Abstract:
Methods for thermal management of an integrated circuit are disclosed. In particular, a dual control loop, having a first control loop and a second control loop, is used to maintain the temperature of an integrated circuit at a first temperature and a second temperature, respectively. In order to prevent the integrated circuit from overheating during periods of rapid temperature increase, the second control loop may be configured to control temperature at the second temperature below the specification limit of the integrated circuit by reducing power to the integrated circuit. The second control loop samples and maintains temperature of the integrated circuit at time intervals relatively faster than that of the first control loop. However, the second control loop is configured to release control to the first control loop when the temperature of the integrated circuit is reduced. The first control loop may then control power to the integrated circuit.
Abstract:
In one embodiment, a system includes power management control that controls a duty cycle of a processor to manage power. The duty cycle may be the amount of time that the processor is powered on as a percentage of the total time. By frequently powering up and powering down the processor during a period of time, the power consumption of the processor may be controlled while providing the perception that the processor is continuously available. For example, the processor may be a graphics processing unit (GPU), and the period of time over which the duty cycle is managed may be a frame to be displayed on the display screen viewed by a user of the system.
Abstract:
A method and apparatus for providing telemetry for use in power control functions is disclosed. A system includes an integrated circuit (IC) having a first power management circuit. The IC also includes a number of functional circuit blocks within a number of different power domains. A second power management circuit is implemented external to the IC and includes a number of voltage regulators. Each of the power domains is coupled to receive power from one voltage regulators. During operation, the first power management circuit may send commands requesting the change of one or more voltages provided to the IC. The second power management circuit may respond by performing the requested voltage change(s), and may also provide telemetry data to the first power management circuit. The second power management circuit may also provide telemetry data responsive to receiving a no operation command from the first power management circuit.
Abstract:
An electronic device may include a display and display control circuitry. The display may be calibrated to compensate for changes in display temperature. Display calibration information may be obtained during manufacturing and may be stored in the electronic device. The display calibration information may include adjustment factors configured to adjust incoming pixel values to reduce temperature-related color shifts. During operation of the electronic device, display control circuitry may determine the temperature at different locations on the display. The display control circuitry may determine the temperature at a given display pixel using the temperatures at the different locations on the display. The display control circuitry may determine adjustment values based on the temperature at the display pixel. The display control circuitry may apply the adjustment values to incoming pixel values to obtain adapted pixel values, which may in turn be provided to the display pixel.
Abstract:
The disclosed embodiments provide an apparatus that controls a cooling system for a computer system. During operation, the apparatus monitors a temperature signal from the computer system to determine a trend for the temperature signal. Then, a filter parameter for a trend-based filter is selected based on the trend. Next, the temperature signal is filtered using the trend-based filter to generate a filtered temperature signal which is then passed through a controller to generate a control signal for the cooling system.
Abstract:
Methods and apparatuses to automatically adjust a thermal requirement of a data processing system are described. One or more conditions associated with a data processing system are detected. A temperature requirement for the data processing system is determined based on the one or more conditions. The performance of the data processing system may be throttled to maintain a temperature of the data processing system below the temperature requirement. Detecting the one or more conditions associated with the data processing system may include determining a location of the data processing system based on a measured motion, a state of a peripheral device, a position of one portion of the data processing system (e.g., a lid) relative another portion of the data processing system (e.g., a bottom portion), a type of application operating on the data processing system, or any combination thereof.
Abstract:
Methods and apparatuses are disclosed to estimate temperature at one or more critical points in a data processing system comprising modeling a steady state temperature portion of a thermal model at the one or more critical points using regression analysis; modeling the transient temperature portion of the thermal model at the one or more critical points using a filtering algorithm; and generating a thermal model at the one or more critical points by combining the steady state temperature portion of the thermal model with the transient temperature portion of the thermal model. The thermal model may then be used to estimate an instantaneous temperature at the one or more critical points or to predict a future temperature at the one or more critical points.
Abstract:
Techniques are disclosed relating to electromigration control implemented by a power management unit. In some embodiments, the power management unit itself is configured to monitor operating conditions, implement control for one or more electromigration loops, and send reduction alerts, via an inter-chip interconnect, to the processor circuitry it powers. In some embodiments, the power management unit implements both thermal and electromigration control loops. Disclosed techniques may advantageously reduce or avoid electromigration issues, potentially with reduced impact on processor performance relative to traditional techniques.
Abstract:
In an embodiment, a system may include a plurality of component circuits. The plurality of component circuits may include rate control circuits the control power consumption in the component circuits based on indications of power allocated to the component circuits. In an embodiment, the rate control circuits may transmit power requests for the component circuits and a floor request representing a minimum amount of power that may ensure reliable operation.
Abstract:
A hierarchical, scalable power delivery system is disclosed. The power delivery system includes a first level of power converter circuitry configured to generate one or more first level regulated supply voltages, and a second level of power converter circuitry configured to generate one or more second level regulated supply voltages. The first level of power converter circuitry receives an input supply voltage, while the second level power converter circuitry receives the one or more first level supp1 voltages. The second level power converter circuitry is configured to provide the second level regulated supply voltages to a computing element configured to operate as a single, logical computer system, the computing element being configured to operate in a number of power configurations having differing numbers of load circuits. Different portions of the hierarchical power delivery system may be selectively enabled for corresponding ones of the power configurations of the computing element.