Abstract:
This invention relates to a dense ceramics having ESD dissipative characteristics, tunable volume and surface resistivities in semi-insulative range (103-1011 Ohm-cm), substantially pore free, high flexural strength, light colors, for desired ESD dissipation characteristics, structural reliability, high vision recognition, low wear and particulate contamination to be used as ESD dissipating tools, fixtures, load bearing elements, work surfaces, containers in manufacturing and assembling electrostatically sensitive microelectronic, electromagnetic, electro-optic components, devices and systems.
Abstract:
A coaxial module includes a conductive housing, front and rear coaxial connectors, and circuitry disposed within the housing including a removable surge protector device. The circuitry within the housing includes a circuit board, including a cutout. Disposed within the cutout is the surge protector device. The surge protector device includes pins for mounting to an edge mount of the circuit board, and the housing includes a removable cover to allow access to the cutout and the surge protector device.
Abstract:
A method for preventing electrostatic discharge (ESD) damage in the head-suspension assembly (HSA) construction process. The method teaches the formation of a novel GMR magnetic recording head on a conductive slider substrate, the GMR head being electrically connected to the substrate and its conducting leads having balanced resistances between the leads and the substrate. By establishing an electrical connection between the GMR head and the slider substrate, the entire HSA can be grounded during its construction. By also grounding any nearby conducting elements that could inadvertently contact the HSA or its parts, no accumulated tribocharges can discharge through the sensitive GMR sensor element.
Abstract:
An arc discharge protection apparatus to prevent arc discharge from occurring in a high voltage output zone caused by abnormal conditions includes an electrode plate to absorb high voltage arc discharge signals released by a voltage boosting unit in the high voltage output zone. A voltage switch unit receives the high voltage arc discharge signals absorbed by the electrode plate and transforms to low voltage arc discharge signals. A rectification unit receives and rectifies the low voltage arc discharge signals and outputs an arc hybrid wave. A trigger unit detects the arc hybrid wave and outputs a trigger signal to stop operation of the control unit or driving unit, thereby prevents arc discharge from causing damage to the surrounding elements resulting from accumulation of heat or sparks.
Abstract:
An electrochemical processing method is provided for forming a current carrying device for semiconductor chip packaging and similar applications. The method comprises selecting sections of a substrate to carry current wherein a selected section is at least partly covered with a voltage switchable dielectric material, rendering the voltage switchable dielectric material conductive, and electrochemically forming a current carrying material directly on the voltage switchable dielectric material. The voltage switchable dielectric material can have a characteristic voltage, such that when a voltage having a magnitude exceeding the characteristic voltage is applied to the voltage switchable dielectric material, the voltage switchable dielectric material switches from a dielectric material to a conductive material. When conductive, the voltage switchable dielectric material is amenable to electrochemical processing such as electroplating.
Abstract:
A memory card is disclosed which has a card body (2) having a concavity (9) formed at the forward end thereof in the inserting direction and in which terminals (5) are disposed and projections (10) are formed between the terminals (5) to prevent the terminals (5) from being touched or accessed from outside. A receptacle for the memory card is also disclosed. The memory card has a simple structure designed to positively protect the terminals and easily let out dust or the like from inside, thereby permitting to assure a positive connection with the receptacle.
Abstract:
This invention relates to a dense ceramics having ESD dissipative characteristics, tunable volume and surface resistivities in semi-insulative range (103-1011 Ohm-cm), substantially pore free, high flexural strength, light colors, for desired ESD dissipation characteristics, structural reliability, high vision recognition, low wear and particulate contamination to be used as ESD dissipating tools, fixtures, load bearing elements, work surfaces, containers in manufacturing and assembling electrostatically sensitive microelectronic, electromagnetic, electro-optic components, devices and systems.
Abstract:
A high voltage transient surge suppression system which provides an improved fusing to greatly reduce or eliminate the chance of secondary combustion during an excess power situation. The invention discloses a fuse link system which places one or more fuse links between a first electrical potential and a second electrical potential, and which uses air to insulate or isolate electrical potentials so that products of combustion from an excess power surge do not form a conductive path between electrical potentials on a printed circuit board.
Abstract:
This invention relates to a dense ceramics having ESD dissipative characteristics, tunable volume and surface resistivities in semi-insulative range (103-1011 Ohm-cm), substantially pore free, high flexural strength, light colors, for desired ESD dissipation characteristics, structural reliability, high vision recognition, low wear and particulate contamination to be used as ESD dissipating tools, fixtures, load bearing elements, work surfaces, containers in manufacturing and assembling electrostatically sensitive microelectronic, electromagnetic, electro-optic components, devices and systems.
Abstract:
A multi-chip module (MCM) having a substrate including a first surface, a second surface and a multi-layer interconnection arrangement disposed between the two surfaces. A high-density thin-film circuit region is provided on the substrate first surface to interconnect a plurality of integrated circuit chips and the multi-layer interconnection arrangement. The integrated circuit chips are powered through the high-density thin-film circuit region, which receives power from the multi-layer interconnection arrangement. A plurality of discrete on-board voltage converter devices, mounted on at least one substrate surface, provide uniform power supply distribution to multi-layer interconnection arrangement power planes, converting an MCM input voltage and current to a relatively lower output voltage and a relatively higher output current. On-board voltage conversion permits the MCM to receive power at higher voltages than is supported by the high-density thin-film circuit region, decreasing MCM input current magnitudes and reducing noise and energy losses. The voltage converters are discrete components. Electrically-isolated MCM power regions isolate power and ground noise.