044 , G02F1/1333 , G02F1/1368 , G02F1/1335
CPC classification number: G06F3/0416 , G02F1/13338 , G02F1/133514 , G02F1/1368 , G02F2201/07 , G02F2202/28 , G06F3/0412 , G06F3/0414 , G06F3/044 , G06F2203/04101 , G06F2203/04102 , G06F2203/04103 , G06F2203/04105
Abstract: The input devices described herein include force sensor electrodes that use capacitive sensing to measure the force with which an input object (e.g., a finger or stylus) presses down on the input device. To measure this force, the input device includes a compressible layer disposed between a backlight of a display in the input device and a cover window of the display. In one embodiment, the compressible layer is disposed between the backlight and a transparent thin-film transistor (TFT) layer in the display. In one embodiment, the compressible layer includes an air gap which has a thickness defined by adhesive material disposed on at least two edges of the display.
-
公开(公告)号：US09897825B2
公开(公告)日：2018-02-20
申请号：US15468115
申请日：2017-03-24
Applicant: SUMITOMO OSAKA CEMENT CO., LTD.
Inventor： Kei Katou , Norikazu Miyazaki , Ryo Shimizu
CPC classification number: G02F1/0327 , G02F1/035 , G02F2201/07 , G02F2201/58
Abstract: An optical modulator includes a substrate having an electro-optic effect, an optical waveguide that is formed in the substrate, and a modulation electrode (not illustrated) for modulating a light wave that propagates through the optical waveguide. In the optical modulator, a light-receiving element is disposed on the substrate, and the light-receiving element includes a light-receiving section that receives a light wave that propagates through the optical waveguide, and the light-receiving section is located on the downstream side of a center of the light-receiving element in a light wave propagating direction.
-
公开(公告)号：US20180031945A1
公开(公告)日：2018-02-01
申请号：US15650222
申请日：2017-07-14
Applicant: Fujitsu Optical Components Limited
Inventor： Yasuhiro OHMORI , Yoshinobu KUBOTA , Masaharu DOI , Masaki SUGIYAMA
CPC classification number: G02F1/2255 , G02F1/0027 , G02F1/0123 , G02F1/2257 , G02F2201/07 , G02F2203/21 , H04B10/50572
Abstract: An optical modulator includes an optical modulator chip configured to optically modulate an optical signal using an electrical signal input thereto; and a relay substrate configured to relay and couple the electrical signal to the optical modulator chip. The optical modulator chip includes a signal electrode and a ground electrode for the electrical signal, formed along a waveguide for the optical signal. One end of the optical modulator chip is arranged to face the relay substrate. An electrode connection portion coupling the electrical signal to the relay substrate by wire is provided at the one end. A distance between a tip of one end of the signal electrode in the electrode connection portion and the end of the optical modulator chip is less than a distance between a tip of an end of the ground electrode in the electrode connection portion and the end of the optical modulator chip.
-
-
-
-
-
-
-
-
-
Search Results
200
records
(took 0.021 seconds)
