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    POLISHING PAD CONDITIONER
    51.
    发明申请
    POLISHING PAD CONDITIONER 有权
    抛光垫调节器

    公开(公告)号：US20100105302A1

    公开(公告)日：2010-04-29

    申请号：US12256845

    申请日：2008-10-23

    申请人： Hung Chih Chen ,  Sen-Hou Ko ,  Shou-Sung Chang

    发明人： Hung Chih Chen ,  Sen-Hou Ko ,  Shou-Sung Chang

    IPC分类号： B24D11/00

    CPC分类号： B24B53/017

    摘要： Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.

    摘要翻译： 本发明的实施例通常提供改进的调节模块和调节盘，用于在调节化学机械抛光（CMP）系统的抛光垫的过程中改善压力分布。 在一个实施例中，提供了包括多个小调节盘的调节模块。 在一个实施例中，提供了具有柔顺背衬构件的调节盘。 在一个实施例中，柔顺背衬构件包括切割成螺旋形状以提供符合性的半刚性背衬构件。 在另一个实施例中，顺从背衬构件包括流体加压的柔性膜。 本发明的每个实施例提供了在每个调节盘的表面上的改进的压力分布，导致增加的盘寿命以及增加的调节速率和均匀性。

    METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE
    52.
    发明申请
    METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE 审中-公开
    用于抛光衬底和/或衬底的方法和装置

    公开(公告)号：US20100105299A1

    公开(公告)日：2010-04-29

    申请号：US12258242

    申请日：2008-10-24

    申请人： Gary C. Ettinger ,  Paul D. Butterfield ,  Antoine P. Manens ,  Sen-Hou Ko

    发明人： Gary C. Ettinger ,  Paul D. Butterfield ,  Antoine P. Manens ,  Sen-Hou Ko

    IPC分类号： B24B21/00

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B49/16

    摘要： Apparatus and methods are provided to polish a substrate. In some aspects, the invention includes a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge. The polishing head includes a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch. Numerous other aspects are provided.

    摘要翻译： 提供设备和方法来抛光基底。 在一些方面，本发明包括一种抛光头，其适于将抛光带应用于衬底边缘中的衬底边缘和凹口中的至少一个。 抛光头包括连接到抛光头的抛光机，其中抛光机具有中空部分并且适于符合基板边缘和凹口中的至少一个的形状。 提供了许多其他方面。

    APPARATUS FOR CONDITIONING PROCESSING PADS
    54.
    发明申请
    APPARATUS FOR CONDITIONING PROCESSING PADS 有权
    调节加工垫的设备

    公开(公告)号：US20090036037A1

    公开(公告)日：2009-02-05

    申请号：US12248302

    申请日：2008-10-09

    申请人： Paul D. Butterfield ,  Sen-Hou Ko

    发明人： Paul D. Butterfield ,  Sen-Hou Ko

    IPC分类号： B24B1/00

    CPC分类号： B24B53/017 ,  B24B53/12

    摘要： Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.

    摘要翻译： 提供了一种用于调理处理垫的装置的实施例。 在一个实施例中，用于调理处理垫的装置包括具有选择性地保持在非平面取向的底表面和设置在构件的底表面上的研磨件的构件。 研磨剂配置用于调理加工垫。 构件和磨料具有产生非平面加工垫表面的轮廓。

    METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING
    58.
    发明申请
    METHODS AND APPARATUS FOR LOW COST AND HIGH PERFORMANCE POLISHING TAPE FOR SUBSTRATE BEVEL AND EDGE POLISHING IN SEMINCONDUCTOR MANUFACTURING 审中-公开
    低成本和高性能抛光胶带的方法和装置，用于在晶体管制造中进行基板水平和边缘抛光

    公开(公告)号：US20080293331A1

    公开(公告)日：2008-11-27

    申请号：US12124153

    申请日：2008-05-21

    申请人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

    发明人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

    IPC分类号： B24B9/06 ,  C08J5/14

    CPC分类号： B24B9/065 ,  B24B21/002

    摘要： Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating.

    摘要翻译： 提供的装置和方法涉及使用诸如抛光带的抛光装置来抛光衬底。 抛光装置可以形成为包括基底，粘附到基底的树脂层和由树脂层固定到基底的多个压花磨料颗粒和/或研磨珠。 多个研磨颗粒和/或珠可以在树脂层中压花。 多个研磨珠可以包括悬挂在粘合剂材料中的多个磨料颗粒。 多个研磨颗粒和/或珠粒和树脂层组合形成适于接触基底的抛光装置的研磨侧。 衬底的抛光优选包括在通过保持装置旋转衬底的同时抛光衬底的边缘，使得除了研磨带之外的其它装置在衬底旋转时不接触边缘。

    METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE
    59.
    发明申请
    METHODS AND APPARATUS FOR POLISHING AN EDGE OF A SUBSTRATE 审中-公开
    用于抛光衬底边缘的方法和装置

    公开(公告)号：US20070238393A1

    公开(公告)日：2007-10-11

    申请号：US11693695

    申请日：2007-03-29

    申请人： Ho Shin ,  Gary Ettinger ,  Donald Olgado ,  Erik Wasinger ,  Sen-Hou Ko ,  Charles Dodds ,  Yufei Chen ,  Wei-Yung Hsu

    发明人： Ho Shin ,  Gary Ettinger ,  Donald Olgado ,  Erik Wasinger ,  Sen-Hou Ko ,  Charles Dodds ,  Yufei Chen ,  Wei-Yung Hsu

    IPC分类号： B24B51/00 ,  B24B49/00 ,  B24B7/30

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/067 ,  B24B49/16 ,  B24B57/02

    摘要： Methods of and systems for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of one of energy and torque exerted in rotating the substrate against the polishing film. The invention may further include determining an amount of material removed from the edge of the substrate based on the detected energy or torque exerted in rotating the substrate against the polishing film; ascertaining a difference between the determined amount of material removed and a preset polish level; and determining an amount of energy or torque to be exerted in rotating the substrate adapted to attain the preset polish level based on the difference between the determined amount of material removed and the preset polish level. Numerous other aspects are provided.

    摘要翻译： 提供了抛光衬底边缘的方法和系统。 本发明包括将衬底旋转抵靠抛光膜，以便从衬底的边缘去除材料; 并且检测在将衬底旋转抛光膜时施加的能量和扭矩中的一个的量。 本发明还可以包括基于在将衬底旋转抛光膜时所检测到的能量或扭矩确定从衬底边缘去除的材料量; 确定确定的去除材料量与预设抛光水平之间的差异; 以及基于所确定的所移除的材料量与所述预设的抛光水平之间的差来确定在旋转所述基板时施加的能量或扭矩的量，所述能量或扭矩适于实现预设的抛光水平。 提供了许多其他方面。