公开(公告)号：US20040198028A1

公开(公告)日：2004-10-07

申请号：US10815813

申请日：2004-04-02

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Koichiro Tanaka ,  Hidekazu Miyairi ,  Hironobu Shoji

IPC分类号： H01L021/00 ,  H01L021/36 ,  B23K026/067

CPC分类号： H01L21/02686 ,  B23K26/0604 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/0853 ,  B23K2101/40 ,  H01L21/2026

摘要： Crystallization by irradiation of laser light forms a plurality of convex portions (ridges) on the surface of a crystalline semiconductor film that is obtained, which decreases a film quality. A method of laser irradiation comprises the steps of: overlapping an area which is irradiated with a first laser beam of a pulsed oscillation having a wavelength of equal to or shorter than that of visible light with an area which is irradiated with a second laser beam of a pulsed oscillation having a longer wavelength than that of the first laser beam; and irradiating a subject to be irradiated with the first laser beam and the second laser beam while synchronizing the pulsed oscillation of the first laser beam with that of the second laser beam, and moving the subject to be irradiated, and the first laser beam and the second laser beam relatively each other.

摘要翻译： 通过照射激光进行结晶，在获得的结晶半导体膜的表面上形成多个凸部（凸脊），这降低了膜质量。 一种激光照射方法包括以下步骤：将具有等于或短于可见光的波长的脉冲振荡的第一激光束照射的区域与照射第二激光束的区域重叠 具有比第一激光束长的波长的脉冲振荡; 并且在使第一激光束的脉冲振荡与第二激光束的脉冲振荡同步的同时照射第一激光束和第二激光束照射的被摄体，并且移动要照射的被摄体，并且第一激光束和 第二激光束相对彼此。

公开(公告)号：US20040129685A1

公开(公告)日：2004-07-08

申请号：US10740817

申请日：2003-12-22

申请人： HITACHI VIA MECHANICS, LTD.

发明人： Kunio Arai ,  Kenji Suzuki

IPC分类号： B23K026/38 ,  B23K026/067

CPC分类号： B23K26/0673 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/067 ,  B23K26/082 ,  B23K26/382 ,  B23K2103/50 ,  H05K3/0026

摘要： Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an fnull lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the fnull lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.

摘要翻译： 本发明提供一种多光束激光钻孔装置，用于在远心误差被抑制的同时位于两个位置的同时进行钻孔，其中将检流计镜用于第一激光束的常规光学系统和电流计镜系统位于 靠近ftheta镜头，以防止发生远心错误。 已经被第二电流计反射镜系统偏转的第二激光束透射通过偏振光束混合器并且入射到第一电流计反射镜系统和透镜上，因此在两个位置上同时钻出工件 使用第一和第二激光束。

公开(公告)号：US20040016732A1

公开(公告)日：2004-01-29

申请号：US10266989

申请日：2002-10-08

发明人： Xinbing Liu ,  Chen-Hsiung Cheng

IPC分类号： B23K026/04 ,  B23K026/38 ,  B23K026/067

CPC分类号： B23K26/0608 ,  B23K26/032 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/0676 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/05 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  B41J2/161 ,  B41J2/1634

摘要： A microfilter design system for use with a laser drilling system producing multiple sub-beams for parallel drilling operations includes an optical intensity detector illuminated by the multiple sub-beams of the laser drilling system. An analysis module operates the optical intensity detector to produce intensity measurement data for each of the multiple sub-beams. A memory operable with a data processing system stores the intensity measurement data for analysis.

摘要翻译： 用于产生用于平行钻井操作的多个子光束的激光钻孔系统的微型过滤器设计系统包括由激光钻孔系统的多个子光束照射的光学强度检测器。 分析模块操作光强度检测器以产生多个子光束中的每一个的强度测量数据。 可与数据处理系统一起操作的存储器存储用于分析的强度测量数据。

公开(公告)号：US20030116545A1

公开(公告)日：2003-06-26

申请号：US10108481

申请日：2002-03-29

申请人： Matsushita Electric Works, Ltd.

发明人： Yoshiyuki Kaji

IPC分类号： B23K026/38 ,  B23K026/067

CPC分类号： B23K26/0608 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/0846 ,  B23K2101/16 ,  B26D7/10

摘要： A prepreg cutting method is provided that cuts prepreg without applying any processing, such as heating, to that part of prepreg other than the place to be cut. When prepreg formed by impregnating a base material with a resin and left to semi-harden is to be cut into a specified dimension, the surface of the prepreg is irradiated with a laser beam so that the resin of the irradiated portion is softened while the laser beam irradiating position is shifted on the prepreg, and the softened resin part is cut by a cutting blade. Because the cutting blade cuts the prepreg portion where the resin has softened, resin dust will not scatter.

摘要翻译： 提供了一种预浸料切割方法，其将预浸料切割，而不对除了要切割的地方之外的那部分预浸料进行任何加工，例如加热。 将通过用树脂浸渍基材并保持半硬化形成的预浸料坯切割成规定尺寸时，用激光束照射预浸料的表面，使得照射部分的树脂在激光 光束照射位置在预浸料上移动，软化树脂部分被切割刀片切割。 由于切割刀片切割树脂软化的预浸料部分，所以树脂粉尘不会散开。

公开(公告)号：US20030085208A1

公开(公告)日：2003-05-08

申请号：US10273422

申请日：2002-10-17

申请人： SEIKO EPSON CORPORATION

发明人： Kazushige Umetsu ,  Jun Amako ,  Kenichi Honda

IPC分类号： B23K026/38 ,  B23K026/067

CPC分类号： B23K26/0673 ,  B23K26/067 ,  B23K2101/38 ,  G02F1/136204 ,  H05K3/027 ,  H05K3/225

摘要： An apparatus for cutting an electrical wiring line includes a laser generator for generating a laser beam, an optical beam branching element for branching a laser beam generated by the laser generator into a plurality of branch beams, and a condenser element for condensing the branch beams branched by the optical beam branching element (the optical beam branching element can also serve as the condenser element). The condenser element may be a condenser lens which is separate from the optical beam branching element. The power and the focal depth of the branch beam may be adjusted. When the substrate has a transparency to the laser beam, the branch beam is directed to the electrical wiring line formed on the substrate from the opposite side to the surface having the electrical wiring line.

摘要翻译： 一种用于切割电线的设备包括用于产生激光束的激光发生器，用于将由激光发生器产生的激光束分支成多个分支光束的光束分支元件，以及用于使分支光束分支 通过光束分支元件（光束分支元件也可以用作聚光元件）。 聚光元件可以是与光束分支元件分离的聚光透镜。 可以调整分支光束的光焦度和焦深。 当基板对激光束具有透明度时，分支光束从与具有电布线的表面相反的一侧被引向形成在基板上的电布线。

公开(公告)号：US20020195434A1

公开(公告)日：2002-12-26

申请号：US10176041

申请日：2002-06-21

申请人： Samsung Electronics Co., Ltd.

发明人： Hyung-Woo Nam ,  Dae-Ho Choo ,  Baek-Kyun Jeon

IPC分类号： B23K026/067 ,  B23K026/38

CPC分类号： B23K26/0673 ,  B23K26/067 ,  B23K26/146 ,  C03B33/093 ,  C03B33/102 ,  G02F1/133351 ,  Y02P40/57

摘要： A method and apparatus for multiple-cutting a substrate into a plurality of pieces with a single irradiation of a laser beam are disclosed. At least two light reflectivity/transmittance control plates are placed on a path through which the light passes such that light reflectivity/transmittance is varied depending on an angle between the generated light and the plates. Plural surface portions of the substrate are heated simultaneously and are then cooled by a sprayed coolant so that the substrate is cut into a plurality of pieces simultaneously. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.

摘要翻译： 公开了一种通过激光束的单次照射将衬底多次切割成多个片的方法和装置。 至少两个光反射率/透光率控制板被放置在光通过的路径上，使得光反射率/透射率根据产生的光和板之间的角度而变化。 同时加热基板的多个表面部分，然后通过喷射的冷却剂进行冷却，从而将基板同时切割成多个片。 因此，切割时间大大缩短，生产率提高。

公开(公告)号：US20020195433A1

公开(公告)日：2002-12-26

申请号：US10042697

申请日：2002-02-10

发明人： IGOR TROITSKI

IPC分类号： B23K026/00 ,  B23K026/067

CPC分类号： B23K26/0613 ,  B23K26/0608 ,  B23K26/0622 ,  B23K26/0676 ,  B23K26/361 ,  B23K26/53 ,  B44B7/00

摘要： Embodiments of methods and an apparatus for creating points or areas of laser-induced damage inside a transparent material are disclosed. One or more embodiments of the invention comprise a method and system for producing etch points by control of breakdown process development. In one embodiment, at the beginning an applied laser radiation level just exceeds an energy threshold for creating a plasma condition in the material, and thereafter the energy level of the applied laser radiation is just maintain the plasma condition and is applied before the plasma condition extinguishes, but after a shock wave associated therewith has passed. Other embodiments of the invention comprise a method and a system for producing etch points by controlling a space structure of laser beam. According to the invention a laser generates a TEMmn radiation. The values of the integers m and n are controlled and determined so as to reproduce particular gray shades for a particular point of an image. Points or areas of laser-induced damage produced by these methods do have the traditional and undesirable star configuration. Furthermore, it is possible to control the brightness of these points without changing their size.

摘要翻译： 公开了在透明材料内产生激光诱发损伤点或区域的方法和设备的实施例。 本发明的一个或多个实施例包括通过控制击穿过程开发产生蚀刻点的方法和系统。 在一个实施例中，在开始时，施加的激光辐射水平刚刚超过用于在材料中产生等离子体状态的能量阈值，此后所施加的激光辐射的能量水平仅维持等离子体状态并且在等离子体条件熄灭之前被施加 但是在与之相关的冲击波已经过去之后。 本发明的其它实施例包括通过控制激光束的空间结构来产生蚀刻点的方法和系统。 根据本发明，激光产生TEMmn辐射。 控制和确定整数m和n的值，以便为图像的特定点再现特定的灰度。 由这些方法产生的激光诱发损伤的点或区域确实具有传统和不期望的星形结构。 此外，可以在不改变它们的尺寸的情况下控制这些点的亮度。

公开(公告)号：US20020148815A1

公开(公告)日：2002-10-17

申请号：US10172532

申请日：2002-06-13

申请人： Toshiba Tec Kabushiki Kaisha

发明人： Isao Suzuki ,  Masahi Shimosato ,  Hiroshi Ito

IPC分类号： B23K026/38 ,  B23K026/067

CPC分类号： B41J2/1634 ,  B23K26/066 ,  B23K26/067 ,  B23K26/0676 ,  B23K26/384 ,  B41J2/162

摘要： The present invention comprises an array lens illumination system for shaping laser light in a band-like beam, a mask which is arranged in an optical path of the laser light from the array lens illumination system and on which a plurality of circular apertures are formed in a staggered shape in accordance with an arranged state of orifices formed on an orifice plate, a shift member which is arranged at the incident side of the laser light rather than the mask, and which splits the laser light incident on the mask into a plurality of beams in accordance with the number of circular apertures and irradiates the split beams onto the respective circular apertures of the mask, and a projecting lens for forming an image of the laser light passing through the mask on the orifice plate.

摘要翻译： 本发明包括一种阵列透镜照明系统，用于在带状光束中成形激光，掩模被布置在来自阵列透镜照明系统的激光的光路中，并且其上形成有多个圆形孔 根据形成在孔板上的孔口的布置状态的交错形状，布置在激光的入射侧而不是掩模的移动构件，并且将入射在掩模上的激光分成多个 根据圆形孔的数量的光束，将分割光束照射到掩模的各个圆形孔上，以及用于形成通过孔板上的掩模的激光的图像的投影透镜。

公开(公告)号：US20020092833A1

公开(公告)日：2002-07-18

申请号：US10032061

申请日：2001-12-31

申请人： Orbotech Ltd.

发明人： Eliezer Lipman ,  Yehiam Prior ,  Abraham Gross

IPC分类号： B23K026/38 ,  B23K026/067

CPC分类号： B23K26/067 ,  B23K26/0673 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0038 ,  H05K2203/108

摘要： A laser micromachining system improve the utilization of laser energy by using multiple spectral components or time-altered pulses.

摘要翻译： 激光微加工系统通过使用多个光谱分量或时变脉冲来提高激光能量的利用率。

公开(公告)号：US20020088784A1

公开(公告)日：2002-07-11

申请号：US10013533

申请日：2001-12-13

发明人： Christophe Bertez

IPC分类号： B23K026/14 ,  B23K026/067

CPC分类号： B23K26/0608 ,  B23K26/0665 ,  B23K26/0676 ,  B23K26/0734 ,  B23K26/123 ,  B23K26/14 ,  B23K26/1476 ,  B23K26/40 ,  B23K2101/35

摘要： Method and plant for cutting or welding by a laser beam with dual-flow and double-focus cutting head. The plant includes a laser generator to generate at least one main laser beam (10), a first optical element (1) enabling the main laser beam (10) to be divided into at least two subsidiary laser beams (11, 12), a first outlet nozzle (4) through which one (11) of the subsidiary laser beams passes, and a second outlet nozzle (3) through which the other (12) of the subsidiary laser beams passes, the first and second outlet nozzles (4, 3) being approximately coaxial one with the other. In this way, it is possible to focus the central beam (11) onto a focusing point (PF) by a first focusing element (1), such as a lens, and the other beam (12) onto an annular focusing zone (ZAF).

摘要翻译： 用双流和双焦切割头的激光束切割或焊接的方法和设备。 所述设备包括激光发生器，用于产生至少一个主激光束（10），使所述主激光束（10）能够被分成至少两个辅助激光束（11,12）的第一光学元件（1） 一个辅助激光束通过的第一出口喷嘴（4）和另一个（12）辅助激光束通过的第二出口喷嘴（3），第一和第二出口喷嘴（4） 3）与另一个大致同轴。 以这种方式，可以通过诸如透镜的第一聚焦元件（1）将中心光束（11）聚焦到聚焦点（PF）上，而将另一个光束（12）聚焦到环形聚焦区域（ZAF）上 ）。