公开(公告)号：US06734419B1

公开(公告)日：2004-05-11

申请号：US09896014

申请日：2001-06-28

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01J502

CPC classification number: H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully supported and structurally fortified by the molded image sensor die package. An image sensor die is then attached to the thus supported lead frame or LGA using a standard flip-chip connection.

Abstract translation: 一种用于形成图像传感器组件的方法包括将引线框架或焊盘网格阵列（LGA）整体地形成到模制的图像传感器芯片封装中，使得引线框架或LGA被模制的图像传感器芯片封装完全支撑并在结构上加强。 然后使用标准倒装芯片连接将图像传感器裸片附接到如此支撑的引线框架或LGA。

公开(公告)号：US06717126B1

公开(公告)日：2004-04-06

申请号：US09906868

申请日：2001-07-16

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2700

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of capturing an image at an angle to a line of sight an image sensor includes receiving radiation of the image. The received radiation is reflected towards an active area of the image sensor with a first panel of a reflector. The radiation strikes the active area and the image sensor captures the image.

Abstract translation: 一种以与图像传感器包括接收图像的辐射的视线成一定角度捕获图像的方法。 接收到的辐射被反射器的第一面板朝着图像传感器的有效区域反射。 辐射照射到有源区域，图像传感器捕获图像。

公开(公告)号：US06562655B1

公开(公告)日：2003-05-13

申请号：US09839288

申请日：2001-04-20

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2144

CPC classification number: H01L21/565 ,  H01L23/4334 ,  H01L23/552 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component is mounted to an upper surface of a substrate. A heat sink is aligned above the electronic component and supported by spring elements of the heat sink on the upper surface of the substrate. The spring elements press the heat sink against a mold half during encapsulation to prevent flash from forming on the heat sink and also operate to ground the heat sink.

Abstract translation: 电子部件安装在基板的上表面。 散热器在电子部件上方对准，并由衬底的上表面上的散热器的弹簧元件支撑。 弹簧元件在封装期间将散热器压在半模上，以防止在散热片上形成闪光，并且还可以对散热片进行接地操作。

公开(公告)号：US06515269B1

公开(公告)日：2003-02-04

申请号：US09490717

申请日：2000-01-25

Applicant: Steven Webster ,  Tony Arellano ,  Roy Dale Hollaway

Inventor： Steven Webster ,  Tony Arellano ,  Roy Dale Hollaway

IPC: H01L2700

CPC classification number: H01L27/14618 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: An image sensor package includes an image sensor having an active area, a window, and a window support in contact with the active area and in contact with the window. The window support entirely encloses, and thus protects, the active area of the image sensor. During use, radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. By forming the window and the window support to have a similar refractive index, the amount of reflected radiation is minimized thus enhancing the sensitivity of the image sensor package. Further, the window support completely fills the region between the window and the active area thus eliminating any possibility of moisture condensation within the image sensor package.

Abstract translation: 图像传感器封装包括具有活动区域，窗口和与活动区域接触并与窗口接触的窗口支撑件的图像传感器。 窗户支架完全封闭，从而保护图像传感器的有效区域。 在使用过程中，辐射通过窗户，穿过窗户支撑件，并撞击响应辐射的有源区域。 通过将窗口和窗口支撑件形成为具有类似的折射率，反射辐射的量被最小化，从而增强了图像传感器封装的灵敏度。 此外，窗户支撑件完全填充窗口和有效区域之间的区域，从而消除了图像传感器封装内的湿气凝结的任何可能性。

公开(公告)号：US06503780B1

公开(公告)日：2003-01-07

申请号：US09610309

申请日：2000-07-05

Applicant: Thomas P. Glenn ,  Steven Webster ,  Tony Arellano

Inventor： Thomas P. Glenn ,  Steven Webster ,  Tony Arellano

IPC: H01L2144

CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pressed into the window support layer such that the windows are above active areas of the image sensors. The shallow cuts in combination with the window support layer define cavities above bond pads of the image sensors. The window sheet is cut from an exterior surface directly opposite of the cavities above the bond pads to singulating the windows from one another. The wafer is then singulated to form a plurality of image sensor packages.

Abstract translation: 为了形成图像传感器封装，在具有多个窗口的窗片的内表面中形成一系列浅切口。 在具有多个图像传感器的晶片的上表面上形成窗口支撑层。 窗片的内表面被压入窗户支撑层，使得窗口在图像传感器的有效区域之上。 与窗口支撑层组合的浅切口在图像传感器的接合焊盘上方形成空腔。 窗板从与接合垫上方的空腔直接相对的外表面切割，以将窗口彼此分开。 然后将晶片分割成多个图像传感器封装。

公开(公告)号：US06486545B1

公开(公告)日：2002-11-26

申请号：US09916848

申请日：2001-07-26

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2302

CPC classification number: H01L25/0657 ,  H01L23/49827 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16237 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/00014

Abstract: A ball grid array (BAG) package includes a substrate having a central aperture. Traces are coupled to a lower surface of the substrate. First ends of the traces support an electronic component in the central aperture. Interconnection balls are formed on second ends of the traces. The interconnection balls extend from the second ends of the traces, through the substrate, and protrude above a second surface of the substrate.

Abstract translation: 球栅阵列（BAG）封装包括具有中心孔的衬底。 迹线耦合到衬底的下表面。 迹线的第一端支撑中心孔中的电子部件。 互连球形成在迹线的第二端。 互连球从迹线的第二端延伸穿过衬底，并突出在衬底的第二表面上方。

公开(公告)号：US06455927B1

公开(公告)日：2002-09-24

申请号：US09804749

申请日：2001-03-12

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2302

CPC classification number: B81B7/0067 ,  G02B26/0841 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A micromirror device package includes a micromirror device chip having a micromirror device area on an upper surface of the micromirror device chip. A window is mounted above the micromirror device area and to the upper surface of the micromirror device chip by a bead. By forming the window of borosilicate glass and the bead of solder glass, the micromirror device area is hermetically sealed. In this manner, corrosion and contamination of the micromirror device area is prevented.

Abstract translation: 微镜器件封装包括在微镜器件芯片的上表面上具有微镜器件区域的微镜器件芯片。 窗口通过一个珠子安装在微反射镜装置区域上方和微镜装置芯片的上表面上。 通过形成硼硅酸盐玻璃窗和焊料玻璃珠，微镜装置区域被气密密封。 以这种方式，防止微镜装置区域的腐蚀和污染。

公开(公告)号：US06455774B1

公开(公告)日：2002-09-24

申请号：US09457505

申请日：1999-12-08

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L2302

CPC classification number: H01L27/14618 ,  H01L23/10 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

Abstract: An image sensor package includes a molding having an interior locking feature and an exterior locking feature. The molding is a low cost molded part. The image sensor package further includes a window having an interior surface and an exterior surface. The exterior locking feature of the molding contacts a periphery of the exterior surface of the window and the interior locking feature of the molding contacts a periphery of the interior surface of the window. In this manner, the window is supported by the molding both top and bottom. Also, the distance which moisture must travel along the interface between the molding and window to reach the image sensor is maximized thus essentially eliminating moisture ingress into the image sensor package.

Abstract translation: 图像传感器封装包括具有内部锁定特征和外部锁定特征的模制件。 模制件是低成本的模制件。 图像传感器封装还包括具有内表面和外表面的窗口。 模制件的外部锁定特征与窗口的外表面的周边相接触，并且模制件的内部锁定特征与窗的内表面的周边接触。 以这种方式，窗口由顶部和底部的成型支撑。 此外，水分必须沿着模制件和窗户之间的界面行进以到达图像传感器的距离最大化，从而基本上消除湿气进入图像传感器封装中。

公开(公告)号：US06432737B1

公开(公告)日：2002-08-13

申请号：US09754239

申请日：2001-01-03

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L2100

CPC classification number: B81B7/0077 ,  B81C2203/0154 ,  H01L21/56 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a custom substrate having holes. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard flip chip techniques. The resulting array of pressure sensor sub-assemblies is then molded, so that a cavity is formed that is open at the bottom of each hole in the custom substrate. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of the hole in the substrate. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the hole. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Abstract translation: 多个压力传感器芯片附接到位于具有孔的定制基板上的压力传感器芯片附着位置的阵列。 然后使用标准的倒装芯片技术将压力传感器芯片电连接到压力传感器芯片附着位置。然后将所得的压力传感器子组件阵列模制成一个空腔，其在每个孔的底部开口 定制基板。 每个压力传感器模具的微机元件的外表面的一部分在基板的孔的底部露出。 在模制之后，微孔元件的暴露的外表面被施加在孔中的压力耦合凝胶覆盖。 然后使用熟知的锯切或激光技术或通过捕捉特殊形成的卡扣阵列来将所得的封装的压力传感器阵列进行旋转。

公开(公告)号：US06424315B1

公开(公告)日：2002-07-23

申请号：US09631449

申请日：2000-08-02

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: H01Q138

CPC classification number: H01Q1/2225 ,  G06K19/07327 ,  G06K19/07775 ,  G06K19/07779 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q9/27 ,  Y10T29/49016

Abstract: A miniature radio-frequency identification (RFID) transceiver and a method for making the same are provided. The RFID transceiver is small in size and physically rugged. The RFID transceiver includes an integrated circuit and a radio-frequency antenna that is fixed to the integrated circuit and electrically connected to the integrated circuit. The integrated circuit includes an RFID transceiver circuit. The antenna may be a single thin-film layer over the top surface of the integrated circuit or multiple layers that form a larger antenna in a compact, folded structure. Multiple antenna layers may also be used to form a three-dimensional structure for improved antenna operation or may be used to form separate, independent antennas.

Abstract translation: 提供了一种微型射频识别（RFID）收发器及其制造方法。 RFID收发器尺寸小，物理坚固。 RFID收发器包括集成电路和固定到集成电路并电连接到集成电路的射频天线。 集成电路包括RFID收发器电路。 该天线可以是在集成电路的顶表面上的单个薄膜层或者以紧凑折叠的结构形成较大天线的多个层。 也可以使用多个天线层来形成用于改进的天线操作的三维结构，或者可以用于形成独立的独立天线。