公开(公告)号：US08133763B2

公开(公告)日：2012-03-13

申请号：US12549613

申请日：2009-08-28

申请人： Sreenivasan K. Koduri

发明人： Sreenivasan K. Koduri

IPC分类号： H01L21/00

CPC分类号： H01L23/49582 ,  H01L21/4842 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45147

摘要： A method for fabricating a leadframe for a QFN/SON semiconductor device by selecting (301) a strip of a first metal as the leadframe core, then plating (302) a layer of a second metal over both surfaces of the strip, then cutting (304) a pattern from the pre-plated strip and further removing (304) portions of the second metal layer over a surface to expose the underlying core first metal. The exposed core first metal oxidized (305) before using (306) the leadframe for assembling the semiconductor device. The steps of cutting and removing are performed programmable machining techniques such as computer numerical controlled tools (CNC), electrical discharge machining (EDM), laser cutting, and water jet cutting.

摘要翻译： 一种用于制造QFN / SON半导体器件的引线框架的方法，该方法是通过选择（301）第一金属的带作为引线框架芯，然后在所述带的两个表面上镀覆（302）一层第二金属，然后切割 304）来自预镀带的图案并且进一步在表面上去除（304）第二金属层的部分以暴露下面的第一金属。 在使用（306）用于组装半导体器件的引线框架之前，暴露的芯第一金属被氧化（305）。 进行切割和拆卸的步骤执行可编程加工技术，例如计算机数控工具（CNC），放电加工（EDM），激光切割和水射流切割。

公开(公告)号：US08129228B2

公开(公告)日：2012-03-06

申请号：US12910933

申请日：2010-10-25

申请人： Ubol Udompanyavit ,  Sreenivasan K Koduri ,  Gerald W Steele ,  Jason M Cole ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Sreenivasan K Koduri ,  Gerald W Steele ,  Jason M Cole ,  Steven Kummerl

IPC分类号： H01L21/00

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架，位于引线框架上的集成电路和耦合到引线框架和集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US08017410B2

公开(公告)日：2011-09-13

申请号：US12759476

申请日：2010-04-13

申请人： Sreenivasan K Koduri

发明人： Sreenivasan K Koduri

IPC分类号： H01L21/00

CPC分类号： H01L23/495 ,  H01F17/045 ,  H01F27/027 ,  H01F27/40 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/16 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device (100) with one or more semiconductor chips (102) has an inductor (101) assembled on or under the chips. The inductor includes a ferromagnetic body (111) and a wire (104) wrapped around the body to form at least a portion of a loop; the wire ends (104a) are connected to the chips. The assembly is attached to a substrate (103), which may be a leadframe. The device may be encapsulated in molding compound (140) so that the inductor can double as a heat spreader (111c), enhancing the thermal device characteristics.

摘要翻译： 具有一个或多个半导体芯片（102）的电子设备（100）具有组装在芯片上或芯片下方的电感器（101）。 所述电感器包括铁磁体（111）和围绕所述主体缠绕以形成环的至少一部分的线（104）; 电线端部（104a）连接到芯片。 组件附接到可以是引线框架的基板（103）。 该装置可以封装在模制化合物（140）中，使得电感器可以作为散热器（111c）加倍，从而增强热装置特性。

公开(公告)号：US20110033985A1

公开(公告)日：2011-02-10

申请号：US12910933

申请日：2010-10-25

申请人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald W. Steele ,  Jason Marc Cole ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald W. Steele ,  Jason Marc Cole ,  Steven Kummerl

IPC分类号： H01L21/60

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架，位于引线框架上的集成电路和耦合到引线框架和集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，并且引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US07723129B2

公开(公告)日：2010-05-25

申请号：US12418117

申请日：2009-04-03

申请人： Sreenivasan K Koduri

发明人： Sreenivasan K Koduri

IPC分类号： H01L21/00

CPC分类号： H01L23/495 ,  H01F17/045 ,  H01F27/027 ,  H01F27/40 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/16 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device (100) with one or more semiconductor chips (102) has an inductor (101) assembled on or under the chips. The inductor includes a ferromagnetic body (111) and a wire (104) wrapped around the body to form at least a portion of a loop; the wire ends (104a) are connected to the chips. The assembly is attached to a substrate (103), which may be a leadframe. The device may be encapsulated in molding compound (140) so that the inductor can double as a heat spreader (111c), enhancing the thermal device characteristics.

摘要翻译： 具有一个或多个半导体芯片（102）的电子设备（100）具有组装在芯片上或芯片下方的电感器（101）。 所述电感器包括铁磁体（111）和围绕所述主体缠绕以形成环的至少一部分的线（104）; 电线端部（104a）连接到芯片。 组件附接到可以是引线框架的基板（103）。 该装置可以封装在模制化合物（140）中，使得电感器可以作为散热器（111c）加倍，从而增强热装置特性。

公开(公告)号：US20090186453A1

公开(公告)日：2009-07-23

申请号：US12418117

申请日：2009-04-03

申请人： Sreenivasan K. KODURI

发明人： Sreenivasan K. KODURI

IPC分类号： H01L21/50

CPC分类号： H01L23/495 ,  H01F17/045 ,  H01F27/027 ,  H01F27/40 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/16 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device (100) with one or more semiconductor chips (102) has an inductor (101) assembled on or under the chips. The inductor includes a ferromagnetic body (111) and a wire (104) wrapped around the body to form at least a portion of a loop; the wire ends (104a) are connected to the chips. The assembly is attached to a substrate (103), which may be a leadframe. The device may be encapsulated in molding compound (140) so that the inductor can double as a heat spreader (111c), enhancing the thermal device characteristics.

摘要翻译： 具有一个或多个半导体芯片（102）的电子设备（100）具有组装在芯片上或芯片下方的电感器（101）。 所述电感器包括铁磁体（111）和围绕所述主体缠绕以形成环的至少一部分的线（104）; 电线端部（104a）连接到芯片。 组件附接到可以是引线框架的基板（103）。 该装置可以封装在模制化合物（140）中，使得电感器可以作为散热器（111c）加倍，从而增强热装置特性。

公开(公告)号：US20080029907A1

公开(公告)日：2008-02-07

申请号：US11458417

申请日：2006-07-19

申请人： Sreenivasan K. Koduri

发明人： Sreenivasan K. Koduri

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/495 ,  H01F17/045 ,  H01F27/027 ,  H01F27/40 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/16 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device (100) with one or more semiconductor chips (102) has an inductor (101) assembled on or under the chips. The inductor includes a ferromagnetic body (111) and a wire (104) wrapped around the body to form at least a portion of a loop; the wire ends (104a) are connected to the chips. The assembly is attached to a substrate (103), which may be a leadframe. The device may be encapsulated in molding compound (140) so that the inductor can double as a heat spreader (111c), enhancing the thermal device characteristics.

摘要翻译： 具有一个或多个半导体芯片（102）的电子设备（100）具有组装在芯片上或芯片下方的电感器（101）。 所述电感器包括铁磁体（111）和围绕所述主体缠绕以形成环的至少一部分的线（104）; 电线端部（104a）连接到芯片。 组件附接到可以是引线框架的基板（103）。 该装置可以封装在模制化合物（140）中，使得电感器可以作为散热器（111c）加倍，从而增强热装置特性。

公开(公告)号：US06292580B1

公开(公告)日：2001-09-18

申请号：US09111977

申请日：1998-07-08

申请人： Sreenivasan K. Koduri ,  Joe D. Woodall ,  Lance C. Wright ,  Charles K. Harris

发明人： Sreenivasan K. Koduri ,  Joe D. Woodall ,  Lance C. Wright ,  Charles K. Harris

IPC分类号： G06K900

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/10 ,  B23K20/26 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： An illumination system for wire bonding at wire bonding locations which includes a first light source for directing light to the location to be illuminated along a predetermined axis, preferably normal to the wire bonding location, and a second light source having an aperture therethrough extending along the predetermined axis directing light in a pattern from around the aperture to the location to be illuminated. A portion of the light is reflectable back from the location to be illuminated through the aperture. The first light source directs light therefrom through the aperture. The light from the second light source for viewing of the lead frame comes from around the object and is diffused so that it scatters in all directions and at all angles. The amount of scattering depends upon the surface roughness at the edge of the light conductor from which the light exits the light conductor. A beam splitter is disposed between the first light source and the aperture, the light from the first light source passing through the beam splitter. The system also receives and stores a digital representation of the reflected light which is reflected from the beam splitter. The system optionally includes a third light source for directing light to the location to be illuminated. The light sources are individually controllable.

摘要翻译： 一种用于在引线接合位置引线接合的照明系统，其包括用于将光引导到沿着预定轴线（优选地垂直于引线接合位置）被照明的位置的第一光源，以及具有沿着 预定轴将光从光圈周围引向图案到要照明的位置。 光的一部分可从通过光圈照射的位置反射回来。 第一光源通过孔引导其光。 来自用于观察引线框架的第二光源的光来自物体周围，并且扩散，使得其在所有方向和各个角度散射。 散射量取决于光导体从光导体出射的边缘处的表面粗糙度。 分束器设置在第一光源和孔之间，来自第一光源的光通过分束器。 该系统还接收并存储从分束器反射的反射光的数字表示。 该系统可选地包括用于将光引导到要照明的位置的第三光源。 光源可以单独控制。

公开(公告)号：US5971248A

公开(公告)日：1999-10-26

申请号：US993659

申请日：1997-12-18

申请人： Sreenivasan K. Koduri

发明人： Sreenivasan K. Koduri

IPC分类号： H01L21/60 ,  B23K20/00 ,  H01L21/00 ,  H01L21/603

CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/78302 ,  H01L2224/78822 ,  H01L2224/78901 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： A rotation device (100) provides steady, non-stepwise rotation of a wire bonding capillary (10) about the longitudinal axis of the capillary (10). This enables the capillary (10) to be rotated to different angular alignments to perform wire bonding in different directions. The rotation device can include gears (111, 122) or friction pads (211, 222). At least a part (110) of the rotation device (120) is coupled to the capillary (10). Another part (120) of the rotation device (100) is separate from the capillary (10) but is engageable with the first part to provide rotation. Sensing devices (610, 620) may be used to provide precise initial alignment of the capillary (10) and to assist in providing and confirming precise alignment and realignment of the capillary to various bonding directions during wire bonding. A computer may be used to provide automated control and rotation of the sensing devices and the rotation device.

摘要翻译： 旋转装置（100）提供引线接合毛细管（10）围绕毛细管（10）的纵向轴线的稳定的非逐步旋转。 这使得毛细管（10）能够旋转到不同的角度对准以在不同的方向上进行引线接合。 旋转装置可以包括齿轮（111,122）或摩擦垫（211,222）。 旋转装置（120）的至少一部分（110）联接到毛细管（10）。 旋转装置（100）的另一部分（120）与毛细管（10）分离，但是可与第一部分接合以提供旋转。 感测装置（610,620）可以用于提供毛细管（10）的精确的初始对准，并且有助于在引线接合期间提供并确认毛细管对各种粘合方向的精确对准和重新对准。 可以使用计算机来提供感测装置和旋转装置的自动控制和旋转。