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    SYSTEM AND METHOD FOR IMAGING USING SPECKLE-FREE ILLUMINATION
    2.
    发明公开
    SYSTEM AND METHOD FOR IMAGING USING SPECKLE-FREE ILLUMINATION 审中-公开

    公开(公告)号：US20240295743A1

    公开(公告)日：2024-09-05

    申请号：US18582408

    申请日：2024-02-20

    申请人： Orbotech Ltd.

    发明人： Jonathan Azogui

    IPC分类号： G02B27/48 ,  H01S3/06 ,  H01S3/16

    CPC分类号： G02B27/48 ,  H01S3/0619 ,  H01S3/169

    摘要： An illumination system comprising is disclosed. The illumination system may include a narrowband illumination source. The illumination system may include an illumination path including one or more illumination optics. The illumination system may include a quantum dot assembly within the illumination path, the quantum dot assembly comprising a quantum dot layer disposed on a substrate, wherein the quantum dot assembly is configured to receive a narrowband illumination beam from the narrowband illumination source and emit a converted illumination beam having a spectral range broader than the narrowband illumination beam. The illumination system may include wherein the one or more illumination optics are configured to direct illumination from the quantum dot assembly to a sample disposed on a sample stage.

    Multi-Modal Wide-Angle Illumination Employing a Compound Beam Combiner
    4.
    发明申请
    Multi-Modal Wide-Angle Illumination Employing a Compound Beam Combiner 有权

    公开(公告)号：US20220155574A1

    公开(公告)日：2022-05-19

    申请号：US17441279

    申请日：2020-07-09

    申请人： Orbotech Ltd.

    发明人： David Fisch ,  Avraham Adler ,  Ilia Lutsker ,  Yigal Katzir ,  Avinoam Rosenberg

    IPC分类号： G02B19/00 ,  G02F1/29 ,  G02B3/08 ,  G02B21/36 ,  G02B26/08

    摘要： Provided is an optical apparatus that includes an illumination assembly which include an extended radiation source emitting radiation with a controllable spatial distribution and telecentric condensing optics, configured to receive and project the emitted radiation with a numerical aperture exceeding 0.3 along a first optical axis onto a field and an imaging assembly that includes a sensor and objective optics configured to image the field along a second optical axis onto the sensor and also a prism combiner positioned between the field and the condensing and objective optics which is configured to combine the first and second optical axes, while reflecting at least one of the optical axes multiple times within the prism combiner.

    Methods and Systems for Producing Three-Dimensional Electronic Products
    5.
    发明申请
    Methods and Systems for Producing Three-Dimensional Electronic Products 有权

    公开(公告)号：US20210157238A1

    公开(公告)日：2021-05-27

    申请号：US17100752

    申请日：2020-11-20

    申请人： Orbotech Ltd.

    发明人： Gil Bernstein Toker ,  Sharona Cohen ,  Zvi Kotler

    IPC分类号： G03F7/16 ,  G03F7/004 ,  G03F7/033

    摘要： A method for manufacturing, the method includes coupling a sample to a mount, and immersing at least part of the sample in a photosensitive liquid having an upper surface defining an interface between the photosensitive liquid and a surrounding environment. At least a polymer layer that is coupled to at least a section of the sample is formed by: setting a thickness of the polymer layer by controlling a position of the sample relative to the upper surface, and illuminating at least the upper surface so as to polymerize the photosensitive liquid to form the polymer layer.

    Hybrid 3D Inspection System
    6.
    发明申请
    Hybrid 3D Inspection System 有权

    公开(公告)号：US20210102892A1

    公开(公告)日：2021-04-08

    申请号：US17064212

    申请日：2020-10-06

    申请人： Orbotech Ltd.

    发明人： Ram Oron ,  Hanina Golan ,  Ilia Lutsker ,  Gil Tidhar

    IPC分类号： G01N21/45 ,  G03H1/04 ,  G03H1/00

    摘要： An optical inspection apparatus includes an interferometer module, which is configured to direct a beam of coherent light toward an area under inspection and to produce a first image of interference fringes of the area. The apparatus also includes a triangulation module configured to project a pattern of structured light onto the area, and at least one image sensor configured to capture the first image of interference fringes and a second image of the pattern that is reflected from the area. Beam combiner optics are configured to direct the beam of coherent light and the projected pattern to impinge on the same location on the area. A processor is configured to process the first and second images in order to generate a 3D map of the area.

    METHOD PRODUCING A CONDUCTIVE PATH ON A SUBSTRATE
    7.
    发明申请
    METHOD PRODUCING A CONDUCTIVE PATH ON A SUBSTRATE 审中-公开

    公开(公告)号：US20200093001A1

    公开(公告)日：2020-03-19

    申请号：US16689262

    申请日：2019-11-20

    申请人： Orbotech Ltd.

    发明人： Zvi Kotler ,  Michael Zenou

    IPC分类号： H05K3/02 ,  H05K1/09 ,  H05K3/26 ,  H05K3/22 ,  H05K3/12

    摘要： A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

    Method producing a conductive path on a substrate
    8.
    发明授权
    Method producing a conductive path on a substrate 有权

    公开(公告)号：US10537027B2

    公开(公告)日：2020-01-14

    申请号：US13958043

    申请日：2013-08-02

    申请人： Orbotech Ltd.

    发明人： Zvi Kotler ,  Michael Zenou

    IPC分类号： H05K3/02

    摘要： A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.