Image-forming apparatus, and designation of electron beam diameter at
image-forming member in image-forming apparatus
    43.
    发明授权
    Image-forming apparatus, and designation of electron beam diameter at image-forming member in image-forming apparatus 失效
    图像形成装置,以及图像形成装置中图像形成部件处的电子束直径的指定

    公开(公告)号:US5455597A

    公开(公告)日:1995-10-03

    申请号:US172060

    申请日:1993-12-23

    CPC classification number: H01J1/316 H01J31/127 H01J2201/3165

    Abstract: An image-forming apparatus is comprised of a substrate, an electron-emitting device which is provided on the substrate and includes an electron-emitting region between electrodes and emits electrons on application of voltage between the electrodes, and an image-forming member which forms an image on irradiation of an electron beam. A diameter S.sub.1 of the electron beam on the image-forming member in direction of application of the voltage between the electrodes is given by Equation (I):S.sub.1 =K.sub.1 .multidot.2d(V.sub.f /V.sub.a).sup.1/2 (I)where K.sub.1 is a constant and 0.8.ltoreq.K.sub.1 .ltoreq.1.0, d is a distance between the substrate and the image-forming member, V.sub.f is a voltage applied between the electrodes, and V.sub.a is a voltage applied to the image-forming member. A method for designing a diameter of an electron beam at an image-forming member face of the image-forming apparatus is comprised of a diameter S.sub.1 the electron beam at the image-forming member face in a direction of application of the voltage between the electrodes designed so as to satisfy the equation (I).

    Abstract translation: 一种图像形成装置包括一基板,一电子发射装置,该电子发射装置设置在该基板上,并且包括电极之间的电子发射区域,并且在该电极之间施加电压而发射电子;以及图像形成部件,其形成 照射电子束的图像。 在电极之间施加电压方向上的图像形成部件上的电子束的直径S1由等式(I)给出:S1 = K1x2d(Vf / Va)1/2(I)其中K1是常数 并且0.8≤Ki≤1.0,d是衬底和图像形成构件之间的距离,Vf是施加在电极之间的电压,Va是施加到图像形成构件的电压。 用于设计图像形成装置的图像形成构件面处的电子束的直径的方法包括直径S1,图像形成构件的电子束在施加电极之间的电压方向上面对 设计为满足等式(I)。

    VACUUM CHANNEL FIELD EFFECT TRANSISTOR, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20210375571A1

    公开(公告)日:2021-12-02

    申请号:US17324923

    申请日:2021-05-19

    Inventor: Yoshiyuki Ando

    Abstract: A vacuum channel field effect transistor includes a first insulator on a p-type semiconductor substrate, a gate electrode on the first insulator, a second insulator on the gate electrode, a drain electrode on the second insulator, and an n+ impurity diffusion layer in the surface of the p-type semiconductor substrate, the n+ impurity diffusion layer being in contact with a side wall including side faces of the first insulator, the gate electrode, and the second insulator. Application of predetermined voltages to the n+ impurity diffusion layer, the gate electrode, and the drain electrode causes charge carriers in the n+ impurity diffusion layer to travel through a vacuum or air faced by the side wall to the drain electrode, which can increase the source-drain current.

    Electron-emitting device, electron source, picture display unit and manufacturing process therefor
    48.
    发明申请
    Electron-emitting device, electron source, picture display unit and manufacturing process therefor 失效
    电子发射器件,电子源,图像显示单元及其制造工艺

    公开(公告)号:US20050269936A1

    公开(公告)日:2005-12-08

    申请号:US11138472

    申请日:2005-05-27

    Applicant: Kunio Takada

    Inventor: Kunio Takada

    CPC classification number: H01J9/027 H01J1/316 H01J31/127 H01J2201/3165

    Abstract: An object of the present invention is to prevent a device portion from being electrostatically charged with the use of the high resistivity film, and at the same time prevent a leak current passing the device portion due to an existing high resistivity film, in an electron source with the use of a surface-conduction electron-emitting device. This process for manufacturing the electron-emitting device comprises the steps of: forming an electroconductive thin film 4 astride device electrodes; forming the high resistivity film 7 in a region except the electroconductive thin film 4 and a perimeter thereof; subjecting the electroconductive thin film 4 to forming processing, to form a fissure 5 therein; and depositing a carbon film 6 inside the fissure 5 and in a region reaching the high resistivity film 7 from the edge of the fissure 5, by applying voltage between device electrodes 2 and 3 under an atmosphere containing a carbon compound.

    Abstract translation: 本发明的目的是通过使用高电阻率膜来防止器件部分被静电充电,并且同时防止在电子源中由于现有的高电阻率膜而导致的器件部分漏电流 使用表面传导电子发射器件。 用于制造电子发射器件的该方法包括以下步骤:形成横跨器件电极的导电薄膜; 在导电薄膜4以外的区域及其周边形成高电阻率膜7; 对导电薄膜4进行成形处理,在其中形成裂缝5; 并且在裂缝5内部和从裂缝5的边缘到达高电阻率膜7的区域中,通过在含有碳化合物的气氛下在器件电极2和3之间施加电压而沉积碳膜6。

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