Abstract:
A field emission cathode is provided which includes a substrate and a conductive layer disposed adjacent the substrate. An electrically resistive pillar is disposed adjacent the conductive layer, the resistive pillar having a substantially flat surface spaced from and substantially parallel to the substrate. A layer of diamond is disposed adjacent the flat surface of the resistive pillar.
Abstract:
An electron-emitting device is provided which is a laminate including a semiconductor layer with fine particles formed between a pair of opposing electrodes an electron-emitting region insulated from the electrodes is formed at a side end surface of the insulating layer formed at the part at which the electrodes oppose each other, and electrons are emitted from the electron-emitting region by applying a voltage between the electrodes.
Abstract:
An image-forming apparatus is comprised of a substrate, an electron-emitting device which is provided on the substrate and includes an electron-emitting region between electrodes and emits electrons on application of voltage between the electrodes, and an image-forming member which forms an image on irradiation of an electron beam. A diameter S.sub.1 of the electron beam on the image-forming member in direction of application of the voltage between the electrodes is given by Equation (I):S.sub.1 =K.sub.1 .multidot.2d(V.sub.f /V.sub.a).sup.1/2 (I)where K.sub.1 is a constant and 0.8.ltoreq.K.sub.1 .ltoreq.1.0, d is a distance between the substrate and the image-forming member, V.sub.f is a voltage applied between the electrodes, and V.sub.a is a voltage applied to the image-forming member. A method for designing a diameter of an electron beam at an image-forming member face of the image-forming apparatus is comprised of a diameter S.sub.1 the electron beam at the image-forming member face in a direction of application of the voltage between the electrodes designed so as to satisfy the equation (I).
Abstract:
An electron beam emitting device, includes a surface conduction type of thin film device having an electron emitting area and at least a pair of electrodes for passing current through the electron emitting area, and a voltage applicator for applying a voltage independently on each of the electrodes, the voltage applicator applying a voltage on each electrode so that each of the electrodes may become higher or lower in potential relative to the other electrode.
Abstract:
A vacuum channel field effect transistor includes a first insulator on a p-type semiconductor substrate, a gate electrode on the first insulator, a second insulator on the gate electrode, a drain electrode on the second insulator, and an n+ impurity diffusion layer in the surface of the p-type semiconductor substrate, the n+ impurity diffusion layer being in contact with a side wall including side faces of the first insulator, the gate electrode, and the second insulator. Application of predetermined voltages to the n+ impurity diffusion layer, the gate electrode, and the drain electrode causes charge carriers in the n+ impurity diffusion layer to travel through a vacuum or air faced by the side wall to the drain electrode, which can increase the source-drain current.
Abstract:
A tunneling electro source, an array thereof and methods for making the same are provided. The tunneling electron source is a surface tunneling micro electron source having a planar multi-region structure. The tunneling electron source includes an insulating substrate, and two conductive regions and one insulating region arranged on a surface of the insulating substrate. The insulating region is arranged between the two conductive regions and abuts on the two conductive regions. Minimum spacing between the two conductive regions, which equals to a minimum width of the insulating region, is less than 100 nm.
Abstract:
An object of the present invention is to prevent a device portion from being electrostatically charged with the use of the high resistivity film, and at the same time prevent a leak current passing the device portion due to an existing high resistivity film, in an electron source with the use of a surface-conduction electron-emitting device. This process for manufacturing the electron-emitting device comprises the steps of: forming an electroconductive thin film 4 astride device electrodes; forming the high resistivity film 7 in a region except the electroconductive thin film 4 and a perimeter thereof; subjecting the electroconductive thin film 4 to forming processing, to form a fissure 5 therein; and depositing a carbon film 6 inside the fissure 5 and in a region reaching the high resistivity film 7 from the edge of the fissure 5, by applying voltage between device electrodes 2 and 3 under an atmosphere containing a carbon compound.
Abstract:
By applying a drive voltage Vf [V] between first and second conductive films, when electrons are emitted by the first conductive film, an equipotential line of 0.5 Vf [V] is inclined toward the first conductive film, rather than toward the second conductive film, in the vicinity of the electron emitting portion of the first conductive film, in a cross section extending across the electron emitting portion and the portion of the second conductive film located nearest the electron emitting portion. The present invention improves electron emission efficiency.
Abstract:
An electron emitter has an electric field receiving member formed on a substrate, a cathode electrode formed on one surface of the electric field receiving member, and an anode electrode formed on the one surface of the electric field receiving member, with a slit defined between the cathode electrode and the anode electrode. The electric field receiving member is made of a dielectric material. The electron emitter also has a modulation circuit for modulating a pulse signal applied between the cathode electrode and the anode electrode based on a control signal supplied from a controller such as a CPU to control at least an amount of emitted electrons.